IMPACT STRENGTH IMPROVING AGENT FOR EPOXY RESIN COMPOSITIONS
    1.
    发明申请
    IMPACT STRENGTH IMPROVING AGENT FOR EPOXY RESIN COMPOSITIONS 有权
    改善环氧树脂组合物的强度

    公开(公告)号:US20100280167A1

    公开(公告)日:2010-11-04

    申请号:US12743456

    申请日:2008-11-21

    IPC分类号: C08L63/00 C08L67/00

    CPC分类号: C08G59/4253

    摘要: The present invention relates to a butadiene/acrylonitrile copolymer CTBN, modified by epoxy solid resin and terminated by carboxyl groups, the terminal epoxy groups thereof also having optionally been reacted. A polymer of this type is used in particular as an impact strength improving agent in epoxy resin compositions and has proven to be particularly advantageous for gluing on or of metal surfaces. It results in a significant reduction of the infiltration with corrosion, which in turn ensures a long-lived adhesive bond.

    摘要翻译: 本发明涉及由环氧固体树脂改性并被羧基封端的丁二烯/丙烯腈共聚物CTBN,其末端环氧基也可任选地反应。 这种聚合物特别用作环氧树脂组合物中的冲击强度改进剂,已被证明是特别有利于胶合在金属表面上。 这导致了腐蚀性渗透的显着降低,这又确保了长久的粘合剂粘结。

    Heat-curable compositions comprising low-temperature impact strength modifiers
    6.
    发明申请
    Heat-curable compositions comprising low-temperature impact strength modifiers 有权
    包含低温冲击强度改性剂的可热固化组合物

    公开(公告)号:US20070066721A1

    公开(公告)日:2007-03-22

    申请号:US10564889

    申请日:2004-07-16

    摘要: The present invention relates to compositions which contain at least one epoxide adduct A having on average more than one epoxide group per molecule, at least one polymer B of the formula (I), at least one thixotropic agent C, based on a urea derivative in a nondiffusing carrier material, and at least one curing agent D for epoxy resins, which is activated by elevated temperature. This composition serves in particular as an adhesive and has an extremely high dynamic resistance to cleavage, in particular at low temperatures. The invention furthermore relates to impact strength modifiers terminated with epoxide groups and of the formula (I). It has been found that these novel impact strength modifiers result in a significant increase in impact strength in epoxy resin compositions, in particular in two-component epoxy resin compositions.

    摘要翻译: 本发明涉及含有至少一种每分子平均具有多于一个环氧基团的环氧化物加合物A的组合物,至少一种式(I)的聚合物B,至少一种触变剂C,基于脲衍生物 非扩散载体材料和至少一种用于环氧树脂的固化剂D,其由升高的温度活化。 该组合物特别用作粘合剂,并且具有极高的动态抗切割性,特别是在低温下。 本发明还涉及用环氧基团和式(I)封端的冲击强度改性剂。 已经发现,这些新的冲击强度改性剂导致环氧树脂组合物,特别是双组分环氧树脂组合物中冲击强度的显着增加。

    EPOXY GROUP-TERMINATED POLYMERS, THE COMPOSITIONS THEREOF AND THE USE THEREOF AS IMPACT RESISTANCE MODIFIERS
    7.
    发明申请
    EPOXY GROUP-TERMINATED POLYMERS, THE COMPOSITIONS THEREOF AND THE USE THEREOF AS IMPACT RESISTANCE MODIFIERS 有权
    环氧基封端聚合物,其组合物及其作为抗冲击改性剂的用途

    公开(公告)号:US20100087567A1

    公开(公告)日:2010-04-08

    申请号:US12450091

    申请日:2008-03-20

    IPC分类号: C08L63/00 C08G18/32

    摘要: The present invention relates to epoxy group-terminated polymers of the formula (I). Said epoxy group-terminated polymers are suited extremely well as impact resistance modifiers, particularly in epoxy resin compostions. They are particularly suited for use in heat-curing epoxy resin adhesives. It has been found that such epoxy resin compostions not only have excellent mechanical properties and high glass transition temperatures, but also above all improved impact resistance properties, both at room temperature and at low temperatures.

    摘要翻译: 本发明涉及式(I)的环氧基封端的聚合物。 所述环氧基封端的聚合物非常适合作为抗冲击改性剂,特别是在环氧树脂组合物中。 它们特别适用于热固化环氧树脂粘合剂。 已经发现,这样的环氧树脂组合物不仅在室温和低温下都具有优异的机械性能和高的玻璃化转变温度,而且还具有优异的耐冲击性能。

    Electrically conductive thermoplastic polymer formulations and the use
thereof
    9.
    发明授权
    Electrically conductive thermoplastic polymer formulations and the use thereof 失效
    导电热塑性聚合物配方及其用途

    公开(公告)号:US5482655A

    公开(公告)日:1996-01-09

    申请号:US075658

    申请日:1993-06-11

    摘要: A formulation comprisinga) at least one polythiophene in oxidised polycationic form and containing structural repeating units of formula I ##STR1## wherein R.sub.1 and R.sub.2 are each independently of the other linear or branched C.sub.1 -C.sub.18 alkyl or C.sub.2 -C.sub.18 alkoxyalkyl; or are C.sub.3 -C.sub.8 cycloalkyl, phenyl or benzyl which are unsubstituted or substituted by C.sub.1 -C.sub.6 alkyl, C.sub.1 -C.sub.6 alkoxy or halogen; or R.sub.1 and R.sub.2, taken together, are linear C.sub.1 -C.sub.8 alkylene which is unsubstituted or substituted by C.sub.1 -C.sub.6 alkyl, C.sub.1 -C.sub.6 alkoxy, halogen, C.sub.3 -C.sub.8 cycloalkyl, phenyl, benzyl, C.sub.1 -C.sub.4 alkylphenyl, C.sub.1 -C.sub.4 alkoxyphenyl, halophenyl, C.sub.1 -C.sub.4 alkylbenzyl, C.sub.1 -C.sub.4 alkoxybenzyl or halobenzyl; andb) at least one polyanion of a film-forming thermoplastic polymer containing sulfated alcohol groups ##STR2## and/or sulfonatoalkylated alcohol groups ##STR3## in structural repeating units, wherein the group --(C.sub.n H.sub.2n)-- is linear or branched C.sub.2 -C.sub.12 alkylene which contains 2 to 5 carbon atoms in the carbon chain and is unsubstituted or substituted by C.sub.1 -C.sub.4 alkoxy. The formulation is an intrinsically electrically conductive themoformable material.

    摘要翻译: 一种制剂,其包含a)至少一种氧化聚阳离子形式的聚噻吩,并含有另一个直链或支链C 1 -C 18烷基或C 2 -C 18烷氧基烷基的结构式I重复单元; 或未取代或被C 1 -C 6烷基,C 1 -C 6烷氧基或卤素取代的C 3 -C 8环烷基,苯基或苄基; 或者R 1和R 2一起是未被取代或被C 1 -C 6烷基,C 1 -C 6烷氧基,卤素,C 3 -C 8环烷基,苯基,苄基,C 1 -C 4烷基苯基,C 1 -C 4烷氧基苯基,卤代苯基,C 1 -C 4烷基苄基 ,C 1 -C 4烷氧基苄基或卤代苄基; 和b)在结构重复单元中含有硫酸化醇基团和/或磺化烷基化醇基团的成膜热塑性聚合物的至少一种聚阴离子,其中 - (C n H 2n) - 为直链或支链C 2 -C 12亚烷基 其在碳链中含有2至5个碳原子且未被取代或被C 1 -C 4烷氧基取代。 制剂是本征导电的可变形材料。