公开(公告)号：US08338941B2

公开(公告)日：2012-12-25

申请号：US12805131

申请日：2010-07-14

申请人： Jinho Lee ,  Choongbin Yim ,  Jin-woo Park ,  Dae-young Choi ,  Mi-yeon Kim

发明人： Jinho Lee ,  Choongbin Yim ,  Jin-woo Park ,  Dae-young Choi ,  Mi-yeon Kim

IPC分类号： H01L23/48

CPC分类号： H01L21/76898 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1515 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package may include a substrate having first and second surfaces, the second surface including a recessed portion, a first semiconductor chip mounted on the first surface, a first ball land outside the recessed portion, a connection pad inside the recessed portion, a second chip in the recessed portion, the second semiconductor chip including a through via electrically connected to the connection pad, and a second ball land electrically connected to the through via. A semiconductor package may include a substrate having first and second surfaces, the second surface including a recessed portion, a first semiconductor chip mounted on the first surface, a first ball land outside the recessed portion, a connection pad inside the recessed portion, a second semiconductor chip in the recessed portion, the second chip including a through via electrically connected to the connection pad, and a second ball land electrically connected to the through via.

摘要翻译： 半导体封装可以包括具有第一表面和第二表面的基板，第二表面包括凹部，安装在第一表面上的第一半导体芯片，凹部外侧的第一球台面，凹部内的连接垫，第二表面 所述第二半导体芯片包括电连接到所述连接焊盘的通孔，以及电连接到所述通孔的第二焊盘。 半导体封装可以包括具有第一表面和第二表面的基板，第二表面包括凹部，安装在第一表面上的第一半导体芯片，凹部外侧的第一球台面，凹部内的连接垫，第二表面 半导体芯片，所述第二芯片包括电连接到所述连接焊盘的通孔，以及电连接到所述通孔的第二焊盘。

公开(公告)号：US20110018121A1

公开(公告)日：2011-01-27

申请号：US12805131

申请日：2010-07-14

申请人： Jinho Lee ,  Choongbin Yim ,  Jin-woo Park ,  Dae-young Choi ,  Mi-yeon Kim

发明人： Jinho Lee ,  Choongbin Yim ,  Jin-woo Park ,  Dae-young Choi ,  Mi-yeon Kim

IPC分类号： H01L23/52 ,  H01L23/48

CPC分类号： H01L21/76898 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1515 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package may include a substrate having first and second surfaces, the second surface including a recessed portion, a first semiconductor chip mounted on the first surface, a first ball land outside the recessed portion, a connection pad inside the recessed portion, a second chip in the recessed portion, the second semiconductor chip including a through via electrically connected to the connection pad, and a second ball land electrically connected to the through via. A semiconductor package may include a substrate having first and second surfaces, the second surface including a recessed portion, a first semiconductor chip mounted on the first surface, a first ball land outside the recessed portion, a connection pad inside the recessed portion, a second semiconductor chip in the recessed portion, the second chip including a through via electrically connected to the connection pad, and a second ball land electrically connected to the through via.

摘要翻译： 半导体封装可以包括具有第一表面和第二表面的基板，第二表面包括凹部，安装在第一表面上的第一半导体芯片，凹部外侧的第一球台面，凹部内的连接垫，第二表面 所述第二半导体芯片包括电连接到所述连接焊盘的通孔，以及电连接到所述通孔的第二焊盘。 半导体封装可以包括具有第一表面和第二表面的基板，第二表面包括凹部，安装在第一表面上的第一半导体芯片，凹部外侧的第一球台面，凹部内的连接垫，第二表面 半导体芯片，所述第二芯片包括电连接到所述连接焊盘的通孔，以及电连接到所述通孔的第二焊盘。

公开(公告)号：US20110292999A1

公开(公告)日：2011-12-01

申请号：US12827195

申请日：2010-06-30

申请人： Se Yoon JEONG ,  Sung-Chang Lim ,  Hahyun Lee ,  Jinho Lee ,  Jongho Kim ,  Hae-Chul Choi ,  Sukhee Cho ,  Hui Yong Kim ,  Jin Soo Choi ,  Jin Woo Hong

发明人： Se Yoon JEONG ,  Sung-Chang Lim ,  Hahyun Lee ,  Jinho Lee ,  Jongho Kim ,  Hae-Chul Choi ,  Sukhee Cho ,  Hui Yong Kim ,  Jin Soo Choi ,  Jin Woo Hong

IPC分类号： H04N7/32

CPC分类号： H04N19/105 ,  H04N19/11 ,  H04N19/119 ,  H04N19/122 ,  H04N19/146 ,  H04N19/176 ,  H04N19/40 ,  H04N19/46 ,  H04N19/61 ,  H04N19/70 ,  H04N19/91

摘要： Provided are technologies that may perform intra coding of a super macro block that is an enlarged macro block. In this case, the super macro block is handled as a single entity or may be divided into a plurality of macro blocks. The present invention may perform intra coding both when the super macro block is handled as the single entity and when the super macro block is divided into the plurality of macro blocks.

摘要翻译： 提供了可以执行作为放大的宏块的超宏块的帧内编码的技术。 在这种情况下，超宏块被处理为单个实体或者可以被分成多个宏块。 当超宏块被处理为单个实体时，并且当超宏块被划分成多个宏块时，本发明可以执行帧内编码。

公开(公告)号：US07609860B2

公开(公告)日：2009-10-27

申请号：US11251222

申请日：2005-10-14

申请人： Jinho Lee ,  Baback Moghaddam ,  Hanspeter Pfister ,  Raghu Machiraju

发明人： Jinho Lee ,  Baback Moghaddam ,  Hanspeter Pfister ,  Raghu Machiraju

IPC分类号： G06K9/00 ,  G06K9/46 ,  G06K9/66 ,  G06K9/36 ,  A61B3/10

CPC分类号： G06K9/4661

摘要： A method recognizes a face in an image. A morphable model having shape and pose parameters is fitted to a face in an image to construct a three-dimensional model of the face. Texture is extracted from the face in the image using the three-dimensional model. The shape and texture are projected into a bilinear illumination model to generate illumination bases for the face in the image. The illumination bases for the face in the image are compared to illumination bases of each of a plurality of bilinear illumination models of known faces to identify the face in the image.

摘要翻译： 一种方法识别图像中的一张脸。 具有形状和姿态参数的变形模型被拟合到图像中的面部以构建面部的三维模型。 使用三维模型从图像中的脸部提取纹理。 将形状和纹理投影到双线性照明模型中以为图像中的脸部产生照明基础。 将图像中的脸部的照明基底与已知面部的多个双线性照明模型中的每一个的照明基底进行比较，以识别图像中的脸部。

公开(公告)号：US07426292B2

公开(公告)日：2008-09-16

申请号：US10836004

申请日：2004-04-30

申请人： Baback Moghaddam ,  Hanspeter Pfister ,  Jinho Lee

发明人： Baback Moghaddam ,  Hanspeter Pfister ,  Jinho Lee

IPC分类号： G06K9/00

CPC分类号： G06K9/00288 ,  G06T17/00

摘要： A method determines an optimal set of viewpoints to acquire a 3D shape of a face. A view-sphere is tessellated with a plurality of viewpoint cells. The face is at an approximate center of the view-sphere. Selected viewpoint cells are discarded. The remaining viewpoint cells are clustered to a predetermined number of viewpoint cells according to a silhouette difference metric. The predetermined number of viewpoint cells are searched for a set of optimal viewpoint cells to construct a 3D model of the face.

摘要翻译： 一种方法确定获得面部3D形状的最佳视点集合。 用多个视点单元镶嵌视野球。 脸部位于视野球的大致中心。 所选视点单元被丢弃。 根据剪影差异度量，剩余的视点单元被聚集到预定数量的视点单元。 搜索预定数量的视点单元以获得一组最佳视点单元，以构造面部的3D模型。

公开(公告)号：US07212664B2

公开(公告)日：2007-05-01

申请号：US10636355

申请日：2003-08-07

申请人： Jinho Lee ,  Baback Moghaddam ,  Hanspeter Pfister ,  Raghu Machiraju

发明人： Jinho Lee ,  Baback Moghaddam ,  Hanspeter Pfister ,  Raghu Machiraju

IPC分类号： G06K9/00

CPC分类号： G06K9/00288 ,  G06T17/00

摘要： A method reconstructs or synthesizes heads from 3D models of heads and 2D silhouettes of heads. A 3D statistical model is generated from multiple real human heads. The 3D statistical model includes a model parameter in the form of basis vectors and corresponding coefficients. Multiple 2D silhouettes of a particular head are acquired using a camera for example. The 3D statistical model is fitted to multiple 2D silhouettes to determine a particular value of the model parameter corresponding to the plurality of 2D silhouettes. Then, the 3D statistical model is rendered according to the particular value of the model parameter to reconstruct the particular head.

摘要翻译： 一种方法从头部的3D模型和头部的2D轮廓重建或合成头部。 一个3D统计模型是从多个真人脑中产生的。 3D统计模型包括基矢量和对应系数形式的模型参数。 使用相机例如获取特定头部的多个2D轮廓。 将3D统计模型拟合到多个2D轮廓以确定对应于多个2D轮廓的模型参数的特定值。 然后，根据模型参数的特定值来渲染3D统计模型以重建特定的头部。

公开(公告)号：US09147878B2

公开(公告)日：2015-09-29

申请号：US13563374

申请日：2012-07-31

申请人： Chanho Lee ,  Kiwoon Kim ,  Youngju Ahn ,  Jinho Lee ,  Junpyo Park

发明人： Chanho Lee ,  Kiwoon Kim ,  Youngju Ahn ,  Jinho Lee ,  Junpyo Park

IPC分类号： H01M4/485 ,  H01M4/525 ,  H01M2/22 ,  H01M2/26 ,  H01M2/30 ,  H01M2/34 ,  H01M4/58 ,  H01M10/052 ,  H01M10/058

CPC分类号： H01M4/485 ,  H01M2/22 ,  H01M2/26 ,  H01M2/30 ,  H01M2/348 ,  H01M4/525 ,  H01M4/5825 ,  H01M10/052 ,  H01M10/058 ,  Y02E60/122

摘要： An electrode assembly and a secondary battery comprising the same are provided. The secondary battery includes at least one electrode assembly formed by winding together a first electrode plate and a second electrode plate each coated with an active material layer, a current collector, and a case accommodating the electrode assemblies and the current collector.

摘要翻译： 提供一种电极组件和包括该电极组件的二次电池。 二次电池包括至少一个电极组件，其通过将第一电极板和各自涂覆有活性材料层的第二电极板，集电器和容纳电极组件和集电器的壳体卷绕在一起而形成。

公开(公告)号：US08953686B2

公开(公告)日：2015-02-10

申请号：US12976346

申请日：2010-12-22

申请人： Hae-Chul Choi ,  Se Yoon Jeong ,  Sukhee Cho ,  Hui Yong Kim ,  Jinho Lee ,  Hahyun Lee ,  Sung-Chang Lim ,  Jongho Kim ,  Jin Soo Choi ,  Jin Woo Hong ,  Jin Woong Kim

发明人： Hae-Chul Choi ,  Se Yoon Jeong ,  Sukhee Cho ,  Hui Yong Kim ,  Jinho Lee ,  Hahyun Lee ,  Sung-Chang Lim ,  Jongho Kim ,  Jin Soo Choi ,  Jin Woo Hong ,  Jin Woong Kim

IPC分类号： H04N11/02 ,  H04N19/52

CPC分类号： H04N19/52 ,  H04N19/172 ,  H04N19/176 ,  H04N19/513

摘要： Provided is an image encoding/decoding apparatus and method. The image encoding apparatus may include a motion vector prediction unit to perform a prediction with respect to an arbitrary motion vector of a current block within an image, using at least one of vector information of a motion vector corresponding to an adjacent block and vector information of a previous motion vector of the current block, and a differential determination unit to determine differential information of a motion vector of the current block based on the motion vector predicted in the motion vector prediction unit and an actual motion vector of the current block.

摘要翻译： 提供了一种图像编码/解码装置和方法。 图像编码装置可以包括运动矢量预测单元，使用与相邻块对应的运动矢量的矢量信息和矢量信息中的至少一个来执行关于图像内的当前块的任意运动矢量的预测 当前块的先前运动矢量，以及差分确定单元，用于基于运动矢量预测单元中预测的运动矢量和当前块的实际运动矢量来确定当前块的运动矢量的差分信息。

公开(公告)号：US20140205006A1

公开(公告)日：2014-07-24

申请号：US14220962

申请日：2014-03-20

申请人： Se Yoon Jeong ,  Sung-Chang Lim ,  Hahyun Lee ,  Jinho Lee ,  Jongho Kim ,  Hae-Chul Choi ,  Sukhee Cho ,  Hui Yong Kim ,  Jin Soo Choi ,  Jin Woo Hong

发明人： Se Yoon Jeong ,  Sung-Chang Lim ,  Hahyun Lee ,  Jinho Lee ,  Jongho Kim ,  Hae-Chul Choi ,  Sukhee Cho ,  Hui Yong Kim ,  Jin Soo Choi ,  Jin Woo Hong

IPC分类号： H04N19/105 ,  H04N19/61 ,  H04N19/176 ,  H04N19/146 ,  H04N19/91

CPC分类号： H04N19/105 ,  H04N19/11 ,  H04N19/119 ,  H04N19/122 ,  H04N19/146 ,  H04N19/176 ,  H04N19/40 ,  H04N19/46 ,  H04N19/61 ,  H04N19/70 ,  H04N19/91

摘要： Provided are technologies that may perform intra coding of a super macro block that is an enlarged macro block. In this case, the super macro block is handled as a single entity or may be divided into a plurality of macro blocks. The present invention may perform intra coding both when the super macro block is handled as the single entity and when the super macro block is divided into the plurality of macro blocks.

摘要翻译： 提供了可以执行作为放大的宏块的超宏块的帧内编码的技术。 在这种情况下，超宏块被处理为单个实体或者可以被分成多个宏块。 当超宏块被处理为单个实体时，并且当超宏块被划分成多个宏块时，本发明可以执行帧内编码。

公开(公告)号：US09180156B2

公开(公告)日：2015-11-10

申请号：US13588467

申请日：2012-08-17

申请人： Dae-Kyu Song ,  Jinho Lee

发明人： Dae-Kyu Song ,  Jinho Lee

IPC分类号： A61K36/82 ,  A61K31/25 ,  A23L1/30 ,  A23L1/307 ,  A23L1/308

CPC分类号： A61K36/82 ,  A23L33/105 ,  A23L33/20 ,  A23L33/25 ,  A23V2002/00 ,  A61K31/25 ,  A23V2200/328 ,  A23V2250/214 ,  A23V2250/5116

摘要： The present application describes a composition for blood glucose control containing green tea extracts (GTE) with gallated catechins (GC) and macromolecule to prevent the intestinal absorption of GC.

摘要翻译： 本申请描述了一种用于血糖控制的组合物，其包含含有无茶酸化儿茶素（GC）和大分子的绿茶提取物（GTE），以防止肠吸收GC。