Light-emitting diode
    1.
    发明授权
    Light-emitting diode 有权
    发光二极管

    公开(公告)号:US08421054B2

    公开(公告)日:2013-04-16

    申请号:US13351452

    申请日:2012-01-17

    IPC分类号: H01L29/04 H01L29/26

    摘要: A light-emitting diode element includes: an n-type conductive layer 2 being made of a gallium nitride-based compound, a principal surface being an m-plane; a semiconductor multilayer structure 21 provided on a first region 2a of the principal surface of the n-type conductive layer 2, the semiconductor multilayer structure 21 including a p-type conductive layer 4 and an active layer 3; a p-electrode 5 provided on the p-type conductive layer 4; a conductor portion 9 provided on a second region 2b of the principal surface of the n-type conductive layer 2, the conductor portion 9 being in contact with an inner wall of a through hole 8; and an n-type front surface electrode 6 provided on the second region 2b of the principal surface of the n-type conductive layer 2, the n-type front surface electrode 6 being in contact with the conductor portion 9.

    摘要翻译: 发光二极管元件包括:n型导电层2,其由氮化镓基化合物制成,主表面为m面; 设置在n型导电层2的主表面的第一区域2a上的半导体多层结构21,包括p型导电层4和活性层3的半导体多层结构21; 设置在p型导电层4上的p电极5; 设置在n型导电层2的主表面的第二区域2b上的导体部分9,导体部分9与通孔8的内壁接触; 以及设置在n型导电层2的主表面的第二区域2b上的n型正面电极6,n型正面电极6与导体部分9接触。

    LIGHT-EMITTING DIODE
    2.
    发明申请
    LIGHT-EMITTING DIODE 有权
    发光二极管

    公开(公告)号:US20120113656A1

    公开(公告)日:2012-05-10

    申请号:US13351452

    申请日:2012-01-17

    IPC分类号: F21V21/00 H01L33/38

    摘要: A light-emitting diode element includes: an n-type conductive layer 2 being made of a gallium nitride-based compound, a principal surface being an m-plane; a semiconductor multilayer structure 21 provided on a first region 2a of the principal surface of the n-type conductive layer 2, the semiconductor multilayer structure 21 including a p-type conductive layer 4 and an active layer 3; a p-electrode 5 provided on the p-type conductive layer 4; a conductor portion 9 provided on a second region 2b of the principal surface of the n-type conductive layer 2, the conductor portion 9 being in contact with an inner wall of a through hole 8; and an n-type front surface electrode 6 provided on the second region 2b of the principal surface of the n-type conductive layer 2, the n-type front surface electrode 6 being in contact with the conductor portion 9.

    摘要翻译: 发光二极管元件包括:n型导电层2,其由氮化镓基化合物制成,主表面为m面; 设置在n型导电层2的主表面的第一区域2a上的半导体多层结构21,包括p型导电层4和活性层3的半导体多层结构21; 设置在p型导电层4上的p电极5; 设置在n型导电层2的主表面的第二区域2b上的导体部分9,导体部分9与通孔8的内壁接触; 以及设置在n型导电层2的主表面的第二区域2b上的n型正面电极6,n型正面电极6与导体部分9接触。

    GALLIUM NITRIDE-BASED COMPOUND SEMICONDUCTOR LIGHT-EMITTING DIODE
    3.
    发明申请
    GALLIUM NITRIDE-BASED COMPOUND SEMICONDUCTOR LIGHT-EMITTING DIODE 审中-公开
    基于氮化镓的化合物半导体发光二极管

    公开(公告)号:US20120085986A1

    公开(公告)日:2012-04-12

    申请号:US13321923

    申请日:2010-06-09

    IPC分类号: H01L33/04

    摘要: The light-emitting diode element of this invention includes: an n-type GaN substrate (7), of which the principal surface (7a) is an m plane; and a multilayer structure on the principal surface (7a) of the substrate (7), which includes an n-type semiconductor layer (2), an active layer (3) on a first region (2a) of the upper surface of the n-type semiconductor layer (2), a p-type semiconductor layer (4), an anode electrode layer (5), and a cathode electrode layer (6) on a second region (2b) of the upper surface of the n-type semiconductor layer (2). These layers (2, 3, 4) have all been grown epitaxially through an m-plane growth. The n-type dopant concentration in the substrate (7) and n-type semiconductor layer (2) is 1×1018 cm−3 or less. When viewed perpendicularly to the principal surface (7a), a gap of 4 μm or less is left between the anode and cathode electrode layers (5, 6) and the anode electrode layer (5) is arranged at a distance of 45 μm or less from an edge of the cathode electrode layer (6) that faces the anode electrode layer (5).

    摘要翻译: 本发明的发光二极管元件包括:主面(7a)为m面的n型GaN衬底(7); 以及在基板(7)的主表面(7a)上的多层结构,其包括n型半导体层(2),在n的上表面的第一区域(2a)上的有源层(3) 型半导体层(2),p型半导体层(4),阳极电极层(5)以及在n型上表面的第二区域(2b)上的阴极电极层 半导体层(2)。 这些层(2,3,4)全部通过m平面生长而外延生长。 基板(7)和n型半导体层(2)中的n型掺杂剂浓度为1×1018cm -3以下。 当垂直于主表面(7a)观察时,在阳极和阴极电极层(5,6)之间留下4μm或更小的间隙,并且阳极电极层(5)被布置在45μm或更小的距离处 从所述阴极电极层(6)的与所述阳极电极层(5)相对的边缘。

    Nitride semiconductor light-emitting element and process for production thereof
    4.
    发明授权
    Nitride semiconductor light-emitting element and process for production thereof 有权
    氮化物半导体发光元件及其制造方法

    公开(公告)号:US08587022B2

    公开(公告)日:2013-11-19

    申请号:US13256061

    申请日:2010-12-27

    IPC分类号: H01L33/00

    摘要: A nitride-based semiconductor light-emitting device 31 includes: an n-type GaN substrate 1 which has an m-plane principal surface; a current diffusing layer 7 provided on the n-type GaN substrate 1; an n-type nitride semiconductor layer 2 provided on the current diffusing layer 7; an active layer 3 provided on the n-type nitride semiconductor layer 2; a p-type nitride semiconductor layer 4 provided on the active layer 3; a p-electrode 5 which is in contact with the p-type nitride semiconductor layer 4; and an n-electrode 6 which is in contact with the n-type GaN substrate 1 or the n-type nitride semiconductor layer 2. The donor impurity concentration of the n-type nitride semiconductor layer 2 is not more than 5×1018 cm−3, and the donor impurity concentration of the current diffusing layer 7 is ten or more times the donor impurity concentration of the n-type nitride semiconductor layer 2.

    摘要翻译: 氮化物系半导体发光元件31具备:具有m面主面的n型GaN衬底1, 设置在n型GaN衬底1上的电流扩散层7; 设置在电流扩散层7上的n型氮化物半导体层2; 设置在n型氮化物半导体层2上的有源层3; 设置在有源层3上的p型氮化物半导体层4; 与p型氮化物半导体层4接触的p电极5; 以及与n型GaN衬底1或n型氮化物半导体层2接触的n电极6.n型氮化物半导体层2的施主杂质浓度不大于5×1018cm- 3,电流扩散层7的施主杂质浓度为n型氮化物半导体层2的施主杂质浓度的十倍以上。

    NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREFOR
    5.
    发明申请
    NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND MANUFACTURING METHOD THEREFOR 有权
    氮化物半导体发光元件及其制造方法

    公开(公告)号:US20130214288A1

    公开(公告)日:2013-08-22

    申请号:US13880027

    申请日:2012-05-02

    IPC分类号: H01L33/32

    CPC分类号: H01L33/32 H01L33/02 H01L33/16

    摘要: A nitride-based semiconductor light-emitting device of an embodiment includes a semiconductor multilayer structure having a growing plane which is an m-plane and being made of a GaN-based semiconductor. The semiconductor multilayer structure includes a n-type semiconductor layer, a p-type semiconductor layer, a p-side electrode provided on the p-type semiconductor layer, and an active layer interposed between the n-type semiconductor layer and the p-type semiconductor layer. The ratio of the thickness of the active layer to the thickness of the n-type semiconductor layer, D, is in the range of 1.8×10−4≦D≦14.1×10−4. The area of the p-side electrode, S, is in the range of 1×102 μm2≦S≦9×104 μm2. A maximum current density which leads to 88% of a maximum of the external quantum efficiency is not less than 2 A/mm2.

    摘要翻译: 实施方式的氮化物系半导体发光元件具有半导体层叠结构,该半导体层叠结构具有作为m面的生长面并由GaN系半导体构成。 半导体多层结构包括n型半导体层,p型半导体层,设置在p型半导体层上的p侧电极以及介于n型半导体层和p型半导体层之间的有源层 半导体层。 有源层的厚度与n型半导体层的厚度D之比在1.8×10 -4 @ D @ 14.1×10 -4的范围内。 p侧电极S的面积在1×102mum2 @ S @ 9×104mum2的范围内。 导致外部量子效率最大值的88%的最大电流密度不小于2A / mm2。

    Nitride semiconductor light-emitting element and manufacturing method therefor
    6.
    发明授权
    Nitride semiconductor light-emitting element and manufacturing method therefor 有权
    氮化物半导体发光元件及其制造方法

    公开(公告)号:US08823026B2

    公开(公告)日:2014-09-02

    申请号:US13880027

    申请日:2012-05-02

    CPC分类号: H01L33/32 H01L33/02 H01L33/16

    摘要: A nitride-based semiconductor light-emitting device of an embodiment includes a semiconductor multilayer structure having a growing plane which is an m-plane and being made of a GaN-based semiconductor. The semiconductor multilayer structure includes a n-type semiconductor layer, a p-type semiconductor layer, a p-side electrode provided on the p-type semiconductor layer, and an active layer interposed between the n-type semiconductor layer and the p-type semiconductor layer. The ratio of the thickness of the active layer to the thickness of the n-type semiconductor layer, D, is in the range of 1.8×10−4≦D≦14.1×10−4. The area of the p-side electrode, S, is in the range of 1×102 μm2≦S≦9×104 μm2. A maximum current density which leads to 88% of a maximum of the external quantum efficiency is not less than 2 A/mm2.

    摘要翻译: 实施方式的氮化物系半导体发光元件具有半导体层叠结构,该半导体层叠结构具有作为m面的生长面并由GaN系半导体构成。 半导体多层结构包括n型半导体层,p型半导体层,设置在p型半导体层上的p侧电极以及介于n型半导体层和p型半导体层之间的有源层 半导体层。 有源层的厚度与n型半导体层的厚度D的比值在1.8×10-4< 1lE; D≦̸ 14.1×10-4的范围内。 p侧电极S的面积在1×102μm2& NlE; S&NlE; 9×104μm2的范围内。 导致外部量子效率最大值的88%的最大电流密度不小于2A / mm2。

    NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND PROCESS FOR PRODUCTION THEREOF
    7.
    发明申请
    NITRIDE SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND PROCESS FOR PRODUCTION THEREOF 有权
    氮化物半导体发光元件及其生产工艺

    公开(公告)号:US20120001223A1

    公开(公告)日:2012-01-05

    申请号:US13256061

    申请日:2010-12-27

    IPC分类号: H01L33/32

    摘要: A nitride-based semiconductor light-emitting device 31 includes: an n-type GaN substrate 1 which has an m-plane principal surface; a current diffusing layer 7 provided on the n-type GaN substrate 1; an n-type nitride semiconductor layer 2 provided on the current diffusing layer 7; an active layer 3 provided on the n-type nitride semiconductor layer 2; a p-type nitride semiconductor layer 4 provided on the active layer 3; a p-electrode 5 which is in contact with the p-type nitride semiconductor layer 4; and an n-electrode 6 which is in contact with the n-type GaN substrate 1 or the n-type nitride semiconductor layer 2. The donor impurity concentration of the n-type nitride semiconductor layer 2 is not more than 5×1018 cm−3, and the donor impurity concentration of the current diffusing layer 7 is ten or more times the donor impurity concentration of the n-type nitride semiconductor layer 2.

    摘要翻译: 氮化物系半导体发光元件31具备:具有m面主面的n型GaN衬底1, 设置在n型GaN衬底1上的电流扩散层7; 设置在电流扩散层7上的n型氮化物半导体层2; 设置在n型氮化物半导体层2上的有源层3; 设置在有源层3上的p型氮化物半导体层4; 与p型氮化物半导体层4接触的p电极5; 以及与n型GaN衬底1或n型氮化物半导体层2接触的n电极6.n型氮化物半导体层2的施主杂质浓度不大于5×1018cm- 3,电流扩散层7的施主杂质浓度为n型氮化物半导体层2的施主杂质浓度的十倍以上。

    Nitride semiconductor element and manufacturing method therefor
    9.
    发明授权
    Nitride semiconductor element and manufacturing method therefor 有权
    氮化物半导体元件及其制造方法

    公开(公告)号:US08729587B2

    公开(公告)日:2014-05-20

    申请号:US13596849

    申请日:2012-08-28

    IPC分类号: H01L33/30 H01L33/50

    摘要: An exemplary nitride-based semiconductor device includes: a nitride-based semiconductor multilayer structure 20 which has a p-type GaN-based semiconductor region whose surface 12 is inclined from the m-plane by an angle of not less than 1° and not more than 5° or the principal surface has a plurality of m-plane steps; and an electrode 30 that is arranged on the p-type GaN-based semiconductor region. The electrode 30 includes a Mg alloy layer 32 which is formed from Mg and metal selected from a group consisting of Pt, Mo, and Pd. The Mg alloy layer 32 is in contact with the surface 12 of the p-type GaN-based semiconductor region of the semiconductor multilayer structure 20.

    摘要翻译: 示例性的基于氮化物的半导体器件包括:氮化物基半导体多层结构20,其具有p型GaN基半导体区域,其表面12从m面倾斜不小于1°的角度,而不是更多 超过5°或主表面具有多个m平面步骤; 以及布置在p型GaN基半导体区域上的电极30。 电极30包括由Mg和选自Pt,Mo和Pd的金属形成的Mg合金层32。 Mg合金层32与半导体多层结构体20的p型GaN类半导体区域的表面12接触。

    Method for fabricating nitride-based semiconductor device having electrode on m-plane
    10.
    发明授权
    Method for fabricating nitride-based semiconductor device having electrode on m-plane 有权
    一种在m面上具有电极的氮化物基半导体器件的制造方法

    公开(公告)号:US08334199B2

    公开(公告)日:2012-12-18

    申请号:US12937758

    申请日:2010-03-17

    IPC分类号: H01L21/3205

    摘要: A nitride-based semiconductor light-emitting device 100 includes: a GaN substrate 10 with an m-plane surface 12; a semiconductor multilayer structure 20 provided on the m-plane surface 12 of the GaN substrate 10; and an electrode 30 provided on the semiconductor multilayer structure 20. The electrode 30 includes a Zn layer 32 and an Ag layer 34 provided on the Zn layer 32. The Zn layer 32 is in contact with a surface of a p-type semiconductor region of the semiconductor multilayer structure 20.

    摘要翻译: 氮化物系半导体发光装置100具备:具有m面面12的GaN衬底10; 设置在GaN衬底10的m面表面12上的半导体多层结构20; 以及设置在半导体多层结构体20上的电极30.电极30包括Zn层32和设置在Zn层32上的Ag层34.Zn层32与p型半导体区域的表面接触 半导体多层结构20。