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23 条记录 (耗时 0.02 秒)

    Semi-aqueous solvent cleaning of paste processing residue from substrates
    5.
    发明授权
    Semi-aqueous solvent cleaning of paste processing residue from substrates 失效
    半水溶剂清洗膏从底物处理残留物

    公开(公告)号：US06569252B1

    公开(公告)日：2003-05-27

    申请号：US09609283

    申请日：2000-06-30

    申请人： Krishna G. Sachdev ,  James N. Humenik ,  Chon Cheong Lei ,  Glenn A. Pomerantz

    发明人： Krishna G. Sachdev ,  James N. Humenik ,  Chon Cheong Lei ,  Glenn A. Pomerantz

    IPC分类号： C23G502

    CPC分类号： H01L21/02063 ,  B23K35/025 ,  C11D7/263 ,  C11D11/0047 ,  C11D11/007 ,  C23G5/032 ,  H05K3/1233 ,  H05K3/26 ,  Y10S134/902

    摘要： A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.

    摘要翻译： 清洁与半导体制造工艺有关的物体的过程，例如通过在电子电路组件中的模版印刷生产多层陶瓷衬底中的导电糊料和复合焊膏。 具体地说，该方法在半导体封装衬底的制造中，将金属/聚合物复合糊剂从掩模掩模和用于印刷导电金属图案的相关糊剂制造和加工设备移除到陶瓷生片上。 该工艺还可以将陶瓷芯片载体上用于SMT离散，焊料柱附件和BGA（球栅阵列）附件的电子模块组件表面贴装技术中使用的模版印刷设备的焊膏残留物清理或用于将焊膏屏蔽到印刷电路板上。 更具体地，通过使用高沸点丙二醇烷基醚或丙二醇烷基醚和丙二醇溶剂的混合物的非碱性半水洗涤方法，从金属，陶瓷和塑料基材中清除糊状残余物。

    Lapping and polishing fixture having flexible sides
    6.
    发明授权
    Lapping and polishing fixture having flexible sides 失效
    具有柔性边的研磨和抛光夹具

    公开(公告)号：US06442825B1

    公开(公告)日：2002-09-03

    申请号：US09457730

    申请日：1999-12-10

    申请人： Glenn A. Pomerantz

    发明人： Glenn A. Pomerantz

    IPC分类号： B23P1304

    CPC分类号： B24B37/08 ,  B24B37/30 ,  B24B41/06 ,  Y10T29/49996 ,  Y10T29/49998

    摘要： A fixture for holding a workpiece in a machining apparatus comprises at least one opening having at least one flexible side for elastically holding the workpiece and a slot adjacent each of the at least one side for allowing the side to flex.

    摘要翻译： 用于在加工装置中保持工件的夹具包括至少一个具有至少一个柔性侧的开口，用于弹性地保持工件，并且与所述至少一个侧面中的每一个相邻的狭槽以允许侧面弯曲。

    Aqueous cleaning of paste residue
    7.
    发明授权
    Aqueous cleaning of paste residue 失效
    糊状残留物的水性清洗

    公开(公告)号：US06277799B1

    公开(公告)日：2001-08-21

    申请号：US09344886

    申请日：1999-06-25

    申请人： Krishna G. Sachdev ,  James N. Humenik ,  John U. Knickerbocker ,  Glenn A. Pomerantz

    发明人： Krishna G. Sachdev ,  James N. Humenik ,  John U. Knickerbocker ,  Glenn A. Pomerantz

    IPC分类号： C11D172

    CPC分类号： C11D11/0047 ,  C11D1/008 ,  C11D1/02 ,  C11D1/24 ,  C11D1/29 ,  C11D1/66 ,  C11D1/662 ,  C11D1/72 ,  C11D1/88 ,  C11D1/90 ,  C11D3/2086 ,  H05K3/1216 ,  H05K3/26

    摘要： This invention relates to an aqueous cleaning method for removal of metal-organic composite paste residue from the surface of components, such as, screening masks, associated paste screening equipment, substrates, to name a few. The invention is particularly concerned with aqueous alkaline cleaning solutions comprising alkali metal salt and/or quaternary ammonium salt of an organic acid preferably &agr;-hydroxy carboxylic acid in the presence of excess alkali and optionally a surface active agent for use in cleaning components, such as, screening masks, associated screening equipment, substrates, etc., which are used in the production of electronic components.

    摘要翻译： 本发明涉及从组分表面除去金属 - 有机复合糊状残留物的水性清洗方法，例如筛选掩模，相关的糊状物筛选设备，底物等等。 本发明特别涉及含有碱金属盐和/或季铵盐的含水碱性清洗溶液，所述碱性金属盐和/或有机酸优选为α-羟基羧酸的季铵盐，所述碱性金属盐和/或季铵盐在过量碱和任选的表面活性剂存在下用于清洁组分，例如 ，筛选掩模，相关筛选设备，基材等，用于生产电子元件。

    Method to recover underfilled modules by selective removal of discrete components
    10.
    发明授权
    Method to recover underfilled modules by selective removal of discrete components 失效
    通过选择性去除分立元件来回收未充足模块的方法

    公开(公告)号：US07781232B2

    公开(公告)日：2010-08-24

    申请号：US12015754

    申请日：2008-01-17

    申请人： Charles L. Arvin ,  Benjamin V. Fasano ,  Mario J. Interrante ,  Glenn A. Pomerantz

    发明人： Charles L. Arvin ,  Benjamin V. Fasano ,  Mario J. Interrante ,  Glenn A. Pomerantz

    IPC分类号： H01L21/48 ,  H01L21/00

    CPC分类号： H05K3/3436 ,  H01L21/56 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/09701 ,  H05K3/225 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00

    摘要： Methods and reworked intermediate and resultant electronic modules made thereby, whereby a component in need of rework is located and removed from the module to reveal encapsulated solder connections residing within an underfill matrix. Heights of both the solder connections and underfill matrix are reduced, followed by etching the solder out of the solder connections to form openings within the underfill matrix. The underfill material is then removed to expose metallurgy of the substrate. A blank having a release layer with an array of solder connections is aligned with the exposed metallurgy, and this solder array is transferred from the blank onto the metallurgy. The transferred solder connections are then flattened using heat and pressure, followed by attaching solder connections of a new component to the flattened solder connections and underfilling these reworked solder connections residing between the new chip and substrate.

    摘要翻译： 由此制造的方法和返工的中间和合成的电子模块，由此将需要返工的部件放置并从模块移除，以露出位于底部填充基质内的封装的焊料连接。 焊接连接和底部填充基体的高度减小，随后将焊料从焊料连接处蚀刻出来，以在底部填充基体内形成开口。 然后除去底部填充材料以暴露基底的冶金。 具有具有焊接连接阵列的释放层的坯料与暴露的冶金学对准，并且该焊料阵列从坯料转移到冶金上。 然后，使用热和压力将转移的焊接连接件平坦化，然后将新部件的焊接连接件连接到扁平焊接连接，并对位于新芯片和基板之间的这些返工焊接点进行底部填充。