摘要:
Methods, electroplating solution, and apparatuses for electroplating copper into a surface of a partially fabricated semiconductor substrate are provided. Electroplating solutions include copper ions, suppressor additives, chloride ions, and alternative halide ions, which include bromide ions and/or iodide ions. The concentration of the alternative halide ions in the solution may be between about 0.25 ppm and 20 ppm. Addition of the alternative halide ions at certain concentrations improves suppression properties of the solution over a range of feature sizes without a need to change suppressors.
摘要:
The present invention generally relates to a viscoelastic fluids, thickened acid compositions and the like and to methods of using said gelled compositions. The thickened compositions of the present invention can usefully be employed in methods of stimulating and/or modifying the permeability of underground formations, in drilling fluids, completion fluids, workover fluids, acidizing fluids, fracturing, gravel packing and the like.
摘要:
A StatMux system and method are provided for efficiently allocating time slots on the transmission channel between bit streams representing video and bit streams representing data. By providing such a system and method, when a decreased number of data bits need to be transmitted, a decreased number of time slots may be allocated for transmitting the data bits and an increased number of time slots may be allocated for transmitting video bits. When a decreased number of video bits needs to be transmitted, a decreased number of time slots may be allocated for transmitting video bits and an increased number of time slots may be allocated for transmitting data bits.
摘要:
The present invention provides a method for restoring budding capability to GP64null baculoviruses including gp64null AcMNPV by expressing therein a portion of the VSV G protein gene or a truncated “stem” portion of the GP64 gene. Other embodiments provide methods to use portions of the G-stem or GP64 protein to target foreign proteins for display on virions.
摘要:
This specification describes technologies relating to content presentation. In general, one aspect of the subject matter described in this specification can be embodied in methods that include the actions of receiving data from a plurality of users within a geographic region associated with a location; analyzing the received data to derive a category for the location; annotating the location with the category; and using the category to boost candidate content items for delivery to users in the location in response to future content item requests.
摘要:
The present invention generally relates to a low residue hydraulic fracturing fluid which comprises an aqueous fluid and at least one polymeric gelling agent, wherein said polymeric gelling agent comprises at least one crosslinked, modified starch. The invention also relates to a method of fracturing a subterranean formation through the use of the aforementioned fracturing fluid.
摘要:
An optoelectronic device assembly can comprise: a coated element and an optoelectronic device on the coated element. The coated element can comprise a thermoplastic substrate and a protective weathering layer. The thermoplastic substrate can comprise a bisphenol-A polycarbonate homopolymer and a polycarbonate copolymer, and wherein the polycarbonate copolymer is selected from a copolymer of tetrabromobisphenol A carbonate and BPA carbonate; a copolymer of 2-phenyl-3,3-bis(4-hydroxyphenyl)phthalimidine carbonate and BPA carbonate; a copolymer of 4,4′-(1-phenylethylidene)biphenol carbonate and BPA carbonate; a copolymer of 4,4′-(1-methylethylidene)bis[2,6-dimethyl-phenol]carbonate and BPA carbonate; and combinations comprising at least one of the foregoing. The protective weathering layer can comprise resorcinol polyarylate and polycarbonate.
摘要:
An invoking request processing method in distributed system. The method makes a judgment according to the interface performance of an invoking object, and transforming an invoking request being sent to an intermediate object into a transferring request, which makes the intermediate object only needing to perform the transferring operation for the invoking request. The actual implemental object directly returns the result to the requesting party. And an corresponding distributed system, distributed server and object implementing module are provided. The requesting party may directly obtain the implement result from the actual implemental object by launching only one invocation, which enhanced the requesting efficiency. Meanwhile the intermediate object only needs to implement the transferring interface, which simplifies the development difficulty of the intermediate object.
摘要:
Methods, systems, and apparatus, including computer program products, for attaching a visual representation of hierarchical data associated with a resource identified by a search system to the resource. The resource and hierarchical data can be presented to a user as a search result. In some implementations, breadcrumbs that describe a traversal path toward a starting or entry page associated with the resource can represent the hierarchical data.
摘要:
A method for processing wafers includes learning a first pattern at a de-skew site on a first wafer layer, saving the first patterns in a recipe for de-skewing wafers, learning a second pattern at the de-skew site a second wafer layer, and saving the second pattern in the same recipe for de-skewing wafers. Learning the first pattern may include determining a score of uniqueness for the first pattern. The method further includes finding the de-skew site on the second wafer layer using the first pattern before learning the second pattern. Finding the de-skew site includes determining a score of similarity between the first pattern and the second pattern. Learning the second pattern is performed when the score of similarity is less than a threshold value. A recipe for de-skewing wafers includes multiple patterns of a de-skew site of a wafer, wherein the patterns include a first pattern at the de-skew site on a first wafer layer and a second pattern at the de-skew site on a second wafer layer.