公开(公告)号：US20080271851A1

公开(公告)日：2008-11-06

申请号：US12113537

申请日：2008-05-01

申请人： Ka Shing Kenny KWAN ,  Gang OU ,  Yong WANG ,  Man CHAN

发明人： Ka Shing Kenny KWAN ,  Gang OU ,  Yong WANG ,  Man CHAN

IPC分类号： B32B37/06 ,  B32B37/08

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L2224/48247 ,  H01L2224/7825 ,  H01L2224/78301 ,  H01L2224/789 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45099

摘要： A bonding apparatus is provided comprising a bonding stage for holding a bonding tool, an air distribution system mounted to the bonding stage and an air inlet attached to the air distribution system. The air distribution system is connected to the air inlet for receiving air from the air inlet, and is operative to pass the air over multiple surfaces of the bonding stage for the purpose of temperature control.

摘要翻译： 提供一种接合装置，包括用于保持接合工具的接合台，安装到接合台的空气分配系统和连接到空气分配系统的空气入口。 空气分配系统连接到空气入口，用于从进气口接收空气，并且为了温度控制目的而使空气在粘合台的多个表面上通过。

公开(公告)号：US20080073408A1

公开(公告)日：2008-03-27

申请号：US11534268

申请日：2006-09-22

申请人： Ka Shing Kenny KWAN ,  Chong Hao CHEN ,  Gang OU ,  Keng Yew James SONG

发明人： Ka Shing Kenny KWAN ,  Chong Hao CHEN ,  Gang OU ,  Keng Yew James SONG

IPC分类号： A47J36/02

CPC分类号： H01L24/85 ,  B23K20/004 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/48095 ,  H01L2224/48465 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A bonding apparatus is provided that comprises a bonding tool for bonding wire onto an electronic device secured by a clamping device. The clamping device is locatable at a first position to clamp the electronic device during bonding and a second position at a raised height to release the electronic device for indexing. A flame-off torch is locatable adjacent to the bonding tool and is operative to produce sparks to melt a tip of the wire for bonding. An actuator is further provided that is operative to lower the flame-off torch close to the electronic device during bonding and to raise the flame-off torch away from the electronic device during indexing so as to provide a height clearance between the flame-off torch and the clamping device at its second position.

摘要翻译： 提供一种接合装置，其包括用于将线接合到由夹紧装置固定的电子装置上的接合工具。 夹紧装置可定位在第一位置，以在接合期间夹紧电子装置，并且在升高高度处可定位第二位置以释放用于分度的电子装置。 灭火炬可邻近焊接工具定位，并且可操作地产生火花以熔化焊丝的末端以进行焊接。 还提供了致动器，其可操作以在接合期间将靠近电子设备的熄火炬降低，并且在分拣过程中将熄火炬从电子设备上提升，以便在熄火炬之间提供高度间隙 并且夹紧装置处于其第二位置。

公开(公告)号：US20080274325A1

公开(公告)日：2008-11-06

申请号：US12113499

申请日：2008-05-01

申请人： Ka Shing Kenny KWAN ,  Man CHAN

发明人： Ka Shing Kenny KWAN ,  Man CHAN

IPC分类号： B32B3/02

CPC分类号： H01L21/67138 ,  H01L24/48 ,  H01L2224/48 ,  H01L2224/78 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/3025 ,  Y10S228/904 ,  Y10T428/239 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A thermal insulation system is provided for a component of a bonding system, such as an optical system. The thermal insulation system comprises multiple insulation layers located between the component and a heat source. The multiple insulation layers comprise at least one layer of moving air injected into the layer and a cover layer enclosing the layer of moving air. The multiple insulation layers may further comprise a layer of static air.

摘要翻译： 为诸如光学系统的接合系统的部件提供了一种绝热系统。 隔热系统包括位于组件和热源之间的多个绝缘层。 多个绝缘层包括注入层中的至少一层移动空气和包围移动空气层的覆盖层。 多个绝缘层可以进一步包括静态空气层。

公开(公告)号：US20080121679A1

公开(公告)日：2008-05-29

申请号：US11563068

申请日：2006-11-24

申请人： Hing Leung Marchy LI ,  Boon June Edwin YEAP ,  Ka Shing Kenny KWAN ,  Man CHAN ,  Yam Mo WONG

发明人： Hing Leung Marchy LI ,  Boon June Edwin YEAP ,  Ka Shing Kenny KWAN ,  Man CHAN ,  Yam Mo WONG

IPC分类号： B23K20/12

CPC分类号： B06B3/00 ,  H01L24/78 ,  H01L2224/78 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2224/45099 ,  H01L2924/00

摘要： A transducer is provided that comprises a horn that is configured to transmit vibrations along its length during operation in the form of an oscillatory waveform, such oscillatory waveform having a plurality of vibration nodal points. An ultrasonic generator is coupled to one end of the horn and a bonding tool is coupled to an opposite end of the horn for performing bonding operations. A first flange structure is located along the length of the horn at a first vibration nodal point for mounting the transducer, and a second flange structure is located along the length of the horn at a second vibration nodal point for mounting the transducer, such that the second flange structure is separated from the first flange structure by a distance of at least two consecutive vibration nodal points.

摘要翻译： 提供了一种换能器，其包括喇叭，该喇叭被配置为以振荡波形的形式在其操作期间沿其长度传递振动，这种振荡波形具有多个振动节点。 超声波发生器耦合到喇叭的一端，并且接合工具耦合到喇叭的相对端，用于执行接合操作。 第一凸缘结构沿着喇叭的长度位于第一振动节点处，用于安装换能器，并且第二凸缘结构沿着喇叭的长度设置在第二振动节点处，用于安装换能器，使得 第二凸缘结构与第一凸缘结构隔开至少两个连续振动节点的距离。

公开(公告)号：US20080093004A1

公开(公告)日：2008-04-24

申请号：US11843012

申请日：2007-08-22

申请人： Yam Mo WONG ,  Keng Yew James SONG ,  Ka Shing Kenny KWAN

发明人： Yam Mo WONG ,  Keng Yew James SONG ,  Ka Shing Kenny KWAN

IPC分类号： H01B13/00 ,  B65C9/26

CPC分类号： B23K37/047 ,  B23K20/004 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/7865 ,  H01L2224/85121 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A large electronic device having a bonding area on one side that comprises first and second portions may be bonded by first locating the first portion but not the second portion of the electronic device for bonding by a bonding tool. After the first portion of the electronic device has been bonded, the electronic device is conveyed to a rotary platform that is rotatable along a substantially horizontal plane. The electronic device is rotated on the rotary platform to change the respective positions of the bonded first portion and unbonded second portion of the electronic device, before the electronic device is conveyed to the bonding tool such that the second portion of the electronic device is located for bonding by the bonding tool. The second portion of the electronic device may then be bonded.

摘要翻译： 具有包括第一和第二部分的一侧上具有接合区域的大型电子设备可以通过首先定位用于通过接合工具进行接合的电子设备的第一部分而不是第二部分来进行接合。 在电子设备的第一部分已经结合之后，电子设备被传送到可沿着基本上水平的平面旋转的旋转平台。 在电子设备被传送到接合工具之前，电子设备在旋转平台上旋转以改变接合的第一部分和未结合的电子设备的第二部分的位置，使得电子设备的第二部分位于 通过粘合工具进行粘合。 然后可以结合电子设备的第二部分。

公开(公告)号：US20120145770A1

公开(公告)日：2012-06-14

申请号：US12967243

申请日：2010-12-14

申请人： Keng Yew James SONG ,  Ka Shing Kenny KWAN ,  Boon June YEAP ,  Shi Jie CHEN ,  Sathish Kumar BALAKRISHNAN ,  Kumaresh GOVINDAN RADHAKRISHNAN

发明人： Keng Yew James SONG ,  Ka Shing Kenny KWAN ,  Boon June YEAP ,  Shi Jie CHEN ,  Sathish Kumar BALAKRISHNAN ,  Kumaresh GOVINDAN RADHAKRISHNAN

IPC分类号： B23K20/14

CPC分类号： B23K20/004 ,  H01L2224/78

摘要： A main body of an apparatus for delivering shielding gas during wire bonding of an electronic device has a through-hole in the main body which is sized for allowing a capillary tip of a bonding tool to be insertable through the main body when performing wire bonding. At least one gas outlet located on a bottom surface of the main body adjacent to the through-hole is operative to direct an inert gas in a direction towards the electronic device. At least one gas inlet in the main body is operative to supply the inert gas to the through-hole and to the gas outlet.

摘要翻译： 用于在电子装置的引线接合期间输送保护气体的装置的主体具有在主体中的通孔，该通孔的尺寸适于允许接合工具的毛细管尖端在进行引线接合时通过主体插入。 位于主体的与通孔相邻的底表面上的至少一个气体出口可操作以沿着朝向电子设备的方向引导惰性气体。 主体中的至少一个气体入口用于将惰性气体供应到通孔和气体出口。

公开(公告)号：US20080272178A1

公开(公告)日：2008-11-06

申请号：US11744492

申请日：2007-05-04

申请人： Ka Shing Kenny KWAN ,  Yue ZHANG ,  Yam Mo WONG

发明人： Ka Shing Kenny KWAN ,  Yue ZHANG ,  Yam Mo WONG

IPC分类号： B23K37/00

CPC分类号： B23K20/004 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/78302 ,  H01L2224/78631 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10S228/904 ,  H01L2224/48 ,  H01L2924/00

摘要： A wire tensioner is provided for a wire bonder, the wire tensioner comprising a tubular body having a bore through which bonding wire is receivable and a bore outlet at an end of the tubular body from which the bonding wire is extendable towards a bonding tool. A chamber is formed next to the bore outlet that substantially encloses the bore outlet, the chamber including an air inlet connected to it that is operative to introduce clean air into the chamber. A vacuum outlet is connected to a side of the tubular body and is in fluid communication with the chamber via the bore, the vacuum outlet being operative to draw air from the bore outlet through the bore whereby to pull the wire.

摘要翻译： 为引线接合器提供线张紧器，线张紧器包括管状体，其具有可接收接合线的孔，管状体的端部处的孔出口，接合线可以从该孔延伸到接合工具。 在孔出口旁边形成有一个大致封闭孔出口的腔室，该腔室包括连接到其上的空气入口，该进气口用于将清洁空气引入腔室。 真空出口连接到管状体的一侧并且经由孔与腔室流体连通，真空出口可操作以从孔出口通过孔抽出空气，从而拉动线。

公开(公告)号：US20080174132A1

公开(公告)日：2008-07-24

申请号：US11624865

申请日：2007-01-19

申请人： Ka Shing Kenny KWAN ,  Tingyu HE

发明人： Ka Shing Kenny KWAN ,  Tingyu HE

IPC分类号： B66C1/42

CPC分类号： B25B11/002 ,  B25B5/06 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78703 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2224/48 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2224/05599

摘要： A clamping mechanism having clamping jaws is provided for holding an object. The clamping mechanism comprises a solenoid pad connected to at least one of the clamping jaws which is operative to actuate movement of the clamping jaw, and a solenoid motor that is operative to attract the solenoid pad towards it when it is energized. Further, a voice coil motor is rigidly coupled to the solenoid pad to drive the solenoid pad in directions towards or away from the solenoid motor.

摘要翻译： 提供具有夹爪的夹持机构用于保持物体。 夹紧机构包括连接到至少一个夹钳的螺线管焊盘，其可操作以致动夹钳的运动;以及螺线管电动机，其可操作以在其被激励时向其吸引螺线管焊盘。 此外，音圈马达刚性地联接到螺线管焊盘，以在朝向或远离螺线管马达的方向上驱动螺线管焊盘。

公开(公告)号：US20080099531A1

公开(公告)日：2008-05-01

申请号：US11554108

申请日：2006-10-30

申请人： Yam Mo WONG ,  Ka Shing Kenny KWAN

发明人： Yam Mo WONG ,  Ka Shing Kenny KWAN

IPC分类号： B23K1/00 ,  B23K37/00

CPC分类号： B23K20/004 ,  B23K20/14 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/78703 ,  H01L2224/85045 ,  H01L2224/85075 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/3025 ,  H01L2224/48 ,  H01L2924/00

摘要： An apparatus is provided for supplying a shielding gas during the bonding of wires to electronic components with a bonding tool comprising a horn and a capillary. The apparatus comprises a main body with an elongated slot having a width that extends into the main body from a side of the main body generally in a first direction and the slot also extends from a top surface to a bottom surface of the main body in a second direction perpendicular to the first direction for the width of the slot. The slot is sized to receive a tip of the capillary which is operable to pass through the slot in the second direction. A gas outlet, which may be formed inside the slot, supplies shielding gas into the slot.

摘要翻译： 提供一种用于在使用包括喇叭和毛细管的接合工具将电线连接到电子部件期间提供保护气体的装置。 该装置包括具有细长狭槽的主体，该细长槽的宽度大致沿第一方向从主体的一侧延伸到主体中，并且槽也从主体的顶表面延伸到底表面 对于槽的宽度，垂直于第一方向的第二方向。 狭槽的尺寸被设计成接收毛细管的尖端，其可操作以沿着第二方向穿过狭槽。 可以形成在槽内的气体出口将保护气体供应到槽中。

公开(公告)号：US20110016707A1

公开(公告)日：2011-01-27

申请号：US12508780

申请日：2009-07-24

申请人： Keng Yew James SONG ,  Ka Shing Kenny KWAN ,  Choong Kead Leslie LUM ,  Ting Yu HE

发明人： Keng Yew James SONG ,  Ka Shing Kenny KWAN ,  Choong Kead Leslie LUM ,  Ting Yu HE

IPC分类号： H05K3/36

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/3011 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53183 ,  Y10T29/53261 ,  Y10T29/53265 ,  H01L2924/00 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756

摘要： A bonding apparatus for bonding electronic devices including substrates comprises first and second rails arranged adjacent to each other which are configured to align the substrates in vertical orientations during transportation along the rails. A bonding system is locatable over a first bonding site which is located along the first rail and a second bonding site which is located along the second rail. A first indexer is located adjacent to the first rail and a second indexer is located adjacent to the second rail wherein each indexer is independently operative to transport a substrate along one rail while a substrate held on the other rail is being bonded. A container located at one end of the rails for holding multiple unbonded substrates is operative to feed unbonded substrates directly to the rails.

摘要翻译： 用于接合包括基板的电子设备的接合装置包括彼此相邻布置的第一和第二轨道，所述第一和第二轨道被配置为在沿着轨道的运输期间沿垂直取向对齐基板。 接合系统可位于沿着第一轨道定位的第一接合位置和沿着第二轨道定位的第二接合位置。 第一分度器位于第一轨道附近并且第二分度器位于第二轨道附近，其中每个分度器独立地操作以沿着一个轨道输送基板，同时保持在另一个导轨上的基板被接合。 位于轨道一端的用于保持多个未粘结基底的容器可操作以将未粘合的基底直接供给到轨道。