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公开(公告)号：US09029901B2
公开(公告)日：2015-05-12
申请号：US13825525
申请日：2011-08-19
申请人： Johann Ramchen , Christina Keith , Bert Braune
发明人： Johann Ramchen , Christina Keith , Bert Braune
IPC分类号： H01L33/54 , H01L33/56 , H01L33/58 , H01L33/64 , H01L31/0203
CPC分类号： H01L33/641 , H01L31/0203 , H01L33/56 , H01L33/58 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： An electronic component has a housing body which comprises a semiconductor chip in a recess. The semiconductor chip in the recess is embedded in a casting compound made of a first plastic material having a first glass transition temperature. A cover element made of a second plastic material having a second glass transition temperature is arranged above the recess. The second glass transition temperature is lower than the first glass transition temperature.
摘要翻译： 电子部件具有包括凹部中的半导体芯片的壳体。 凹部中的半导体芯片嵌入由具有第一玻璃化转变温度的第一塑料材料制成的铸塑料中。 由具有第二玻璃化转变温度的第二塑料材料制成的盖元件设置在凹部上方。 第二玻璃化转变温度低于第一玻璃化转变温度。
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公开(公告)号：US20130256737A1
公开(公告)日：2013-10-03
申请号：US13825525
申请日：2011-08-19
申请人： Johann Ramchen , Christina Keith , Bert Braune
发明人： Johann Ramchen , Christina Keith , Bert Braune
IPC分类号： H01L33/64
CPC分类号： H01L33/641 , H01L31/0203 , H01L33/56 , H01L33/58 , H01L2224/73265 , H01L2224/48091 , H01L2924/00014
摘要： An electronic component has a housing body which comprises a semiconductor chip in a recess. The semiconductor chip in the recess is embedded in a casting compound made of a first plastic material having a first glass transition temperature. A cover element made of a second plastic material having a second glass transition temperature is arranged above the recess. The second glass transition temperature is lower than the first glass transition temperature.
摘要翻译： 电子部件具有包括凹部中的半导体芯片的壳体。 凹部中的半导体芯片嵌入由具有第一玻璃化转变温度的第一塑料材料制成的铸塑料中。 由具有第二玻璃化转变温度的第二塑料材料制成的盖元件设置在凹部上方。 第二玻璃化转变温度低于第一玻璃化转变温度。
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公开(公告)号：US20130207144A1
公开(公告)日：2013-08-15
申请号：US13808705
申请日：2011-07-01
申请人： Johann Ramchen , Jörg Erich Sorg , Simon Jerebic , Bert Braune
发明人： Johann Ramchen , Jörg Erich Sorg , Simon Jerebic , Bert Braune
IPC分类号： H01L33/52 , H01L31/18 , H01L31/0203
CPC分类号： H01L33/52 , H01L31/0203 , H01L31/18 , H01L33/44 , H01L33/486 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83951 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A component with an optoelectronic semiconductor chip fixed to a connection carrier by a bonding layer and embedded in an encapsulation, wherein a decoupling layer is arranged at least in places between the bonding layer and the encapsulation.
摘要翻译： 具有通过结合层固定到连接载体并嵌入封装中的光电子半导体芯片的部件，其中去耦层至少布置在接合层和封装之间的位置。
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4.发明授权公开(公告)号：US09281458B2
公开(公告)日：2016-03-08
申请号：US14127049
申请日：2012-06-20
申请人： Christina Keith , Bert Braune , Michael Kruppa
发明人： Christina Keith , Bert Braune , Michael Kruppa
CPC分类号： H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： An optoelectronic semiconductor device including a carrier substrate and at least one semiconductor chip arranged thereon, wherein the semiconductor chip includes an active layer that generates radiation, conductor tracks electrically contacting the semiconductor chip arranged on the carrier substrate, the semiconductor chip is enclosed in a potting material, and the potting material includes at least a first potting layer, a second potting layer and a third potting layer, which differ from one another in at least one of: their material composition, their optical properties and their chemical properties.
摘要翻译： 一种光电子半导体器件，包括载体衬底和布置在其上的至少一个半导体芯片，其中半导体芯片包括产生辐射的有源层，与布置在载体衬底上的半导体芯片电接触的导体迹线，半导体芯片封装在封装 材料，并且灌封材料至少包括第一灌封层，第二灌封层和第三灌封层，它们的材料组成，它们的光学性质和它们的化学性质中的至少一个彼此不同。
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5.发明申请公开(公告)号：US20140217444A1
公开(公告)日：2014-08-07
申请号：US14127049
申请日：2012-06-20
申请人： Christina Keith , Bert Braune , Michael Kruppa
发明人： Christina Keith , Bert Braune , Michael Kruppa
CPC分类号： H01L33/56 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014
摘要： An optoelectronic semiconductor device including a carrier substrate and at least one semiconductor chip arranged thereon, wherein the semiconductor chip includes an active layer that generates radiation, conductor tracks electrically contacting the semiconductor chip arranged on the carrier substrate, the semiconductor chip is enclosed in a potting material, and the potting material includes at least a first potting layer, a second potting layer and a third potting layer, which differ from one another in at least one of: their material composition, their optical properties and their chemical properties.
摘要翻译： 一种光电子半导体器件，包括载体衬底和布置在其上的至少一个半导体芯片，其中半导体芯片包括产生辐射的有源层，与布置在载体衬底上的半导体芯片电接触的导体迹线，半导体芯片封装在封装 材料，并且灌封材料至少包括第一灌封层，第二灌封层和第三灌封层，它们的材料组成，它们的光学性质和它们的化学性质中的至少一个彼此不同。
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公开(公告)号：US08883268B2
公开(公告)日：2014-11-11
申请号：US13583755
申请日：2011-03-08
申请人： Bert Braune , Christina Keith , Ivan Galesic
发明人： Bert Braune , Christina Keith , Ivan Galesic
CPC分类号： B05D1/60 , B05D1/62 , B05D3/142 , H01L51/5253
摘要： A method of producing a parylene coating on at least one surface of at least one component includes providing a first gas containing parylene monomers and depositing the parylene monomers on the at least one surface of the component by supplying the first gas containing the parylene monomers by a first nozzle to the at least one surface, wherein the component is disposed in an environment at atmospheric pressure.
摘要翻译： 在至少一种组分的至少一个表面上生产聚对二甲苯涂层的方法包括提供含有聚对二甲苯单体的第一气体，并通过将含有聚对二甲苯单体的第一气体通过 第一喷嘴到所述至少一个表面，其中所述部件设置在大气压的环境中。
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公开(公告)号：US20130189447A1
公开(公告)日：2013-07-25
申请号：US13583755
申请日：2011-03-08
申请人： Bert Braune , Christina Keith , Ivan Galesic
发明人： Bert Braune , Christina Keith , Ivan Galesic
IPC分类号： B05D1/00
CPC分类号： B05D1/60 , B05D1/62 , B05D3/142 , H01L51/5253
摘要： A method of producing a parylene coating on at least one surface of at least one component includes providing a first gas containing parylene monomers and depositing the parylene monomers on the at least one surface of the component by supplying the first gas containing the parylene monomers by a first nozzle to the at least one surface, wherein the component is disposed in an environment at atmospheric pressure.
摘要翻译： 在至少一种组分的至少一个表面上生产聚对二甲苯涂层的方法包括提供含有聚对二甲苯单体的第一气体，并通过将含有聚对二甲苯单体的第一气体通过 第一喷嘴到所述至少一个表面，其中所述部件设置在大气压的环境中。
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8.发明授权Conversion medium body, optoelectronic semiconductor chip and method of producing an optoelectronic semiconductor chip 有权转换介质体，光电子半导体芯片以及制造光电子半导体芯片的方法公开(公告)号：US09055655B2
公开(公告)日：2015-06-09
申请号：US13377593
申请日：2010-08-10
申请人： Bert Braune
发明人： Bert Braune
CPC分类号： H05B33/145 , C09K11/08 , H01L24/24 , H01L33/501 , H01L33/508 , H01L2224/48091 , H01L2224/48227 , H01L2924/12041 , H01L2924/12043 , H01L2924/351 , H01L2933/0041 , H05B33/10 , Y10T428/31663 , H01L2924/00014 , H01L2924/00
摘要： A method of producing an optoelectronic semiconductor chip includes providing a semiconductor layer sequence with at least one active layer, providing a one-piece conversion medium body, wherein a matrix material is incompletely crosslinked and/or cured, and wherein the conversion medium body exhibits at room temperature a hardness of Shore A 0 to Shore A 35 and/or a viscosity of 10 Pa·s to 150 Pa·s, placing the conversion medium body onto the semiconductor layer sequence such that they are in direct contact with one another, and curing the conversion medium body wherein after curing the hardness of the conversion medium body is Shore A 30 to Shore D 80.
摘要翻译： 一种制造光电子半导体芯片的方法包括提供具有至少一个活性层的半导体层序列，提供一体的转换介质体，其中基质材料不完全交联和/或固化，并且其中转化介质体表现出 室温下的肖氏A 0至肖氏A 35的硬度和/或10Pa·s至150Pa·s的粘度，将转化介质体放置在半导体层序列上使得它们彼此直接接触，以及 固化转化介质体，其中固化后的转化介质体的硬度为肖氏A 30至肖氏D 80。
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9.发明申请CONVERSION MEDIUM BODY, OPTOELECTRONIC SEMICONDUCTOR CHIP AND METHOD OF PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR CHIP 有权转换介质体，光电子半导体芯片和生产光电半导体芯片的方法公开(公告)号：US20120146076A1
公开(公告)日：2012-06-14
申请号：US13377593
申请日：2010-08-10
申请人： Bert Braune
发明人： Bert Braune
CPC分类号： H05B33/145 , C09K11/08 , H01L24/24 , H01L33/501 , H01L33/508 , H01L2224/48091 , H01L2224/48227 , H01L2924/12041 , H01L2924/12043 , H01L2924/351 , H01L2933/0041 , H05B33/10 , Y10T428/31663 , H01L2924/00014 , H01L2924/00
摘要： A method of producing an optoelectronic semiconductor chip includes providing a semiconductor layer sequence with at least one active layer, providing a one-piece conversion medium body, wherein a matrix material is incompletely crosslinked and/or cured, and wherein the conversion medium body exhibits at room temperature a hardness of Shore A 0 to Shore A 35 and/or a viscosity of 10 Pa·s to 150 Pa·s, placing the conversion medium body onto the semiconductor layer sequence such that they are in direct contact with one another, and curing the conversion medium body wherein after curing the hardness of the conversion medium body is Shore A 30 to Shore D 80.
摘要翻译： 一种制造光电子半导体芯片的方法包括提供具有至少一个活性层的半导体层序列，提供一体的转换介质体，其中基质材料不完全交联和/或固化，并且其中转化介质体表现出 室温下的肖氏A 0至肖氏A 35的硬度和/或10Pa·s至150Pa·s的粘度，将转化介质体放置在半导体层序列上使得它们彼此直接接触，以及 固化转化介质体，其中固化后的转化介质体的硬度为肖氏A 30至肖氏D 80。
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10.发明申请Optical Element, Production Method Therefor, and Composite Component Provided With an Optical Element 有权光学元件，其制造方法和具有光学元件的复合元件公开(公告)号：US20090213469A1
公开(公告)日：2009-08-27
申请号：US12086383
申请日：2006-11-06
申请人： Bert Braune , Simon Blümel , Manfred Wolf
发明人： Bert Braune , Simon Blümel , Manfred Wolf
CPC分类号： H01L33/58 , B29C45/1615 , B29L2011/00 , G02B7/022 , H01L33/483 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/0102 , H01L2924/01067 , H01L2924/00014 , H01L2924/00
摘要： An optical element (14) is specified which is suitable for an optoelectronic component and has a carrier part (1) and a beam shaping part (12), wherein the beam shaping part is molded onto the carrier part, or vice versa. A corresponding production method and a composite device comprising the optical element are furthermore specified.
摘要翻译： 规定了适用于光电子部件并具有载体部件（1）和光束成形部件（12）的光学元件（14），其中光束成形部件模制在载体部件上，反之亦然。 进一步规定了相应的制造方法和包括光学元件的复合装置。
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