公开(公告)号：US20130295725A1

公开(公告)日：2013-11-07

申请号：US13651453

申请日：2012-10-14

Applicant: Jin-Woo PARK ,  Seokhyun LEE

Inventor： Jin-Woo PARK ,  Seokhyun LEE

IPC: H01L21/56

CPC classification number: H01L24/19 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05611 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2224/19 ,  H01L2924/00

Abstract: The inventive concept provides semiconductor packages and methods of forming the same. The semiconductor package includes a buffer layer covering at least one sidewall of the semiconductor chip. The buffer layer is covered by a molding layer. Thus, reliability of the semiconductor package may be improved.

Abstract translation: 本发明构思提供半导体封装及其形成方法。 半导体封装包括覆盖半导体芯片的至少一个侧壁的缓冲层。 缓冲层被模制层覆盖。 因此，可以提高半导体封装的可靠性。

公开(公告)号：US20150125999A1

公开(公告)日：2015-05-07

申请号：US14471327

申请日：2014-08-28

Applicant: Seokhyun LEE ,  Jaegwon JANG ,  Chul-Yong JANG

Inventor： Seokhyun LEE ,  Jaegwon JANG ,  Chul-Yong JANG

IPC: H01L21/56 ,  B23K3/06 ,  B23K1/00 ,  B23K1/20 ,  H01L23/00 ,  H01L21/67

CPC classification number: B23K3/0623 ,  B23K1/0016 ,  B23K1/203 ,  H01L21/4853 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/351 ,  H01L2924/37001 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/45099

Abstract: Provided are apparatuses configured to attach a solder ball, methods of attaching a solder ball, and methods of fabricating a semiconductor package including the same. An apparatus configured to attach a solder ball includes a chuck configured to receive a package substrate on which solder balls are provided; a shielding mask configured to shield the package substrate and including holes configured to expose the solder balls; and a heater configured to melt the solder balls exposed through the holes.

Abstract translation: 提供了构造成附接焊球的装置，附接焊球的方法，以及制造包括该焊球的半导体封装的方法。 构造成附接焊球的装置包括：卡盘，其配置成接收其上设置有焊球的封装基板; 屏蔽掩模，被配置为屏蔽所述封装基板并且包括被配置为暴露所述焊球的孔; 以及被配置为熔化通过孔暴露的焊球的加热器。