摘要:
Inorganic powder, preferably fumed silica, is rendered hydrophobic by treatment with a silylating agent in the presence of a third reagent selected from the group consisting of protonic acids, especially those having a boiling point at atmospheric pressure up to 120.degree. C., preferably formic acid, and linear phosphonitrilic halides, preferably linear phosphonitrilic chlorides.
摘要:
The present invention relates to curable alkenyl based silicone release coating compositions having improved adhesion to paper and polymeric substrates. Furthermore the present invention relates to the process for making a silicone release coating with improved adhesion to paper and polymeric substrates.
摘要:
The present invention provides novel filled silicone compositions comprising a nano-particulate metal oxide filler selected from nano-particulate monoclinic alpha-phase bismuth oxide, nano-particulate erbium oxide, and mixtures thereof. The new composite compositions exhibit a combination of outstanding performance characteristics in both the cured and uncured states. Thus, the uncured formulations are typically free flowing liquids which are self-leveling, which de-gas readily under vacuum, are readily colorable through the addition of pigments, and which cure at temperatures of about 60° C. The cured compositions possess outstanding acoustic characteristics which make them ideally suited for use in applications such as acoustic lenses for medical imaging and therapy. For example, the acoustic impedance of compositions provided by the present invention is closely matched to the acoustic impedance of human tissue. This may result in an enhancement of ultrasound transmission efficiency between the lens of an ultrasound probe comprising such a composition and the patient.
摘要:
The present invention relates to curable alkenyl based silicone release coating compositions having improved adhesion to paper and polymeric substrates. Furthermore the present invention relates to the process for making a silicone release coating with improved adhesion to paper and polymeric substrates.
摘要:
An underfill composition including a polymer precursor is provided. The polymer precursor includes 4 or more pendant oxetane functional groups. The underfill composition includes greater than about 20 weight percent of the polymeric precursor. Associated article and method are also provided.
摘要:
A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen-containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.
摘要:
Disclosed is a crosslinked polysiloxane network comprising both residual Si—H linkages and a Lewis acid catalyst, wherein the network is derived from a linear hydridosiloxane, a branched hydridosiloxane, a cyclic hydridosiloxane or a mixture of a linear hydridosiloxane or branched hydridosiloxane and a cyclic hydridosiloxane. Disclosed also is a method to produce the crosslinked polysiloxane network, alternatively accompanied by a silane with aliphatic, aromatic, or cycloaliphatic substituents by reacting in the presence of an effective amount of a Lewis acid catalyst a linear hydridosiloxane, a branched hydridosiloxane, a cyclic hydridosiloxane or a mixture of a linear hydridosiloxane or branched hydridosiloxane and a cyclic hydridosiloxane.
摘要:
A curable composition is provided, and a method associated therewith. The curable composition may include a curable resin and a finely divided refractory solid. The solid may have a surface area that is greater than about 5 square meters per gram, and a determined density of active surface termination sites per square nanometer of surface area.
摘要:
Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.
摘要:
A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modified resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.