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    METHOD FOR MANUFACTURING THIN SUBSTRATE USING A LAMINATE BODY
    5.
    发明申请
    METHOD FOR MANUFACTURING THIN SUBSTRATE USING A LAMINATE BODY 有权
    使用层压体制造薄基板的方法

    公开(公告)号：US20090115075A1

    公开(公告)日：2009-05-07

    申请号：US12336994

    申请日：2008-12-17

    申请人： Carl R. KESSEL ,  Larry D. Boardman ,  Richard J. Webb

    发明人： Carl R. KESSEL ,  Larry D. Boardman ,  Richard J. Webb

    IPC分类号： H01L21/302 ,  B32B9/04 ,  H01L23/28

    CPC分类号： B32B37/12 ,  B24B7/228 ,  B32B2310/0806 ,  B32B2457/14 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/68381 ,  H01L2221/68386 ,  Y10T428/31663

    摘要： Provided is a laminated body comprising a substrate to be ground and a support, where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a laminated body comprising a substrate to be ground, a curable silicone adhesive layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the adhesive layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

    摘要翻译： 提供了一种层叠体，其包括待研磨的基底和支撑体，其中基底可被研磨成非常小（薄）的厚度，然后可以与支撑体分离而不损坏基底。 一个实施方案是一种层压体，其包括待研磨的基材，与待研磨基材接触的可固化的硅氧烷粘合剂层，包含光吸收剂和可热分解树脂的光热转换层和透光载体。 在与粘合剂层接触的基板表面研磨后，通过透光层照射层叠体，分解光热转换层，分离基板和透光支撑体。

    Method of making light emitting device with silicon-containing encapsulant
    6.
    发明授权
    Method of making light emitting device with silicon-containing encapsulant 有权
    用含硅密封剂制造发光器件的方法

    公开(公告)号：US07427523B2

    公开(公告)日：2008-09-23

    申请号：US11383885

    申请日：2006-05-17

    申请人： Larry D. Boardman ,  D. Scott Thompson ,  Catherine A. Leatherdale

    发明人： Larry D. Boardman ,  D. Scott Thompson ,  Catherine A. Leatherdale

    IPC分类号： H01L21/00

    CPC分类号： H01L33/52 ,  H01L23/293 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A method of making a light emitting device is disclosed. The method includes providing a light emitting diode and forming an encapsulant in contact with the light emitting diode; wherein forming the encapsulant includes contacting the light emitting diode with a photopolymerizable composition comprising a silicon-containing resin, a metal-containing catalyst, and surface treated particles, the silicon-containing resin comprises silicon-bonded hydrogen and aliphatic unsaturation, the surface treated particles comprising nonabsorbing metal oxide particles, semiconductor particles, or combinations thereof, and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

    摘要翻译： 公开了一种制造发光器件的方法。 该方法包括提供发光二极管并形成与发光二极管接触的密封剂; 其中形成所述密封剂包括使所述发光二极管与包含含硅树脂，含金属的催化剂和表面处理的颗粒的光聚合组合物接触，所述含硅树脂包括与硅键合的氢和脂族不饱和键，所述表面处理颗粒 包括非吸收性金属氧化物颗粒，半导体颗粒或其组合，并且施加波长为700nm或更小的光化辐射以引发含硅树脂内的氢化硅烷化。