EEPROM with reduced manufacturing complexity

    公开(公告)号:US06734491B1

    公开(公告)日:2004-05-11

    申请号:US10331705

    申请日:2002-12-30

    IPC分类号: H01L29788

    摘要: A semiconductor device (200) comprising a semiconductor substrate (210) having source and drain regions (530, 540) located in the semiconductor substrate (210) and having similar doping profiles, wherein a channel region (550) extends from the source region (530) to the drain region (540). The semiconductor device (200) also comprises a dielectric layer (230) located over the source and drain regions (530, 540), the dielectric layer (230) having first and second thicknesses (T1, T2) wherein the second thickness (T2) is substantially less than the first thickness (T1) and is partially located over the channel region (550). The semiconductor device (200) also comprises a gate (510) located over the dielectric layer (230) wherein the second thickness (T2) is located between an end (515) of the gate (510) and one of the source and drain regions (530, 540).

    Low cost fabrication method for high voltage, high drain current MOS transistor
    2.
    发明授权
    Low cost fabrication method for high voltage, high drain current MOS transistor 有权
    低成本高漏极电流MOS晶体管制造方法

    公开(公告)号:US06930005B2

    公开(公告)日:2005-08-16

    申请号:US10725642

    申请日:2003-12-02

    摘要: A method for reducing the drain resistance of a drain-extended MOS transistor in a semiconductor wafer, while maintaining a high transistor breakdown voltage. The method provides a first well (502) of a first conductivity type, operable as the extension of the transistor drain (501) of the first conductivity type; portions of the well are covered by a first insulator (503) having a first thickness. A second well (504) of the opposite conductivity type is intended to contain the transistor source (506) of the first conductivity type; portions of the second well are covered by a second insulator (507) thinner than the first insulator. The first and second wells form a junction (505) that terminates at the second insulator (530a, 530b). The method deposits a photoresist layer (510) over the wafer, which is patterned by opening a window (510a) that extends from the drain to the junction termination. Next, ions (540) of the first conductivity type are implanted through the window into the first well; these said ions have an energy to limit the penetration depth (541) to the first insulator thickness, and a dose to create a well region (560) of high doping concentration adjacent to the junction termination (530a).

    摘要翻译: 一种在保持高晶体管击穿电压的同时降低半导体晶片中的漏极扩展MOS晶体管的漏极电阻的方法。 该方法提供第一导电类型的第一阱(50​​2),其可操作为第一导电类型的晶体管漏极(501)的延伸; 阱的一部分被具有第一厚度的第一绝缘体(503)覆盖。 相反导电类型的第二阱(504)旨在包含第一导电类型的晶体管源(506); 第二阱的部分被比第一绝缘体薄的第二绝缘体(507)覆盖。 第一和第二阱形成终止于第二绝缘体(530a,530b)的结(505)。 该方法将光致抗蚀剂层(510)沉积在晶片之上,其通过打开从漏极延伸到结终端的窗口(510a)而被图案化。 接下来,通过窗口将第一导电类型的离子(540)注入到第一阱中; 这些所述离子具有将穿透深度(541)限制到第一绝缘体厚度的能量,以及用于产生邻近连接终端(530a)的高掺杂浓度的阱区(560)的剂量。

    MOS transistors having higher drain current without reduced breakdown voltage
    3.
    发明授权
    MOS transistors having higher drain current without reduced breakdown voltage 有权
    MOS晶体管具有较高的漏极电流,而不降低击穿电压

    公开(公告)号:US06873021B1

    公开(公告)日:2005-03-29

    申请号:US10725641

    申请日:2003-12-02

    摘要: A drain-extended MOS transistor in a semiconductor wafer (300) of a first conductivity type comprises a first well (315) of the first conductivity type, operable as the extension of the transistor drain (305) of the first conductivity type, and covered by a first insulator (312) having a first thickness, and further a second well (302) of the opposite conductivity type, intended to contain the transistor source (304) of the first conductivity type, and covered by a second insulator (311) thinner than said first insulator (312). First and second wells form a junction (330) that terminates (320, 321) at the second insulator. The first well has a region (360) in the proximity of the junction termination, which has a higher doping concentration than the remainder of the first well and extends not deeper than the first insulator thickness. Region (360) of higher doping concentration reduces the transistor drain resistance so that the drain current is increased to approximately twice the value it had without the higher doping concentration, while the transistor breakdown voltage remains determined by the (low) doping concentration of the remainder of first well (315).

    摘要翻译: 第一导电类型的半导体晶片(300)中的漏极扩展MOS晶体管包括第一导电类型的第一阱(315),可用作第一导电类型的晶体管漏极(305)的延伸部分,并且被覆盖 通过具有第一厚度的第一绝缘体(312)和另外具有相反导电类型的第二阱(302),用于容纳第一导电类型的晶体管源(304),并被第二绝缘体(311)覆盖, 比所述第一绝缘体(312)薄。 第一和第二阱形成在第二绝缘体处终止(320,321)的结(330)。 第一阱具有在接合端子附近的区域(360),其具有比第一阱的其余部分更高的掺杂浓度,并且延伸不比第一绝缘体厚度更深。 掺杂浓度较高的区域(360)降低了晶体管漏极电阻,使得漏极电流增加到其没有较高掺杂浓度的值的两倍,而晶体管击穿电压保持由其余部分的(低)掺杂浓度确定 的第一井(315)。

    System and method for forming a semiconductor with an analog capacitor using fewer structure steps
    4.
    发明申请
    System and method for forming a semiconductor with an analog capacitor using fewer structure steps 有权
    使用更少的结构步骤用模拟电容器形成半导体的系统和方法

    公开(公告)号:US20050221595A1

    公开(公告)日:2005-10-06

    申请号:US11145460

    申请日:2005-06-02

    CPC分类号: H01L29/66825 H01L21/28273

    摘要: A method for manufacturing a semiconductor device that comprises forming an oxide layer over a substrate. A polysilicon layer is disposed outwardly from the oxide layer, wherein the polysilicon layer forms a floating gate. A PSG layer is disposed outwardly from the polysilicon layer and planarized. The device is pattern etched to form a capacitor channel, wherein the capacitor channel is disposed substantially above the floating gate formed from the polysilicon layer. A dielectric layer is formed in the capacitor channel disposed outwardly from the polysilicon layer. A tungsten plug operable to substantially fill the capacitor channel is formed.

    摘要翻译: 一种制造半导体器件的方法,包括在衬底上形成氧化物层。 多晶硅层从氧化物层向外设置,其中多晶硅层形成浮栅。 PSG层从多晶硅层向外设置并平坦化。 该器件被图形蚀刻以形成电容器通道,其中电容器通道基本上设置在由多晶硅层形成的浮置栅极的上方。 在从多晶硅层向外设置的电容器通道中形成介电层。 形成可操作以充分充电电容器通道的钨插头。

    SEMANTIC SEARCH METHOD FOR A DISTRIBUTED DATA SYSTEM WITH NUMERICAL TIME SERIES DATA

    公开(公告)号:US20200334253A1

    公开(公告)日:2020-10-22

    申请号:US16765508

    申请日:2018-11-20

    摘要: Methods and systems are provided for searching time series information in a distributed data processing system. A method of processing a semantic search query comprises receiving a structured search query, processing the structured search query to deconstruct into query elements, identifying a set of connected elements based on the query elements, processing a time series data structure of the identified set of connected elements to determine a command data element, utilizing the command data element to process the time series data structure of the identified set of connected elements, annotating the time series data structure of each of the identified set of connected elements to form a queried data set, and providing the queried data set.

    Memory device with reduced cell size
    7.
    发明授权
    Memory device with reduced cell size 有权
    具有减小的单元大小的存储器件

    公开(公告)号:US06958269B2

    公开(公告)日:2005-10-25

    申请号:US10178100

    申请日:2002-06-24

    CPC分类号: H01L29/42324 H01L21/28273

    摘要: A method for manufacturing a memory device includes forming an oxide layer adjacent a substrate. A floating gate layer is formed and disposed outwardly from the oxide layer. A dielectric layer is formed, such that it is disposed outwardly from the floating gate layer. Then, a conductive material layer is formed and disposed outwardly from the dielectric layer, wherein the conductive material layer forms a control gate that is substantially isolated from the floating gate layer by the dielectric layer.

    摘要翻译: 一种用于制造存储器件的方法包括在衬底附近形成氧化物层。 形成浮栅,并从氧化物层向外设置。 形成介电层,使得其从浮栅层向外设置。 然后,形成导电材料层并从电介质层向外设置导电材料层,其中导电材料层形成通过介电层基本上与浮动栅极隔离的控制栅极。

    In-process electrical connector
    8.
    发明授权
    In-process electrical connector 有权
    在线电连接器

    公开(公告)号:US09054632B2

    公开(公告)日:2015-06-09

    申请号:US13198256

    申请日:2011-08-04

    IPC分类号: G01R31/26 H02S50/10 G01R1/073

    CPC分类号: H02S50/10 G01R1/07342

    摘要: Characteristics of partially assembled photovoltaic modules can be determined using electrical connection apparatuses and methods. By providing deformable electrical contacts against a partially assembled module on an assembly line, an electrical bias can be applied to the module before the module is completely assembled. An electrical connection apparatus for a photovoltaic module may include a first contact configured to engage a first lead on the photovoltaic module, a second contact configured to engage a second lead on the photovoltaic module, and an electrical power source configured to apply an electrical bias between the first contact and the second contact.

    摘要翻译: 可以使用电连接装置和方法来确定部分组装的光伏模块的特性。 通过向装配线上的部分组装的模块提供可变形的电触点,在模块完全组装之前,可以将电偏压施加到模块。 用于光伏模块的电连接装置可以包括被配置为接合光伏模块上的第一引线的第一触点,被配置为接合光伏模块上的第二引线的第二触点和被配置为在光伏模块之间施加电偏压的电源 第一次接触和第二次接触。

    GENERIC PACKET FILTERING
    9.
    发明申请
    GENERIC PACKET FILTERING 有权
    一般分组过滤

    公开(公告)号:US20120230235A1

    公开(公告)日:2012-09-13

    申请号:US13411146

    申请日:2012-03-02

    IPC分类号: H04W4/00

    CPC分类号: H04L69/22 H04L69/14 H04W28/06

    摘要: Embodiments contemplate one or more techniques for packet filtering. One or more embodiments may apply specific routing and/or forwarding rules on some or each packet when a device has one or more, or multiple, interfaces. Contemplated filtering techniques may be implemented in a module and/or without modifying an IP stack. The contemplated packet filtering techniques may apply to a terminal in uplink and/or downlink as well as to any network node. An incoming packet table may be created using 5-tuple, 6-tuple, and/or tags, among other mechanisms, to support incoming and/or outgoing packet filtering.

    摘要翻译: 实施例考虑了一种或多种用于分组过滤的技术。 一个或多个实施例可以在设备具有一个或多个或多个接口时在一些或每个分组上应用特定路由和/或转发规则。 考虑过滤技术可以在模块中实现和/或不修改IP堆栈。 预期的分组过滤技术可以应用于上行链路和/或下行链路中的终端以及任何网络节点。 可以使用5元组,6元组和/或标签以及其他机制来创建输入分组表,以支持传入和/或传出分组过滤。

    Zero Temperature Coefficient Capacitor
    10.
    发明申请
    Zero Temperature Coefficient Capacitor 有权
    零温度系数电容器

    公开(公告)号:US20120098045A1

    公开(公告)日:2012-04-26

    申请号:US13267674

    申请日:2011-10-06

    摘要: A zero temperature coefficient (ZTC) capacitor including a silicon dioxide dielectric layer with a phosphorus density between 1.7×1020 atoms/cm3 and 2.3×1020 atoms/cm3. An integrated circuit containing a ZTC capacitor including a silicon dioxide dielectric layer with a phosphorus density between 1.7×1020 atoms/cm3 and 2.3×1020 atoms/cm3. A process of forming an integrated circuit containing a ZTC capacitor including a silicon dioxide dielectric layer with a phosphorus density between 1.7×1020 atoms/cm3 and 2.3×1020 atoms/cm3.

    摘要翻译: 零温度系数(ZTC)电容器,其包括磷密度在1.7×1020原子/ cm3至2.3×1020原子/ cm3之间的二氧化硅介电层。 一种包含ZTC电容器的集成电路,其包括磷密度为1.7×1020原子/ cm3至2.3×1020原子/ cm3的二氧化硅电介质层。 形成包含Zinc电容器的集成电路的过程,该电容器包括磷密度为1.7×1020原子/ cm3至2.3×1020原子/ cm3的二氧化硅介电层。