-
公开(公告)号：US20050170188A1
公开(公告)日：2005-08-04
申请号：US11096160
申请日：2005-04-01
申请人： John Campbell , Slawomir Rubinsztajn , David Gibson , Sandeep Tonapi , Ryan Mills , Ananth Prabhakumar
发明人： John Campbell , Slawomir Rubinsztajn , David Gibson , Sandeep Tonapi , Ryan Mills , Ananth Prabhakumar
IPC分类号： B32B27/38
CPC分类号： C08G59/3218 , C08G59/24 , C08G59/4215 , C08G59/68 , C08K3/36 , H01L21/563 , H01L23/293 , H01L2224/73203 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/01051 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , Y10T428/31511 , C08L63/00 , H01L2924/00
摘要： A composition comprises a first curable resin composition that includes at least one aromatic epoxy resin in combination with a solvent, a functionalized colloidal silica dispersion, and at least one other component selected from the group consisting of cycloaliphatic epoxy monomers, aliphatic epoxy monomers, hydroxy aromatic compounds, combinations thereof, and mixtures thereof. The composition can include a separate second curable fluxing composition that comprises at least one epoxy resin. The first curable resin or the combination of the two resin compositions is useful in producing underfill materials and is suitable for use as an encapsulant for electronic chips.
摘要翻译： 组合物包含第一可固化树脂组合物，其包含至少一种与溶剂组合的芳族环氧树脂，官能化胶态二氧化硅分散体和至少一种选自脂环族单体，脂族环氧单体，羟基芳族化合物 化合物，其组合，及其混合物。 组合物可以包括单独的第二可固化助熔组合物，其包含至少一种环氧树脂。 第一可固化树脂或两种树脂组合物的组合可用于生产底部填充材料，并且适合用作电子芯片的密封剂。
-
公开(公告)号：US20060293172A1
公开(公告)日：2006-12-28
申请号：US11167847
申请日：2005-06-23
IPC分类号： B01J31/00
CPC分类号： H01L23/293 , B01J31/0237 , B01J31/0244 , B01J31/146 , C08G59/68 , C08G59/70 , H01L21/563 , H01L24/81 , H01L2224/73203 , H01L2224/8121 , H01L2224/81815 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/0106 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/12044 , H01L2924/3025 , H01L2924/00
摘要： A cure catalyst is provided. The cure catalyst may include a Lewis acid and one or both of a nitrogen-containing molecule or a non-tertiary phosphine. The nitrogen-containing molecule may include a mono amine or a heterocyclic aromatic organic compound. A curable composition may include the cure catalyst. An electronic device may include the curable composition. Methods associated with the foregoing are provided also.
摘要翻译： 提供固化催化剂。 固化催化剂可以包括路易斯酸和含氮分子或非叔膦中的一种或两种。 含氮分子可以包括单胺或杂环芳族有机化合物。 可固化组合物可包括固化催化剂。 电子设备可以包括可固化组合物。 还提供与前述相关的方法。
-
公开(公告)号：US20050049352A1
公开(公告)日：2005-03-03
申请号：US10737943
申请日：2003-12-16
申请人： Slawomir Rubinsztajn , Sandeep Tonapi , David Gibson , John Campbell , Ananth Prabhakumar , Ryan Mills
发明人： Slawomir Rubinsztajn , Sandeep Tonapi , David Gibson , John Campbell , Ananth Prabhakumar , Ryan Mills
CPC分类号： B82Y30/00 , C01P2004/64 , C08K9/06 , C08L63/00 , C09C1/3081 , H01L21/563 , H01L23/293 , H01L23/295 , H01L2224/73203 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/12044 , H01L2924/00
摘要： A solvent-modified resin composition for use as underfill material is provided. The composition having at least one epoxy resin, at least one solvent and a filler of functionalized colloidal silica. The solvent-modified resin composition is useful in making transparent B-stage resin films. Embodiments of the disclosure include use as a wafer level underfill, and an encapsulant for electronic chips.
摘要翻译： 提供了用作底部填充材料的溶剂改性树脂组合物。 所述组合物具有至少一种环氧树脂，至少一种溶剂和官能化胶体二氧化硅的填料。 溶剂改性树脂组合物可用于制备透明的B阶树脂膜。 本公开的实施例包括用作晶片级底部填充物，以及用于电子芯片的密封剂。
-
4.发明申请Nano-filled composite materials with exceptionally high glass transition temperature 审中-公开具有极高玻璃化转变温度的纳米填充复合材料公开(公告)号：US20050048291A1
公开(公告)日：2005-03-03
申请号：US10641425
申请日：2003-08-14
申请人： Wing Woo , Slawomir Rubinsztajn , John Campbell , Florian Schattenmann , Sandeep Tonapi , Ananth Prabhakumar
发明人： Wing Woo , Slawomir Rubinsztajn , John Campbell , Florian Schattenmann , Sandeep Tonapi , Ananth Prabhakumar
CPC分类号： B82Y30/00 , C01P2004/64 , C08K9/04 , C09C1/3081 , H01L23/293 , H01L23/295 , H01L2224/16227 , H01L2224/73104 , H01L2224/73204 , H01L2224/92125 , H01L2224/94 , Y10T428/31511 , C08L63/00 , H01L2224/11 , H01L2224/27
摘要： A curable epoxy formulation is provided in the present invention. The formulation comprises an epoxy monomer, an organofunctionalized colloidal silica having a particle size in a range between about 2 nanometers and about 20 nanometers, and optional reagents wherein the organofunctionalized colloidal silica substantially increases the glass transition temperature of the epoxy formulation. Further embodiments of the present invention include a semiconductor package comprising the aforementioned curable epoxy formulation.
摘要翻译： 在本发明中提供可固化的环氧树脂制剂。 该制剂包含环氧单体，粒度在约2纳米至约20纳米之间的有机官能化胶体二氧化硅，以及任选的试剂，其中有机官能化胶体二氧化硅基本上增加了环氧树脂制剂的玻璃化转变温度。 本发明的其它实施方案包括包含上述可固化环氧树脂制剂的半导体封装。
-
5.发明申请公开(公告)号：US20050266263A1
公开(公告)日：2005-12-01
申请号：US11155990
申请日：2005-06-17
IPC分类号： B32B15/00
CPC分类号： H01L23/293 , B82Y30/00 , C01P2004/64 , C01P2006/12 , C01P2006/22 , C08G59/3218 , C08G59/68 , C08K9/06 , C08L63/00 , C09C1/3081 , C09C3/12 , C09J163/00 , H01L24/81 , H01L2224/274 , H01L2224/81011 , H01L2224/8121 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01042 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , Y10T428/12556 , Y10T428/12569 , Y10T428/12771 , Y10T428/12812 , H01L2924/00
摘要： A finely divided refractory solid and an associated method are provided. The solid may have a surface area that is greater than about 5 square meters per gram. The solid may have a density of active surface termination sites per square nanometer of surface area sufficiently low that a curable composition comprising a curable resin that comprises less than about 99 percent by weight of the solid has a stability ratio of less than about 3 after a period of about two weeks. Also, a curable composition, a cured layer, and an electronic device that includes the cured layer are provided.
摘要翻译： 提供细碎的耐火固体和相关方法。 该固体可具有大于约5平方米/克的表面积。 固体可以具有每平方毫米表面积的活性表面终止位置的密度足够低，使得包含小于约99重量％的固体的可固化树脂的可固化组合物在a以后的稳定比小于约3 期间约两周。 此外，提供了包含固化层的固化性组合物，固化层和电子器件。
-
公开(公告)号：US20050129956A1
公开(公告)日：2005-06-16
申请号：US10737453
申请日：2003-12-16
CPC分类号： C08G59/423 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663
摘要： An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.
摘要翻译： 具有增强的粘附性和改善的抗开裂性的底部填充剂组合物，其包含环氧树脂与双官能硅氧烷酐环氧固化剂和任选试剂的组合。 在一些实施方案中，环氧树脂包括粒度范围为约1nm至约500nm的官能化胶体二氧化硅填料。 双官能硅氧烷酐环氧固化剂可以任选地与液体酐环氧固化剂组合。 固化催化剂，含羟基单体，粘合促进剂，阻燃剂和消泡剂也可以加入到组合物中。 本公开的另外的实施方案包括包含底部填充剂组合物的包装的固态装置。
-
7.发明申请No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance 审中-公开具有低热膨胀系数和良好焊球助熔性能的无流动底部填充材料公开(公告)号：US20050048700A1
公开(公告)日：2005-03-03
申请号：US10653371
申请日：2003-09-02
CPC分类号： C08L63/00 , H01L21/563 , H01L23/293 , H01L24/29 , H01L2224/73203 , H01L2924/01012 , H01L2924/01019 , H01L2924/01029 , H01L2924/01066 , H01L2924/01087 , H01L2924/10253 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , Y10T428/31511 , H01L2924/00
摘要： A no-flow underfill composition comprising an epoxy resin in combination with epoxy hardener and optional reagents and a filler of a functionalized colloidal silica having a particle size ranging from about 1 nm to about 250 nm. The colloidal silica is functionalized with at least one organoalkoxysilane functionalization agent and subsequently functionalized with at least one capping agent. The epoxy hardener includes anhydride curing agents. The optional reagents include cure catalyst and hydroxyl-containing monomer. The adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.
摘要翻译： 一种包含环氧树脂与环氧固化剂和任选的试剂的组合物和具有约1nm至约250nm粒度范围的官能化胶体二氧化硅的填料的无流动底部填充组合物。 胶体二氧化硅用至少一种有机烷氧基硅烷官能化剂官能化，随后用至少一种封端剂官能化。 环氧固化剂包括酸酐固化剂。 任选的试剂包括固化催化剂和含羟基的单体。 粘合促进剂，阻燃剂和消泡剂也可以加入到组合物中。 本公开的另外的实施方案包括包含底部填充剂组合物的包装的固态装置。
-
公开(公告)号：US20060192280A1
公开(公告)日：2006-08-31
申请号：US11068376
申请日：2005-02-28
申请人： David Esler , Donald Buckley , Sandeep Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Arun Gowda
发明人： David Esler , Donald Buckley , Sandeep Tonapi , John Campbell , Ryan Mills , Ananth Prabhakumar , Arun Gowda
CPC分类号： H05K3/3436 , H01L23/49816 , H01L2924/0002 , H05K2201/0209 , H05K2201/10977 , Y02P70/613 , H01L2924/00
摘要： A method of forming polymer reinforced solder-bumped containing device or substrate is described. The method comprises the following steps: providing a device or substrate having at least one solder bump formed thereon; coating a predetermined portion of the device or substrate with a curable polymer reinforcement material forming a layer on the device or substrate, partially curing the curable polymer reinforcement material to provide a solder-bumped structure comprising a partially cured polymer reinforcement material, and, making a connection between the solder-bumped structure formed and a printed circuit board or array of attachment pads and fully curing the partially cured polymer reinforcement material to provide a reinforced interconnection. Full curing of the polymer reinforcement material may take place either during the “reflow step” or subsequent to it (post-curing).
摘要翻译： 描述了形成聚合物增强焊料凸起的装置或基底的方法。 该方法包括以下步骤：提供其上形成有至少一个焊料凸块的器件或衬底; 用形成在所述装置或基底上的层的可固化聚合物增强材料涂覆所述装置或基材的预定部分，部分固化所述可固化聚合物增强材料，以提供包含部分固化的聚合物增强材料的焊料凸起结构， 所形成的焊料凸起结构与印刷电路板或附接焊盘阵列之间的连接，并且完全固化部分固化的聚合物增强材料以提供增强的互连。 聚合物增强材料的完全固化可以在“回流步骤”或之后（后固化）发生。
-
公开(公告)号：US07279223B2
公开(公告)日：2007-10-09
申请号：US10737453
申请日：2003-12-16
CPC分类号： C08G59/423 , Y10T428/31511 , Y10T428/31515 , Y10T428/31663
摘要： An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.
摘要翻译： 具有增强的粘附性和改善的抗开裂性的底部填充剂组合物，其包含环氧树脂与双官能硅氧烷酐环氧固化剂和任选试剂的组合。 在一些实施方案中，环氧树脂包括粒度范围为约1nm至约500nm的官能化胶体二氧化硅填料。 双官能硅氧烷酐环氧固化剂可以任选地与液体酐环氧固化剂组合。 固化催化剂，含羟基单体，粘合促进剂，阻燃剂和消泡剂也可以加入到组合物中。 本公开的另外的实施方案包括包含底部填充剂组合物的包装的固态装置。
-
10.发明申请Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications 审中-公开溶胶改性树脂体系含有在晶圆级底层填充应用中具有高Tg，透明度和良好可靠性的填料公开(公告)号：US20050049334A1
公开(公告)日：2005-03-03
申请号：US10654378
申请日：2003-09-03
CPC分类号： B82Y30/00 , C01P2004/64 , C08K9/06 , C08L63/00 , C09C1/3081 , H01L21/563 , H01L23/293 , H01L23/295 , H01L2224/73203 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/12044 , H01L2924/00
摘要： A solvent modified resin underfill material comprising a resin in combination with a filler of functionalized colloidal silica and solvent to form a transparent B-stage resin composition, which may then be cured to form a low CTE, high Tg thermoset resin. Embodiments of the disclosure include use as a wafer level filler, and an encapsulant for electronic chips.
摘要翻译： 一种溶剂改性树脂底部填充材料，其包括与官能化胶体二氧化硅和溶剂的填料结合的树脂，以形成透明的B阶树脂组合物，然后可将其固化以形成低CTE，高Tg热固性树脂。 本公开的实施例包括用作晶片级填充物，以及用于电子芯片的密封剂。
-
-
-
-
-
-
-
-
-
搜索结果
22 条记录 (耗时 0.025 秒)
