Methods for epitaxial silicon growth
    1.
    发明授权
    Methods for epitaxial silicon growth 有权
    外延硅生长方法

    公开(公告)号:US09217209B2

    公开(公告)日:2015-12-22

    申请号:US13410596

    申请日:2012-03-02

    IPC分类号: C30B23/02 C30B29/06 C30B25/18

    CPC分类号: C30B29/06 C30B23/02 C30B25/18

    摘要: Methods of cleaning substrates and growing epitaxial silicon thereon are provided. Wafers are exposed to a plasma for a sufficient time prior to epitaxial silicon growth, in order to clean the wafers. The methods exhibit enhanced selectivity and reduced lateral growth of epitaxial silicon. The wafers may have dielectric areas that are passivated by the exposure of the wafer to a plasma.

    摘要翻译: 提供清洗衬底并在其上生长外延硅的方法。 在外延硅生长之前,将晶片暴露于等离子体足够的时间,以便清洁晶片。 该方法表现出增强的选择性和减少外延硅的横向生长。 晶片可以具有通过将晶片暴露于等离子体而钝化的电介质区域。

    Memory cell with carbon switching material having a reduced cross-sectional area and methods for forming the same
    3.
    发明授权
    Memory cell with carbon switching material having a reduced cross-sectional area and methods for forming the same 有权
    具有具有减小的横截面积的碳开关材料的存储单元及其形成方法

    公开(公告)号:US08471360B2

    公开(公告)日:2013-06-25

    申请号:US12760156

    申请日:2010-04-14

    IPC分类号: H01L29/92

    摘要: In a first aspect, a method of forming a metal-insulator-metal (“MIM”) stack is provided, the method including: (1) forming a dielectric material having an opening and a first conductive carbon layer within the opening; (2) forming a spacer in the opening; (3) forming a carbon-based switching material on a sidewall of the spacer; and (4) forming a second conductive carbon layer above the carbon-based switching material. A ratio of a cross sectional area of the opening in the dielectric material to a cross sectional area of the carbon-based switching material on the sidewall of the spacer is at least 5. Numerous other aspects are provided.

    摘要翻译: 在第一方面中,提供了形成金属 - 绝缘体 - 金属(“MIM”)叠层的方法,所述方法包括:(1)在开口内形成具有开口的电介质材料和第一导电碳层; (2)在开口中形成间隔物; (3)在间隔件的侧壁上形成碳基开关材料; 和(4)在碳基开关材料上形成第二导电碳层。 介电材料中的开口的横截面积与间隔件侧壁上的碳基开关材料的横截面积的比率至少为5.许多其它方面。

    METHODS FOR EPITAXIAL SILICON GROWTH
    4.
    发明申请
    METHODS FOR EPITAXIAL SILICON GROWTH 有权
    外源硅生长方法

    公开(公告)号:US20120180716A1

    公开(公告)日:2012-07-19

    申请号:US13410596

    申请日:2012-03-02

    CPC分类号: C30B29/06 C30B23/02 C30B25/18

    摘要: Methods of cleaning substrates and growing epitaxial silicon thereon are provided. Wafers are exposed to a plasma for a sufficient time prior to epitaxial silicon growth, in order to clean the wafers. The methods exhibit enhanced selectivity and reduced lateral growth of epitaxial silicon. The wafers may have dielectric areas that are passivated by the exposure of the wafer to a plasma.

    摘要翻译: 提供清洗衬底并在其上生长外延硅的方法。 在外延硅生长之前,将晶片暴露于等离子体足够的时间,以便清洁晶片。 该方法表现出增强的选择性和减少外延硅的横向生长。 晶片可以具有通过将晶片暴露于等离子体而钝化的电介质区域。

    Methods for epitaxial silicon growth
    5.
    发明授权
    Methods for epitaxial silicon growth 有权
    外延硅生长方法

    公开(公告)号:US08152918B2

    公开(公告)日:2012-04-10

    申请号:US11478401

    申请日:2006-06-29

    IPC分类号: C30B21/02

    CPC分类号: C30B29/06 C30B23/02 C30B25/18

    摘要: Methods of cleaning substrates and growing epitaxial silicon thereon are provided. Wafers are exposed to a plasma for a sufficient time prior to epitaxial silicon growth, in order to clean the wafers. The methods exhibit enhanced selectivity and reduced lateral growth of epitaxial silicon. The wafers may have dielectric areas that are passivated by the exposure of the wafer to a plasma.

    摘要翻译: 提供清洗衬底并在其上生长外延硅的方法。 在外延硅生长之前,将晶片暴露于等离子体足够的时间,以便清洁晶片。 该方法表现出增强的选择性和减少外延硅的横向生长。 晶片可以具有通过将晶片暴露于等离子体而钝化的电介质区域。

    MEMORY CELL WITH CARBON SWITCHING MATERIAL HAVING A REDUCED CROSS-SECTIONAL AREA AND METHODS FOR FORMING THE SAME
    6.
    发明申请
    MEMORY CELL WITH CARBON SWITCHING MATERIAL HAVING A REDUCED CROSS-SECTIONAL AREA AND METHODS FOR FORMING THE SAME 有权
    具有减少的交叉区域的碳开关材料的存储单元及其形成方法

    公开(公告)号:US20110254126A1

    公开(公告)日:2011-10-20

    申请号:US12760156

    申请日:2010-04-14

    IPC分类号: H01L29/92 H01L21/20

    摘要: In a first aspect, a method of forming a metal-insulator-metal (“MIM”) stack is provided, the method including: (1) forming a dielectric material having an opening and a first conductive carbon layer within the opening; (2) forming a spacer in the opening; (3) forming a carbon-based switching material on a sidewall of the spacer; and (4) forming a second conductive carbon layer above the carbon-based switching material. A ratio of a cross sectional area of the opening in the dielectric material to a cross sectional area of the carbon-based switching material on the sidewall of the spacer is at least 5. Numerous other aspects are provided.

    摘要翻译: 在第一方面中,提供了形成金属 - 绝缘体 - 金属(“MIM”)叠层的方法,所述方法包括:(1)在开口内形成具有开口的电介质材料和第一导电碳层; (2)在开口中形成间隔物; (3)在间隔件的侧壁上形成碳基开关材料; 和(4)在碳基开关材料上形成第二导电碳层。 介电材料中的开口的横截面积与间隔件侧壁上的碳基开关材料的横截面积的比率至少为5.许多其它方面。

    Methods for epitaxial silicon growth

    公开(公告)号:US07101435B2

    公开(公告)日:2006-09-05

    申请号:US10448687

    申请日:2003-05-30

    IPC分类号: C30B25/16

    CPC分类号: C30B29/06 C30B23/02 C30B25/18

    摘要: Methods of cleaning substrates and growing epitaxial silicon thereon are provided. Wafers are exposed to a plasma for a sufficient time prior to epitaxial silicon growth, in order to clean the wafers. The methods exhibit enhanced selectivity and reduced lateral growth of epitaxial silicon. The wafers may have dielectric areas that are passivated by the exposure of the wafer to a plasma.