Substrate covered with an intermediate coating and a hard carbon coating
    1.
    发明授权
    Substrate covered with an intermediate coating and a hard carbon coating 有权
    基材覆盖有中间涂层和硬碳涂层

    公开(公告)号:US07927700B2

    公开(公告)日:2011-04-19

    申请号:US10565265

    申请日:2004-07-01

    IPC分类号: B32B9/00

    摘要: The invention relates to a substrate covered at least partially with a layered coating. The layered coating comprises an intermediate coating and a hard carbon coating. The intermediate coating comprises a first metal layer deposited on the substrate, the first metal layer comprising at least one element of group IVB, group VB or group VIB; a nitride layer deposited on the first metal layer, the nitride layer comprising at least one nitride of an element of group IVB, group VB or group VIB; a second metal layer deposited on the nitride layer, the second metal layer comprising at least one element of group IVB, group VB or group VIB; a transition layer deposited on the second metal layer, the transition layer comprising at least one carbide of an element of group IVB, group VB or group VIB.

    摘要翻译: 本发明涉及至少部分地覆盖有层状涂层的基底。 分层涂层包括中间涂层和硬碳涂层。 中间涂层包括沉积在基底上的第一金属层,第一金属层包含IVB族,VB族或VIB族的至少一种元素; 沉积在第一金属层上的氮化物层,所述氮化物层包含至少一种IVB族,VB族或VIB族元素的氮化物; 沉积在氮化物层上的第二金属层,第二金属层包含IVB族,VB族或VIB族的至少一种元素; 沉积在第二金属层上的过渡层,所述过渡层包含至少一种第IVB族,VB族或VIB族元素的碳化物。

    Substrate covered with an intermediate coating and a hard carbon coating
    2.
    发明申请
    Substrate covered with an intermediate coating and a hard carbon coating 有权
    基材覆盖有中间涂层和硬碳涂层

    公开(公告)号:US20060182895A1

    公开(公告)日:2006-08-17

    申请号:US10565265

    申请日:2004-07-01

    IPC分类号: C23C16/24

    摘要: The invention relates to a substrate covered at least partially with a layered coating. The layered coating comprises an intermediate coating and a hard carbon coating. The intermediate coating comprises a first metal layer deposited on the substrate, the first metal layer comprising at least one element of group IVB, group VB or group VIB; a nitride layer deposited on the first metal layer, the nitride layer comprising at least one nitride of an element of group IVB, group VB or group VIB; a second metal layer deposited on the nitride layer, the second metal layer comprising at least one element of group IVB, group VB or group VIB; a transition layer deposited on the second metal layer, the transition layer comprising at least one carbide of an element of group IVB, group VB or group VIB.

    摘要翻译: 本发明涉及至少部分地覆盖有层状涂层的基底。 分层涂层包括中间涂层和硬碳涂层。 中间涂层包括沉积在基底上的第一金属层,第一金属层包含IVB族,VB族或VIB族的至少一种元素; 沉积在第一金属层上的氮化物层,所述氮化物层包含至少一种IVB族,VB族或VIB族元素的氮化物; 沉积在氮化物层上的第二金属层,第二金属层包含IVB族,VB族或VIB族的至少一种元素; 沉积在第二金属层上的过渡层,所述过渡层包含至少一种第IVB族,VB族或VIB族元素的碳化物。

    Sputtering apparatus
    4.
    发明授权
    Sputtering apparatus 有权
    溅射装置

    公开(公告)号:US09082595B2

    公开(公告)日:2015-07-14

    申请号:US12293891

    申请日:2007-03-14

    摘要: A coating apparatus is revealed that is designed to coat substrates by means of a physical vacuum deposition process or a chemical vacuum deposition process or a combination thereof. Said coating apparatus is particular in that it uses a rotatable magnetron (14) that is coverable with an axially moveable shutter (18). Such an arrangement enables to keep the magnetron target clean or to clean the target in between or even during subsequent coating steps. The shutter further provides for a controllable gas atmosphere in the vicinity of the target. The arrangement wherein the magnetron is centrally placed is described. Substrates are then exposed to the sputtering source from all angles by hanging them on a planetary carousel (24) that turns around the magnetron.

    摘要翻译: 揭示了一种涂布设备,其被设计成通过物理真空沉积工艺或化学真空沉积工艺或其组合来涂覆基底。 所述涂覆装置的特征在于它使用可旋转的磁控管(14),该磁控管可利用轴向可移动的挡板(18)覆盖。 这种布置使得能够在磁控管目标之间或在随后的涂覆步骤之间或之后保持目标清洁或清洁目标。 闸门还提供了目标附近的可控气体气氛。 描述了磁控管中心放置的布置。 然后通过将衬底悬挂在围绕磁控管的行星转盘(24)上将衬底从各个角度暴露于溅射源。

    COATING APPARATUS
    5.
    发明申请
    COATING APPARATUS 失效
    涂装装置

    公开(公告)号:US20090130336A1

    公开(公告)日:2009-05-21

    申请号:US12293880

    申请日:2007-03-14

    IPC分类号: C23C14/22 C23C14/56 C23C14/34

    摘要: A coating apparatus (100) for batch coating of substrates is presented. In the batch coater layers of a stack can be deposited by means of physical vapour deposition, by means of chemical vapour deposition or by a mixture of both processes. When compared to previous apparatus, the mixed mode process is particularly stable. This is achieved by using a rotatable magnetron (112) rather than the prior-art planar magnetrons. The apparatus is further equipped with a rotatable shutter that allows for concurrent or alternating process steps.

    摘要翻译: 提出了一种用于批量涂布基材的涂布设备(100)。 在叠层的分批涂布机层中,可以通过物理气相沉积,通过化学气相沉积或两种方法的混合物沉积。 与以前的装置相比,混合模式工艺特别稳定。 这通过使用可旋转磁控管(112)而不是现有技术的平面磁控管来实现。 该装置还配备有允许并行或交替的处理步骤的可旋转快门。

    Coating apparatus
    6.
    发明授权
    Coating apparatus 失效
    涂装设备

    公开(公告)号:US08192597B2

    公开(公告)日:2012-06-05

    申请号:US12293880

    申请日:2007-03-14

    IPC分类号: C23C14/35

    摘要: A coating apparatus (100) for batch coating of substrates is presented. In the batch coater layers of a stack can be deposited by means of physical vapor deposition, by means of chemical vapor deposition or by a mixture of both processes. When compared to previous apparatus, the mixed mode process is particularly stable. This is achieved by using a rotatable magnetron (112) rather than the prior-art planar magnetrons. The apparatus is further equipped with a rotatable shutter that allows for concurrent or alternating process steps.

    摘要翻译: 提出了一种用于批量涂布基材的涂布设备(100)。 在叠层的分批涂布机层中,可以通过物理气相沉积,通过化学气相沉积或两种方法的混合物沉积。 与以前的装置相比,混合模式工艺特别稳定。 这通过使用可旋转磁控管(112)而不是现有技术的平面磁控管来实现。 该装置还配备有允许并行或交替的处理步骤的可旋转快门。

    SPUTTERING APPARATUS
    7.
    发明申请
    SPUTTERING APPARATUS 有权
    溅射装置

    公开(公告)号:US20090114529A1

    公开(公告)日:2009-05-07

    申请号:US12293891

    申请日:2007-03-14

    IPC分类号: C23C14/34

    摘要: A coating apparatus is revealed that is designed to coat substrates by means of a physical vacuum deposition process or a chemical vacuum deposition process or a combination thereof. Said coating apparatus is particular in that it uses a rotatable magnetron (14) that is coverable with an axially moveable shutter (18). Such an arrangement enables to keep the magnetron target clean or to clean the target in between or even during subsequent coating steps. The shutter further provides for a controllable gas atmosphere in the vicinity of the target. The arrangement wherein the magnetron is centrally placed is described. Substrates are then exposed to the sputtering source from all angles by hanging them on a planetary carousel (24) that turns around the magnetron.

    摘要翻译: 揭示了一种涂布设备,其被设计成通过物理真空沉积工艺或化学真空沉积工艺或其组合来涂覆基底。 所述涂覆装置的特征在于它使用可旋转的磁控管(14),该磁控管可利用轴向可移动的挡板(18)覆盖。 这种布置使得能够在磁控管目标之间或在随后的涂覆步骤之间或之后保持目标清洁或清洁目标。 闸门还提供了目标附近的可控气体气氛。 描述了磁控管中心放置的布置。 然后通过将衬底悬挂在围绕磁控管的行星转盘(24)上将衬底从各个角度暴露于溅射源。

    Soft sputtering magnetron system
    8.
    发明授权
    Soft sputtering magnetron system 有权
    软溅射磁控管系统

    公开(公告)号:US09394603B2

    公开(公告)日:2016-07-19

    申请号:US13885905

    申请日:2011-11-17

    IPC分类号: C23C14/34 C23C14/35 H01J37/34

    摘要: A sputtering method and apparatus having at least one set of dual rotatable cylindrical sputtering targets mounted in a vacuum chamber. Magnet assemblies in hollow target cylinders provide erosion zones running long the parallel sides of a racetrack that act as target flux sources towards a substrate. These parallel erosion zones have a highly concentrated plasma density for rapid sputtering of the target and any reactive material. Features include the angular distance between normals to adjacent parallel erosion zones, the angle greater than 45° subtended at the center of the cylindrical target, placement of the substrate with respect to the targets, and pointing angles (orientation or tilt) of the racetracks toward the substrate and/or each other. These parameters form a relatively wide and efficient constant flux deposition region at the substrate, and allows for high deposition rates at constant reactive gas partial pressures with substantially uniform film stoichiometry and thickness.

    摘要翻译: 一种溅射方法和装置,其具有安装在真空室中的至少一组双旋转圆柱形溅射靶。 空心目标圆柱体中的磁体组件提供腐蚀区域,该区域作为朝向基板的目标通量源的跑道的平行侧延伸。 这些平行侵蚀区域具有高浓度的等离子体密度,用于目标物和任何反应性材料的快速溅射。 特征包括法向与相邻平行侵蚀区域之间的角距离,在圆柱形目标的中心处对角度大于45°的角度,相对于目标物放置基板,以及将跑道的指向角度(取向或倾斜)朝向 基板和/或彼此。 这些参数在衬底上形成相对宽且有效的恒定焊剂沉积区域,并且在具有基本均匀的膜化学计量和厚度的恒定反应气体分压下允许高沉积速率。

    Process for the manufacturing of a sputter target
    9.
    发明授权
    Process for the manufacturing of a sputter target 有权
    制造溅射靶的工艺

    公开(公告)号:US07563488B2

    公开(公告)日:2009-07-21

    申请号:US10486650

    申请日:2002-07-10

    IPC分类号: C23C14/34 C23C16/00

    摘要: The invention relates to a process for manufacturing a sputter target. The process comprises the steps of—providing a target holder (12); —applying an intermediate layer (14) on said target holder; —applying a top layer (16) on top of said intermediate layer; said top layer comprising a material having a melting point which is substantially higher than the melting point of said target material; —heating the target holder coated with said intermediate layer and said top layer.

    摘要翻译: 本发明涉及溅射靶的制造方法。 该方法包括以下步骤:提供目标支架(12); 在所述目标支架上施加中间层(14); 在所述中间层的顶部上施加顶层(16); 所述顶层包含熔点远高于所述目标材料的熔点的材料; - 加热涂覆有所述中间层和所述顶层的靶架。

    End-Block for a Rotatable Target Sputtering Apparatus
    10.
    发明申请
    End-Block for a Rotatable Target Sputtering Apparatus 失效
    可转动靶溅射装置的端块

    公开(公告)号:US20080087541A1

    公开(公告)日:2008-04-17

    申请号:US11665563

    申请日:2005-10-11

    IPC分类号: H01J37/34

    CPC分类号: H01J37/3435 H01J37/3405

    摘要: An end-block for electrically energising a rotatable tubular target in a vacuum coating installation is disclosed. The end-block has a rotary electrical contact that reduces the joule heating effects when operating in alternating current mode. When compared to known end-blocks, this is achieved by increasing the number of contact areas between a contacting ring and a series of circumferentially mounted contacting shoes. Also the contact shoes are being pressed radially outwardly by means of resilient elements against the contacting ring.

    摘要翻译: 公开了一种用于对真空涂覆装置中的可旋转管状靶进行电激励的端块。 端块具有旋转电接触,可在交流模式下工作时减少焦耳加热效应。 当与已知的端块相比时,这通过增加接触环和一系列周向安装的接触鞋之间的接触面积的数量来实现。 此外,接触鞋被抵靠接触环的弹性元件径向向外挤压。