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    Ceramic optical sub-assembly for optoelectronic modules
    1.
    发明申请
    Ceramic optical sub-assembly for optoelectronic modules 有权

    公开(公告)号：US20060140534A1

    公开(公告)日：2006-06-29

    申请号：US11344721

    申请日：2006-01-31

    申请人： Jia Liu ,  Luu Nguyen ,  Ken Pham ,  William Mazotti ,  Bruce Roberts ,  Stephen Gee ,  John Briant

    发明人： Jia Liu ,  Luu Nguyen ,  Ken Pham ,  William Mazotti ,  Bruce Roberts ,  Stephen Gee ,  John Briant

    IPC分类号： G02F1/295

    CPC分类号： H01S5/02284 ,  H01S5/4025

    摘要： Optoelectronic components, specifically, ceramic optical sub-assemblies are described. In one aspect, the optoelectronic component includes a ceramic base substrate having a pair of angled (or substantially perpendicular) faces. The electrical traces are formed directly on the ceramic surfaces and extend between the pair of faces. A semiconductor chip assembly is mounted on the first face of the ceramic base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the ceramic base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. It is particularly well adapted for use with vertical cavity surface emitting lasers (or laser arrays) and detectors (or detector arrays). In some embodiments, at least the cathode of the photonic device is soldered directly to a cathode pad on the base substrate. Similarly, in some embodiments, the semiconductor chip assembly is electrically connected to the base substrate by direct soldering. Specific base substrate structures are disclosed as well.

    Optical sub-assembly for opto-electronic modules
    2.
    发明申请
    Optical sub-assembly for opto-electronic modules 有权
    光电子模块的光学子组件

    公开(公告)号：US20050175297A1

    公开(公告)日：2005-08-11

    申请号：US11095637

    申请日：2005-03-30

    申请人： William Mazotti ,  Peter Deane ,  Luu Nguyen ,  Ken Pham ,  Bruce Roberts ,  Jia Liu ,  Yongseon Koh ,  John Briant ,  Roger Clarke ,  Michael Nelson ,  Christopher Smith ,  Janet Townsend

    发明人： William Mazotti ,  Peter Deane ,  Luu Nguyen ,  Ken Pham ,  Bruce Roberts ,  Jia Liu ,  Yongseon Koh ,  John Briant ,  Roger Clarke ,  Michael Nelson ,  Christopher Smith ,  Janet Townsend

    IPC分类号： G02B6/42 ,  H05K1/02 ,  H05K1/18 ,  H05K3/40 ,  G02B6/36

    CPC分类号： G02B6/4201 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H05K1/0219 ,  H05K1/189 ,  H05K3/403 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/10121 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Concepts for conveniently arranging devices for the transduction of signals to and from voltage and current domains to infrared radiation domains is described. Specifically, optoelectronic components and methods of making the same are described. In one aspect, the optoelectronic component includes a base substrate having a pair of angled (or substantially perpendicular) faces with electrical traces extending therebetween. A semiconductor chip assembly is mounted on the first face of the base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. In some embodiments the base substrate is formed from a ceramic material having the electrical traces formed thereon. In other implementations the substrate includes a backing block having a flexible printed circuit substrate adhered thereto.

    摘要翻译： 描述了用于方便地布置用于将电压和电流域的信号传导到红外辐射域的装置的概念。 具体地说，描述了光电子元件及其制造方法。 在一个方面，光电子部件包括具有一对成角度（或基本上垂直）的表面的基底基板，其间延伸有电迹线。 半导体芯片组件安装在基底基板的第一面上，并且光子器件安装在第二面上。 半导体芯片组件和光子器件都与基底衬底上的迹线电连接。 半导体芯片组件通常被布置成电连接到外部装置。 光子器件通常布置成与一根或多根光纤光学通信。 所描述的结构可以与各种各样的光子器件一起使用。 在一些实施例中，基底由具有形成在其上的电迹线的陶瓷材料形成。 在其它实施方式中，基板包括具有粘附到其上的柔性印刷电路基板的背衬块。

    Multi-purpose optical light pipe
    8.
    发明申请
    Multi-purpose optical light pipe 有权
    多功能光导管

    公开(公告)号：US20050013581A1

    公开(公告)日：2005-01-20

    申请号：US10621033

    申请日：2003-07-15

    申请人： William Mazotti ,  Brian Huss

    发明人： William Mazotti ,  Brian Huss

    IPC分类号： G02B6/42 ,  G02B6/10

    CPC分类号： G02B6/4246

    摘要： A plug device for use during manufacturing and/or testing processes for optoelectronic (OE) devices is described. The plug device has a handle and structures that extend off of the handle to cover “barrels” of an OE device. The plug device prevents contaminating particulates from reacting the lenses and/or the photonic devices within the OE device. The plug device can also be made of a material that transmits light signals so that testing of the OE devices can be easily performed. The plug device can also have a surface to which a pick and place machine can attach itself so that the plug device and a respective optoelectronic device can be easily transported. Overall, the plug device can simplify both the manufacturing and testing processes for OE devices.

    摘要翻译： 描述了用于光电（OE）设备的制造和/或测试过程中使用的插头设备。 插头装置具有从手柄延伸的手柄和结构以覆盖OE装置的“桶”。 插塞装置防止污染微粒使OE器件内的透镜和/或光子器件发生反应。 插头装置也可以由透射光信号的材料制成，从而可以容易地进行OE装置的测试。 插头装置还可以具有拾取和放置机器可以自身附接的表面，使得插头装置和相应的光电装置可以容易地输送。 总的来说，插头设备可以简化OE设备的制造和测试过程。

    Opto-electronic module form factor having adjustable optical plane height
    9.
    发明申请
    Opto-electronic module form factor having adjustable optical plane height 有权
    具有可调光学平面高度的光电模块形状

    公开(公告)号：US20050013560A1

    公开(公告)日：2005-01-20

    申请号：US10621035

    申请日：2003-07-15

    申请人： William Mazotti ,  Brian Huss

    发明人： William Mazotti ,  Brian Huss

    IPC分类号： G02B6/42 ,  H05K1/14 ,  G02B6/36

    CPC分类号： G02B6/4246 ,  G02B6/4245 ,  G02B6/4255 ,  G02B6/4257 ,  G02B6/4274 ,  G02B6/4278 ,  G02B6/4281 ,  G02B6/4283 ,  H05K1/148

    摘要： An apparatus opto-electronic module that is flexible in design such that components of different types and dimensions can be incorporated into the module without straying from certain mechanical standards requirements is described. Generally, an opto-electronic module of the present invention includes a first substrate that supports an opto-electronic device and thereby the optical port, a second substrate that includes the electrical port, and a flexible connector that electrically connects the first and second substrates. The flexible connector allows for the first substrate and the second substrate to be positioned in various orientations with respect to each other so that optical and electrical components of various sizes can be utilized and still remain in compliance with a set of mechanical standards.

    摘要翻译： 描述了设计灵活的装置光电模块，使得不同类型和尺寸的部件可以并入模块中而不偏离某些机械标准要求。 通常，本发明的光电子模块包括：第一基板，其支撑光电器件，从而支撑光学端口;第二基板，其包括电气端口;以及柔性连接器，其电连接第一和第二基板。 柔性连接器允许第一基板和第二基板相对于彼此以各种取向定位，使得可以利用各种尺寸的光学和电气部件，并且仍然保持符合一组机械标准。