摘要:
The present invention provides a method of manufacturing an integrated circuit comprising the steps of: providing a semiconductor substrate, etching at least one trench into a surface of said semiconductor substrate, performing an ion implantation step, wherein a direction of said ion implantation step is parallel to a vertical centre line of said trench, and performing a single oxidation step to form a first oxide layer with a first layer thickness covering a bottom of said at least one trench and a second oxide layer with a second layer thickness covering the sidewalls of said at least one trench, wherein said first layer thickness differs from said second layer thickness.
摘要:
The present invention relates to a multiplexer/demultiplexer with a connection for inputting and/or outputting an optical signal which has signal components of different wavelengths, a carrier plate (8) with at least one wavelength-sensitive element (11), a focussing member (13) with at least two focussing elements (14, 14′) as well as a detector or signal-generator plate (1), on which at least two detectors (4) or signal generators are arranged. To achieve this, it is proposed according to the invention that the focussing member (13) has at least one fibre stop, preferably formed integrally with the focussing member for adjusting a waveguide, and is connected to the detector or signal-generator plate (1) or to the carrier plate (8) via an elastic connecting element (23).
摘要:
In one embodiment, a memory cell includes a bit line arranged in a semiconductor substrate and a bit line contact region arranged adjacent the bit line. A word line is arranged above the bit line contact region in a trench formed in the semiconductor substrate. A generally U-shaped insulating layer is arranged in a bottom region of the trench and separates the bit line and the bit line contact region from the word line.
摘要:
A memory cell array having a plurality of memory cells is disclosed. In one embodiment, each memory cell includes a storage capacitor and an access transistor, a plurality of bit lines orientated in a first direction, a plurality of word lines orientated in a second direction, the second direction being perpendicular to the first direction, a semiconductor substrate with a surface, a plurality of active areas being formed in the semiconductor substrate, each active area extending in the second direction, the access transistors being partially formed in the active areas and electrically coupling corresponding ones of the storage capacitors to corresponding bit lines, wherein a gate electrode of each of the access transistors is connected with a corresponding word line, a capacitor dielectric of the storage capacitor has a relative dielectric constant of more than 8, and the word lines are disposed above the bit lines.
摘要:
Memory cells having trench capacitors, the trench capacitor being at least partially filled with a material which could not withstand high-temperature processes used during the fabrication of a memory chip without impairment of its electrical parameters. What is essential to the invention is that the material of the trench capacitor is introduced into the trench after the high-temperature processes. The method according to the invention makes it possible to use dielectric layers having large dielectric constants and electrode layers made of metallic material. The electrical properties of the trench capacitor are thus improved in comparison with known trench capacitors.
摘要:
The invention relates to a support element (1), for mounting at least two wave-modifying elements, with support of services, arranged parallel to each other. According to the invention, support element for mounting at least two wave-modifying elements and corresponding production method maybe achieved, whereby the support surfaces each have at least one opening and the openings are connected to each other by means of at least one through drilling.
摘要:
A memory cell has a trench capacitor, in which the area required over a terminal area of the trench capacitor is advantageously reduced by the formation of a particularly thin insulation collar. The insulation collar is reduced to such an extent that although a lateral current is prevented, the formation of a parasitic field-effect transistor is permitted. In order that, however, overall no current flows via the parasitic field-effect transistor, a second parasitic field-effect transistor is disposed in a manner connected in series, but is not turned on. This is achieved by the formation of a thicker second insulation collar that isolates the filling of the trench capacitor from the surrounding substrate.
摘要:
In semiconductor memories, in particular DRAMs, the memory cells of which have vertical transistors at vertical lands formed from substrate material, gate electrodes are formed as spacers which run around the land. The gate electrodes of adjacent memory cells conventionally have to be retroactively connected to form word lines. It is known to fill spaces between adjacent lands with an oxide, with the result that the spacers are formed directly as word lines but only cover two side walls of a land. Two transistors which are connected in parallel are formed at these side walls instead of a single transistor, since the gate electrode does not run around the land. The invention proposes a method for fabricating a semiconductor memory in which all four side walls of a land are covered by the word lines and at the same time lands of adjacent memory cells are connected to one another by the word lines.
摘要:
An electrically conductive contact can be used to connect an integrated component to an interconnect. A sacrificial layer is deposited on a liner and planarized until a surface of the integrated component is uncovered. The sacrificial layer is patterned to define the later contacts. The layer is covered in a partial region above contact connection regions. An interlevel insulator is deposited and patterned, so that the sacrificial layer can then be stripped out from the partial region. After the removal of the liner, a conductive layer is deposited into the cavity formed as a result of the stripping-out process on the uncovered contact connection regions and optionally into trenches formed at the outset within the interlevel insulator.
摘要:
A mask is fabricated by applying a sacrificial layer on a semiconductor wafer. The sacrificial layer is then processed with the aid of a first and a second lithographic process sequence in order to pattern the sacrificial layer in a first and a second direction. A hard mask layer is subsequently applied in order to completely enclose the patterned sacrificial layer. Finally, the sacrificial layer is then removed from the hard mask layer.