摘要:
A method for performing a liftoff operation involves printing a liftoff pattern using low-resolution patterning techniques to form fine feature patterns. The resulting feature size is defined by the spacing between printed patterns rather than the printed pattern size. By controlling the cross-sectional profile of the printed liftoff pattern, mask structures may be formed from the liftoff operation having beneficial etch-mask aperture profiles. For example, a multi-layer printed liftoff pattern can be used to create converging aperture profiles in a patterned layer. The patterned layer can then be used as an etch mask, where the converging aperture profiles result in desirable diverging etched features.
摘要:
A digital lithography system including a droplet source (printhead) for selectively ejecting liquid droplets of a phase-change masking material, and an imaging system for capturing (generating) image data representing printed features formed by the ejected liquid droplets. The system also includes a digital control system that detects defects in the printed features, for example, by comparing the image data with stored image data. The digital control system then modifies the printed feature to correct the defect, for example, by moving the printhead over the defect and causing the printhead to eject droplets onto the defect's location. In one embodiment, a single-printhead secondary printer operates in conjunction with a multi-printhead main printer to correct defects.
摘要:
A method of forming an integrated microelectronic device and a micro channel is provided. The method offers an inexpensive way of integrating devices that are usually incompatible during fabrication, a microchannel and a microelectronic structure such as an electro-optic light source, a detector or a MEMs device into a single integrated structure.
摘要:
A method and system for masking a surface to be etched is described. The method includes the operation of heating a phase-change masking material and using a droplet source to eject droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze after upon contact with the thin-film or substrate surface. The thin-film or substrate is then treated to alter the surface characteristics, typically by depositing a self assembled monolayer on the surface. After deposition, the masking material is removed. A material of interest is then deposited over the substrate such that the material adheres only to regions not originally covered by the mask such that the mask acts as a negative resist. Using such techniques, feature sizes of devices smaller than the smallest droplet printed may be fabricated.
摘要:
Printing systems are disclosed that produce homogenous, smooth edged printed patterns (such as integrated circuit (IC) patterns) by separating pattern layouts into discrete design layers having only parallel layout features, and by printing each design layer using individual print solution droplets deposited onto the substrate. A first alignment operation is performed to achieve a specified orientation between the printhead and a first set of alignment marks on the substrate using first image data generated by the imaging sensor of the camera before performing a first print operation, and a second alignment operation to orient the printhead relative to a second set of alignment marks is performed before a second print operation. A first pattern layout portion includes first layout elements aligned parallel to a first reference axis, and the first print operation is performed by making multiple printing passes in a print direction aligned with the first reference axis.
摘要:
A method and system for masking a surface to be etched is described. The method includes the operation of heating a phase-change masking material and using a droplet source to eject droplets of a masking material for deposit on a thin-film or other substrate surface to be etched. The temperature of the thin-film or substrate surface is controlled such that the droplets rapidly freeze after upon contact with the thin-film or substrate surface. The thin-film or substrate is then treated to alter the surface characteristics, typically by depositing a self assembled monolayer on the surface. After deposition, the masking material is removed. A material of interest is then deposited over the substrate such that the material adheres only to regions not originally covered by the mask such that the mask acts as a negative resist. Using such techniques, feature sizes of devices smaller than the smallest droplet printed may be fabricated.
摘要:
Printing systems are disclosed that produce homogenous, smooth edged printed patterns (such as integrated circuit (IC) patterns) by separating pattern layouts into discrete design layers having only parallel layout features, and by printing each design layer using individual print solution droplets deposited onto the substrate. A printhead alignment operation includes positioning the printhead and printing a spot onto the substrate from each ejector, determining a vertical offset between an expected location of each spot along a vertical axis and the actual location of the spot along the vertical axis, calculating a linear fit line for the vertical offset of each spot plotted against an expected location of the spot along a horizontal axis, calculating the slope of the linear fit line, and rotating the printhead relative to the substrate according to an angle defined by the slope of the linear fit line.
摘要:
Printing systems are disclosed that produce homogenous, smooth edged printed patterns (such as integrated circuit (IC) patterns) by separating pattern layouts into discrete design layers having only parallel layout features, and by printing each design layer using individual print solution droplets deposited onto the substrate. A printhead alignment operation includes printing a first spot from a first printhead ejector on a first substrate location, positioning a second ejector over the first substrate location and printing a second spot, measuring a distance between the first spot and the second spot, adjusting a rotational orientation between the print head and the substrate to reduce the distance between the first spot and the second spot, and then repeating the printing, measuring and adjusting processes until the first and second spots are separated by a predefined threshold value apart. The design layers are then printed.
摘要:
Printing systems are disclosed that produce homogenous, smooth edged printed patterns (such as integrated circuit (IC) patterns) by separating pattern layouts into discrete design layers having only parallel layout features, and by printing each design layer using individual print solution droplets deposited onto the substrate. A printhead alignment operation includes positioning the printhead and printing a spot onto the substrate from each ejector, determining a vertical offset between an expected location of each spot along a vertical axis and the actual location of the spot along the vertical axis, calculating a linear fit line for the vertical offset of each spot plotted against an expected location of the spot along a horizontal axis, calculating the slope of the linear fit line, and rotating the printhead relative to the substrate according to an angle defined by the slope of the linear fit line.
摘要:
Printing systems are disclosed that produce homogenous, smooth edged printed patterns (such as integrated circuit (IC) patterns) by separating pattern layouts into discrete design layers having only parallel layout features, and by printing each design layer using individual print solution droplets deposited onto the substrate. A printhead alignment operation includes printing a first spot from a first printhead ejector on a first substrate location, positioning a second ejector over the first substrate location and printing a second spot, measuring a distance between the first spot and the second spot, adjusting a rotational orientation between the print head and the substrate to reduce the distance between the first spot and the second spot, and then repeating the printing, measuring and adjusting processes until the first and second spots are separated by a predefined threshold value apart. The design layers are then printed.