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    PRESSURE SENSOR AND METHOD OF PACKAGING SAME
    1.
    发明申请
    PRESSURE SENSOR AND METHOD OF PACKAGING SAME 有权
    压力传感器及其包装方法

    公开(公告)号：US20140206124A1

    公开(公告)日：2014-07-24

    申请号：US14219011

    申请日：2014-03-19

    申请人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

    发明人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

    IPC分类号： H01L41/25

    CPC分类号： H01L41/25 ,  G01L19/0069 ,  G01L19/147 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.

    摘要翻译： 包装压力传感器管芯的方法包括提供引线框架，其具有围绕管芯焊盘的管芯焊盘和引线指。 带子附接到引线框架的第一侧。 压力传感器芯片在引线框架的第二侧附接到芯片焊盘，并且芯片的焊盘被连接到引线指。 将密封剂分配到引线框架的第二侧上并且覆盖引线指及其电连接。 将凝胶分配到模具的顶表面上并覆盖芯片接合焊盘及其电连接。 盖子连接到引线框架并覆盖模具和凝胶，并且盖的侧面穿透密封剂。

    PRESSURE SENSOR AND METHOD OF PACKAGING SAME
    4.
    发明申请
    PRESSURE SENSOR AND METHOD OF PACKAGING SAME 有权
    压力传感器及其包装方法

    公开(公告)号：US20120168884A1

    公开(公告)日：2012-07-05

    申请号：US13293119

    申请日：2011-11-10

    申请人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

    发明人： Jinzhong Yao ,  Wai Yew Lo ,  Lan Chu Tan ,  Xuesong Xu

    IPC分类号： H01L29/84 ,  H01L21/50

    CPC分类号： H01L41/25 ,  G01L19/0069 ,  G01L19/147 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

    摘要： A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.

    摘要翻译： 包装压力传感器管芯的方法包括提供引线框架，其具有围绕管芯焊盘的管芯焊盘和引线指。 带子附接到引线框架的第一侧。 压力传感器芯片在引线框架的第二侧附接到芯片焊盘，并且芯片的焊盘被连接到引线指。 将密封剂分配到引线框架的第二侧上并且覆盖引线指及其电连接。 将凝胶分配到模具的顶表面上并覆盖芯片接合焊盘及其电连接。 盖子连接到引线框架并覆盖模具和凝胶，并且盖的侧面穿透密封剂。

    Lead frame for semiconductor device
    8.
    发明授权
    Lead frame for semiconductor device 有权
    半导体器件引线框架

    公开(公告)号：US08525311B2

    公开(公告)日：2013-09-03

    申请号：US13170206

    申请日：2011-06-28

    申请人： Zhigang Bai ,  Jinzhong Yao ,  Xuesong Xu

    发明人： Zhigang Bai ,  Jinzhong Yao ,  Xuesong Xu

    IPC分类号： H01L33/62

    CPC分类号： H01L23/49558 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A lead frame for a semiconductor device has a die pad with a first major surface for receiving an semiconductor die and a connection bar that encircles the die pad. First lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the first lead fingers lie in a first plane. Second lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the second lead fingers lie in a second plane that is parallel and spaced from the first plane. An isolation frame is disposed between the proximal ends of the first and second lead fingers. The isolation frame separates but supports the proximal ends of the first and second lead fingers.

    摘要翻译： 用于半导体器件的引线框具有具有用于接收半导体管芯的第一主表面的管芯焊盘和环绕管芯焊盘的连接杆。 从连接杆朝向管芯焊盘突出的第一引线指端具有靠近管芯焊盘的近端，并且远端连接到连接杆。 第一引线指的近端位于第一平面中。 从连接杆朝向管芯焊盘突出的第二引线指端具有靠近管芯焊盘的近端，并且远端连接到连接杆。 第二引线指的近端位于与第一平面平行并间隔开的第二平面中。 隔离框架设置在第一和第二引线指的近端之间。 隔离框架分离但支撑第一和第二引线指的近端。

    LEADFRAME FOR SEMICONDUCTOR DEVICE
    10.
    发明申请
    LEADFRAME FOR SEMICONDUCTOR DEVICE 有权
    半导体器件的LEADFRAME

    公开(公告)号：US20120056311A1

    公开(公告)日：2012-03-08

    申请号：US13170206

    申请日：2011-06-28

    申请人： Zhigang BAI ,  Jinzhong Yao ,  Xuesong Xu

    发明人： Zhigang BAI ,  Jinzhong Yao ,  Xuesong Xu

    IPC分类号： H01L23/495 ,  H01L21/56

    CPC分类号： H01L23/49558 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： A lead frame for a semiconductor device has a die pad with a first major surface for receiving an semiconductor die and a connection bar that encircles the die pad. First lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the first lead fingers lie in a first plane. Second lead fingers that project from the connection bar towards the die pad have proximal ends close to the die pad and distal ends connected to the connection bar. The proximal ends of the second lead fingers lie in a second plane that is parallel and spaced from the first plane. An isolation frame is disposed between the proximal ends of the first and second lead fingers. The isolation frame separates but supports the proximal ends of the first and second lead fingers.

    摘要翻译： 用于半导体器件的引线框具有具有用于接收半导体管芯的第一主表面的管芯焊盘和环绕管芯焊盘的连接杆。 从连接杆朝向管芯焊盘突出的第一引线指端具有靠近管芯焊盘的近端，并且远端连接到连接杆。 第一引线指的近端位于第一平面中。 从连接杆朝向管芯焊盘突出的第二引线指端具有靠近管芯焊盘的近端，并且远端连接到连接杆。 第二引线指的近端位于与第一平面平行并间隔开的第二平面中。 隔离框架设置在第一和第二引线指的近端之间。 隔离框架分离但支撑第一和第二引线指的近端。