公开(公告)号：US20060055080A1

公开(公告)日：2006-03-16

申请号：US11267719

申请日：2005-11-03

申请人： Ken Pham ,  Luu Nguyen ,  William Mazotti

发明人： Ken Pham ,  Luu Nguyen ,  William Mazotti

IPC分类号： B29C45/02 ,  B29C45/14 ,  B29C45/37 ,  B29C70/72 ,  B29C70/88 ,  H01L21/56

CPC分类号： B29C45/37 ,  B29C45/14639 ,  B29C2045/14934 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/0401

摘要： Techniques for forming packaged semiconductor devices having top surfaces with flash-free electrical contact surfaces are described. According to one aspect, a molding cavity is provided which has a molding surface that is sufficiently smooth such that when placed in contact with an electrically conductive contact, gaps between the conductive contact and the mold cavity surface do not form.

摘要翻译： 描述了用于形成具有无闪光电接触表面的顶表面的封装半导体器件的技术。 根据一个方面，提供了一种模制腔，其具有足够光滑的模制表面，使得当与导电触点接触时，不形成导电触头和模腔表面之间的间隙。

公开(公告)号：US20060001183A1

公开(公告)日：2006-01-05

申请号：US11217518

申请日：2005-08-31

申请人： Luu Nguyen ,  Ken Pham ,  Peter Deane ,  William Mazotti ,  Bruce Roberts

发明人： Luu Nguyen ,  Ken Pham ,  Peter Deane ,  William Mazotti ,  Bruce Roberts

IPC分类号： B29D11/00

CPC分类号： B29C70/72 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/4809 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/4554

摘要： This disclosure describes a clear overmolding cap for protecting the photonic devices in optoelectronic packages from damage due to handling, module assembly, board assembly, and environmental exposure in field applications. The overmolding of the devices with a clear mold cap or similar material also provides a standoff for optical fibers positioned next to the active facets. The photonic devices are attached to a substrate, which may be flexible that has electronic traces that allow the photonic devices to be connected to an external device such as a semiconductor device. A technique for manufacturing the overmolding cap using a mold die system in combination with a rigid carrier is also disclosed. The rigid carrier is used to maintain the shape of the substrate during the molding process. The proposed method applies to photonic devices used in optoelectronic packages that can serve as transceivers, transmitters, or receivers.

公开(公告)号：US20050100294A1

公开(公告)日：2005-05-12

申请号：US11015247

申请日：2004-12-15

申请人： Luu Nguyen ,  Ken Pham ,  Peter Deane ,  William Mazotti ,  Bruce Roberts ,  Jia Liu

发明人： Luu Nguyen ,  Ken Pham ,  Peter Deane ,  William Mazotti ,  Bruce Roberts ,  Jia Liu

IPC分类号： G02B6/38 ,  G02B6/42 ,  H01L23/02 ,  H01L23/498 ,  H01L25/10 ,  H05K1/02 ,  H05K1/18 ,  H05K3/40 ,  G02B6/36

CPC分类号： G02B6/4292 ,  G02B6/3825 ,  G02B6/3874 ,  G02B6/3897 ,  G02B6/4201 ,  G02B6/4239 ,  G02B2006/4297 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16145 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K1/0219 ,  H05K1/189 ,  H05K3/403 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/10121 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/45147 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753

摘要： The present invention provides a low cost device that has a true die to external fiber optic connection. Specifically, the present invention relates to an optical device package joined to a semiconductor device package. In some cases, the combination is joined using wirebond studs and an adhesive material. In other cases, the combination is joined using an anisotropic conductive film. Yet, in other cases, the combination is joined using solder material. Each of these joining mechanisms provides high levels of thermal, electrical and optical performance. The joining mechanisms can apply to optical sub-assembly and chip sub-assembly interfaces in transceivers, transmitters, as well as receivers for opto-electronic packages.

公开(公告)号：US20050175297A1

公开(公告)日：2005-08-11

申请号：US11095637

申请日：2005-03-30

申请人： William Mazotti ,  Peter Deane ,  Luu Nguyen ,  Ken Pham ,  Bruce Roberts ,  Jia Liu ,  Yongseon Koh ,  John Briant ,  Roger Clarke ,  Michael Nelson ,  Christopher Smith ,  Janet Townsend

发明人： William Mazotti ,  Peter Deane ,  Luu Nguyen ,  Ken Pham ,  Bruce Roberts ,  Jia Liu ,  Yongseon Koh ,  John Briant ,  Roger Clarke ,  Michael Nelson ,  Christopher Smith ,  Janet Townsend

IPC分类号： G02B6/42 ,  H05K1/02 ,  H05K1/18 ,  H05K3/40 ,  G02B6/36

CPC分类号： G02B6/4201 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H05K1/0219 ,  H05K1/189 ,  H05K3/403 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/10121 ,  H01L2924/00014 ,  H01L2924/00

摘要： Concepts for conveniently arranging devices for the transduction of signals to and from voltage and current domains to infrared radiation domains is described. Specifically, optoelectronic components and methods of making the same are described. In one aspect, the optoelectronic component includes a base substrate having a pair of angled (or substantially perpendicular) faces with electrical traces extending therebetween. A semiconductor chip assembly is mounted on the first face of the base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. In some embodiments the base substrate is formed from a ceramic material having the electrical traces formed thereon. In other implementations the substrate includes a backing block having a flexible printed circuit substrate adhered thereto.

摘要翻译： 描述了用于方便地布置用于将电压和电流域的信号传导到红外辐射域的装置的概念。 具体地说，描述了光电子元件及其制造方法。 在一个方面，光电子部件包括具有一对成角度（或基本上垂直）的表面的基底基板，其间延伸有电迹线。 半导体芯片组件安装在基底基板的第一面上，并且光子器件安装在第二面上。 半导体芯片组件和光子器件都与基底衬底上的迹线电连接。 半导体芯片组件通常被布置成电连接到外部装置。 光子器件通常布置成与一根或多根光纤光学通信。 所描述的结构可以与各种各样的光子器件一起使用。 在一些实施例中，基底由具有形成在其上的电迹线的陶瓷材料形成。 在其它实施方式中，基板包括具有粘附到其上的柔性印刷电路基板的背衬块。

公开(公告)号：US20060140534A1

公开(公告)日：2006-06-29

申请号：US11344721

申请日：2006-01-31

申请人： Jia Liu ,  Luu Nguyen ,  Ken Pham ,  William Mazotti ,  Bruce Roberts ,  Stephen Gee ,  John Briant

发明人： Jia Liu ,  Luu Nguyen ,  Ken Pham ,  William Mazotti ,  Bruce Roberts ,  Stephen Gee ,  John Briant

IPC分类号： G02F1/295

CPC分类号： H01S5/02284 ,  H01S5/4025

摘要： Optoelectronic components, specifically, ceramic optical sub-assemblies are described. In one aspect, the optoelectronic component includes a ceramic base substrate having a pair of angled (or substantially perpendicular) faces. The electrical traces are formed directly on the ceramic surfaces and extend between the pair of faces. A semiconductor chip assembly is mounted on the first face of the ceramic base substrate and a photonic device is mounted on the second face. Both the semiconductor chip assembly and the photonic device are electrically connected to traces on the ceramic base substrate. The semiconductor chip assembly is generally arranged to be electrically connected to external devices. The photonic devices are generally arranged to optically communicate with one or more optical fibers. The described structure may be used with a wide variety of photonic devices. It is particularly well adapted for use with vertical cavity surface emitting lasers (or laser arrays) and detectors (or detector arrays). In some embodiments, at least the cathode of the photonic device is soldered directly to a cathode pad on the base substrate. Similarly, in some embodiments, the semiconductor chip assembly is electrically connected to the base substrate by direct soldering. Specific base substrate structures are disclosed as well.

公开(公告)号：US20050157990A1

公开(公告)日：2005-07-21

申请号：US11050073

申请日：2005-02-01

申请人： William Mazotti ,  Jia Liu ,  Luu Nguyen ,  Haryanto Chandra ,  Peter Deane ,  Todd Thyes ,  Brian Huss ,  John Rukavina ,  Glenn Woodhouse

发明人： William Mazotti ,  Jia Liu ,  Luu Nguyen ,  Haryanto Chandra ,  Peter Deane ,  Todd Thyes ,  Brian Huss ,  John Rukavina ,  Glenn Woodhouse

IPC分类号： G02B6/42

CPC分类号： G02B6/4292 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4231 ,  G02B6/4239 ,  G02B6/4249 ,  G02B6/4251

摘要： Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the environment and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or without the use of a receptacle device, such that the photonic device is contained within a sealed cavity. The invention has three main embodiments in which the photonic device can be hermetically sealed, quasi-hermetically sealed, or non-hermetically sealed. The optical transmission device can be configured to serve as an optical receiver, detector, or a transceiver device.

摘要翻译： 描述了以使得光子器件免受可能由于暴露于环境和物理处理引起的损害的方式制造光传输装置的技术。 本发明涉及将透镜或透镜阵列放置在光子器件上，无论是否使用插座器件，使得光子器件被包含在密封腔内。 本发明具有三个主要实施例，其中光子器件可被气密密封，准气密密封或非气密密封。 光传输设备可以被配置为用作光接收器，检测器或收发器设备。

公开(公告)号：US20070071391A1

公开(公告)日：2007-03-29

申请号：US11473820

申请日：2006-06-23

申请人： William Mazotti ,  Jia Liu ,  Luu Nguyen ,  Haryanto Chandra ,  Peter Deane ,  Todd Thyes ,  Brian Huss ,  John Rukavina ,  Glenn Woodhouse

发明人： William Mazotti ,  Jia Liu ,  Luu Nguyen ,  Haryanto Chandra ,  Peter Deane ,  Todd Thyes ,  Brian Huss ,  John Rukavina ,  Glenn Woodhouse

IPC分类号： G02B6/36

CPC分类号： G02B6/4292 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4231 ,  G02B6/4239 ,  G02B6/4249 ,  G02B6/4251

摘要： Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the envirorunent and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or without the use of a receptacle device, such that the photonic device is contained within a sealed cavity. The invention has three main embodiments in which the photonic device can be hermetically sealed, quasi-hermetically sealed, or non-hermetically sealed. The optical transmission device can be configured to serve as an optical receiver, detector, or a transceiver device.

摘要翻译： 描述了以光子器件被保护免受暴露于环境和物理处理可能引起的损害的方式制造光传输装置的技术。 本发明涉及将透镜或透镜阵列放置在光子器件上，无论是否使用插座器件，使得光子器件被包含在密封腔内。 本发明具有三个主要实施例，其中光子器件可被气密密封，准气密密封或非气密密封。 光传输设备可以被配置为用作光接收器，检测器或收发器设备。

公开(公告)号：US20060253609A1

公开(公告)日：2006-11-09

申请号：US11120344

申请日：2005-05-03

申请人： Dmitry Andreev ,  Galina Grunin ,  Luu Nguyen ,  Gregory Vilshansky

发明人： Dmitry Andreev ,  Galina Grunin ,  Luu Nguyen ,  Gregory Vilshansky

IPC分类号： G06F15/16

CPC分类号： H04L29/12132 ,  H04L29/12066 ,  H04L61/1511 ,  H04L61/1552 ,  H04L67/28 ,  H04L67/2842

摘要： A method and system is presented for bypassing a local Domain Name Server (DNS) when using edge caching servers. Domain names of frequently used business applications that are known to rely upon edge servers, together with the corresponding authoritative DNSs, are listed in both local hosts file and user defined FSFD local configuration file fsfd.conf. When the client computer's browser attempts to resolve a domain name, a File System Filtering Driver (FSFD) in the client computer intercepts the browser's request. If the domain name which is being resolved is found in a local FSFD configuration file fsfd.conf, then the FSFD initiates a DNS request directly to the appropriate authoritative DNS whose IP address gets extracted from the fsfd.conf record, thus bypassing the local DNS. The authoritative DNS returns the IP address for an edge caching server that is topographically proximate to the client computer's browser.

摘要翻译： 提出了一种方法和系统，用于在使用边缘缓存服务器时绕过本地域名服务器（DNS）。 在本地主机文件和用户定义的FSFD本地配置文件fsfd.conf中列出了已知依赖于边缘服务器的经常使用的业务应用程序的域名以及相应的权威DNS。 当客户端计算机的浏览器尝试解析域名时，客户端计算机中的文件系统过滤驱动程序（FSFD）会拦截浏览器的请求。 如果正在解析的域名在本地FSFD配置文件fsfd.conf中找到，则FSFD将直接向适当的授权DNS发起DNS请求，该域名的IP地址从fsfd.conf记录中提取出来，从而绕过本地DNS 。 权威性DNS返回位于邻近客户端计算机浏览器的边缘缓存服务器的IP地址。

公开(公告)号：US06245595B1

公开(公告)日：2001-06-12

申请号：US09359074

申请日：1999-07-22

申请人： Luu Nguyen ,  Hem P. Takiar ,  Ethan Warner ,  Shahram Mostafazadeh ,  Joseph O. Smith

发明人： Luu Nguyen ,  Hem P. Takiar ,  Ethan Warner ,  Shahram Mostafazadeh ,  Joseph O. Smith

IPC分类号： H01L2144

CPC分类号： H01L21/67126 ,  H01L21/563 ,  H01L24/11 ,  H01L24/29 ,  H01L24/94 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/01031 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method and apparatus for forming a layer of underfill encapsulant on an integrated circuit located on a wafer are described. As a flip chip, the integrated circuit has electrically conductive pads, most of which have a solder ball attached thereto. Most of the solder balls have been flattened in order to provide an enlarged solder wetting area. A layer of underfill encapsulant is injected onto the integrated circuit under pressure to form a layer of underfill encapsulant that is then pre-cured. The integrated circuit is mounted to a substrate and the substrate and the integrated circuit are electrically coupled by a solder reflow operation which also finally cures the underfill encapsulant.

摘要翻译： 描述了在位于晶片上的集成电路上形成底层密封剂层的方法和装置。 作为倒装芯片，集成电路具有导电焊盘，其中大部分具有附着于其上的焊球。 大多数焊球已经被平坦化，以便提供扩大的焊料润湿区域。 将一层底层填料密封剂在压力下注入到集成电路上，以形成一层底层填料密封剂，然后将其预固化。 集成电路安装到基板上，并且基板和集成电路通过回流焊接操作电耦合，焊接回流操作也最终固化底部填充密封剂。

公开(公告)号：US06238949B1

公开(公告)日：2001-05-29

申请号：US09336037

申请日：1999-06-18

申请人： Luu Nguyen ,  Ashok Prabhu ,  Nikhil Kelkar ,  Hem P. Takiar

发明人： Luu Nguyen ,  Ashok Prabhu ,  Nikhil Kelkar ,  Hem P. Takiar

IPC分类号： H01L2144

CPC分类号： H01L24/17 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49575 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92127 ,  H01L2224/92225 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method and an apparatus for forming a plastic chip on chip module is disclosed. The plastic chip on chip module is formed by placing a stacked chip set into a molding chamber suitably arranged to receive encapsulant. The stacked chip set includes a daughter chip that is electrically and mechanically coupled to a mother chip where the daughter chip is directly aligned to and separated from the mother chip by a standoff gap. Encapsulant is then passed into the molding chamber filling the standoff gap substantially simultaneously with surrounding the chip set to form the plastic chip on chip module.

摘要翻译： 公开了一种用于形成芯片上的塑料芯片模块的方法和装置。 通过将堆叠的芯片组放置在适当地布置成接收密封剂的模制室中来形成芯片上的塑料芯片模块。 堆叠的芯片组包括电子和机械耦合到母芯片的子芯片，其中子芯片通过间隙与母芯片直接对准并与母芯片分离。 然后将封装剂填充到填充间隙的模制室中，同时围绕芯片组以形成芯片上的塑料芯片模块。