Reduced Process Sensitivity of Electrode-Semiconductor Rectifiers
    1.
    发明申请
    Reduced Process Sensitivity of Electrode-Semiconductor Rectifiers 有权
    电极半导体整流器的工艺灵敏度降低

    公开(公告)号:US20100314707A1

    公开(公告)日:2010-12-16

    申请号:US12484096

    申请日:2009-06-12

    摘要: Disclosed are semiconductor devices and methods of making semiconductor devices. An exemplary embodiment comprises a semiconductor layer of a first conductivity type having a first surface, a second surface, and a graded net doping concentration of the first conductivity type within a portion of the semiconductor layer. The graded portion is located adjacent to the top surface of the semiconductor layer, and the graded net doping concentration therein decreasing in value with distance from the top surface of the semiconductor layer. The exemplary device also comprises an electrode disposed at the first surface of the semiconductor layer and adjacent to the graded portion.

    摘要翻译: 公开了制造半导体器件的半导体器件和方法。 示例性实施例包括第一导电类型的半导体层,其具有在半导体层的一部分内的第一导电类型的第一表面,第二表面和等级净掺杂浓度。 分级部分位于与半导体层的顶表面相邻的位置,并且其中的渐变网络掺杂浓度随距离半导体层的顶表面的距离而减小。 示例性器件还包括设置在半导体层的第一表面并且与渐变部分相邻的电极。

    Reduced process sensitivity of electrode-semiconductor rectifiers
    2.
    发明授权
    Reduced process sensitivity of electrode-semiconductor rectifiers 有权
    降低电极半导体整流器的工艺灵敏度

    公开(公告)号:US08492837B2

    公开(公告)日:2013-07-23

    申请号:US13283496

    申请日:2011-10-27

    IPC分类号: H01L29/872

    摘要: Disclosed are semiconductor devices and methods of making semiconductor devices. An exemplary embodiment comprises a semiconductor layer of a first conductivity type having a first surface, a second surface, and a graded net doping concentration of the first conductivity type within a portion of the semiconductor layer. The graded portion is located adjacent to the top surface of the semiconductor layer, and the graded net doping concentration therein decreasing in value with distance from the top surface of the semiconductor layer. The exemplary device also comprises an electrode disposed at the first surface of the semiconductor layer and adjacent to the graded portion.

    摘要翻译: 公开了制造半导体器件的半导体器件和方法。 示例性实施例包括第一导电类型的半导体层,其具有在半导体层的一部分内的第一导电类型的第一表面,第二表面和渐变网掺杂浓度。 分级部分位于与半导体层的顶表面相邻的位置,并且其中的渐变网络掺杂浓度随距离半导体层的顶表面的距离而减小。 示例性器件还包括设置在半导体层的第一表面并且与渐变部分相邻的电极。

    REDUCED PROCESS SENSITIVITY OF ELECTRODE-SEMICONDUCTOR RECTIFIERS
    3.
    发明申请
    REDUCED PROCESS SENSITIVITY OF ELECTRODE-SEMICONDUCTOR RECTIFIERS 有权
    电极半导体整流器的降低工艺灵敏度

    公开(公告)号:US20120037982A1

    公开(公告)日:2012-02-16

    申请号:US13283496

    申请日:2011-10-27

    IPC分类号: H01L29/78 H01L21/336

    摘要: Disclosed are semiconductor devices and methods of making semiconductor devices. An exemplary embodiment comprises a semiconductor layer of a first conductivity type having a first surface, a second surface, and a graded net doping concentration of the first conductivity type within a portion of the semiconductor layer. The graded portion is located adjacent to the top surface of the semiconductor layer, and the graded net doping concentration therein decreasing in value with distance from the top surface of the semiconductor layer. The exemplary device also comprises an electrode disposed at the first surface of the semiconductor layer and adjacent to the graded portion.

    摘要翻译: 公开了制造半导体器件的半导体器件和方法。 示例性实施例包括第一导电类型的半导体层,其具有在半导体层的一部分内的第一导电类型的第一表面,第二表面和等级净掺杂浓度。 分级部分位于与半导体层的顶表面相邻的位置,并且其中的渐变网络掺杂浓度随距离半导体层的顶表面的距离而减小。 示例性器件还包括设置在半导体层的第一表面并且与渐变部分相邻的电极。

    Reduced process sensitivity of electrode-semiconductor rectifiers
    4.
    发明授权
    Reduced process sensitivity of electrode-semiconductor rectifiers 有权
    降低电极半导体整流器的工艺灵敏度

    公开(公告)号:US08049276B2

    公开(公告)日:2011-11-01

    申请号:US12484096

    申请日:2009-06-12

    IPC分类号: H01L29/66

    摘要: Disclosed are semiconductor devices and methods of making semiconductor devices. An exemplary embodiment comprises a semiconductor layer of a first conductivity type having a first surface, a second surface, and a graded net doping concentration of the first conductivity type within a portion of the semiconductor layer. The graded portion is located adjacent to the top surface of the semiconductor layer, and the graded net doping concentration therein decreasing in value with distance from the top surface of the semiconductor layer. The exemplary device also comprises an electrode disposed at the first surface of the semiconductor layer and adjacent to the graded portion.

    摘要翻译: 公开了制造半导体器件的半导体器件和方法。 示例性实施例包括第一导电类型的半导体层,其具有在半导体层的一部分内的第一导电类型的第一表面,第二表面和等级净掺杂浓度。 分级部分位于与半导体层的顶表面相邻的位置,并且其中的渐变网络掺杂浓度随距离半导体层的顶表面的距离而减小。 示例性器件还包括设置在半导体层的第一表面并且与渐变部分相邻的电极。