摘要:
A non-volatile memory device can include a word line that is operatively coupled to a non-volatile memory cell. A local bit line can be operatively coupled to the non-volatile memory cell. A discharge line that is associated with the local bit line can be configured to discharge the local bit line and a discharge diode can be electrically coupled between the local bit line and the discharge line.
摘要:
A semiconductor memory device having the mismatch cell makes a capacitance difference between a bit line pair relatively large during a read operation using at least one dummy memory cell as a mismatch cell selected together with a corresponding memory cell. Therefore, data of a semiconductor memory device may be detected more easily.
摘要:
A nonvolatile memory device includes: a memory array including a plurality of memory banks which are arranged in a first direction; a write global bit line and a read global bit line extending in the first direction to be shared by the memory banks; a write circuit connected to the write global bit line and disposed on a first side of the memory array; and a read circuit connected to the read global bit line and disposed on a second side of the memory array opposite the first side of the memory array, wherein each of the memory banks extends in a second direction different from the first direction and comprises a plurality of nonvolatile memory cells, each of the nonvolatile memory cells having a variable resistive element whose resistance value varies according to data stored therein.
摘要:
The semiconductor memory device includes a memory cell array and a switching circuit. The memory cell array includes a plurality of first memory cells connected between word lines and first local bit lines, and a plurality of second memory cells connected between the word lines and second local bit lines. The switching circuit is configured to respectively connect the first local bit lines to first global bit lines during a first sensing period, and to respectively connect the second local bit lines to second global bit lines during a second sensing period of a reading operation. The semiconductor memory device further includes a sensing circuit configured to sense and amplify data from the first global bit lines during the first sensing period, and to sense and amplify data from the second global bit lines during the second sensing period of the reading operation.
摘要:
One embodiment includes a plurality of word lines, a plurality of bit lines intersecting with the plurality of word lines, a plurality of memory cells formed at intersections of and connected to the plurality of word lines and the plurality of bit lines. Each of the plurality of memory cells may be a floating body cell. A bit line selecting circuit may be configured to selectively connect each of the plurality of bit lines to an output bit line. The embodiment may further include plurality of sense amplifiers, where the plurality of sense amplifiers is greater than one and less than the plurality of bit lines in number. A sense amplifier switching structure may be configured to selectively connect each of the plurality of sense amplifiers to the output bit line.
摘要:
A semiconductor device is provided which includes an NMOS vertical channel transistor located on a substrate and including a p+ polysilicon gate electrode surrounding a vertical p-channel region, and a PMOS vertical channel transistor located on the substrate and including an n+ polysilicon gate electrode surrounding a vertical n-channel region. The NMOS and PMOS vertical channel transistors are optionally operable in a CMOS operational mode.
摘要:
A pre-charge controlling method and device are provided. The pre-charge controlling method includes pre-charging a first global bit line with a first pre-charge voltage by using at least a first pre-charge circuit located between a plurality of sub arrays included in a memory cell array and pre-charging the first global bit line with a second pre-charge voltage by using a second pre-charge circuit located outside the memory cell array.
摘要:
A semiconductor memory device includes a memory cell array including a plurality of memory cells having a transistor with a floating body, a source line driver configured to control the source lines to select the memory cells in response to an address signal, a source line voltage generation unit configured to generate a source line target voltage, receive an source line output voltage from the source line driver, compare the level of the source line output voltage with the level of the source line target voltage, generate a source line voltage of which the level is adaptively varied according to a temperature, and a sense amplifier configured to sense a difference in current flowing through the bit lines in response to data read from a selected memory cell, amplify the difference to a level having high output driving capability and output the amplified current.
摘要:
A semiconductor memory device including a transistor having a vertical channel structure is provided. The device includes a first sub memory cell array including a first memory cell connected to a first bit lines and including a transistor having a vertical channel structure, a second sub memory cell array including a second memory cell connected to a first inverted bit lines and including a transistor having a vertical channel structure, and a plurality of precharge blocks. In addition, first and second precharge blocks are disposed at first and second sides of the first bit line and precharge the first bit line, and third and fourth precharge blocks are disposed at first and second sides of the first inverted bit line and precharge the first inverted bit line.
摘要:
A nonvolatile memory device includes: a memory array including a plurality of memory banks which are arranged in a first direction; a write global bit line and a read global bit line extending in the first direction to be shared by the memory banks; a write circuit connected to the write global bit line and disposed on a first side of the memory array; and a read circuit connected to the read global bit line and disposed on a second side of the memory array opposite the first side of the memory array, wherein each of the memory banks extends in a second direction different from the first direction and comprises a plurality of nonvolatile memory cells, each of the nonvolatile memory cells having a variable resistive element whose resistance value varies according to data stored therein.