公开(公告)号：US09755120B2

公开(公告)日：2017-09-05

申请号：US13482676

申请日：2012-05-29

申请人： D. Scott Thompson ,  Fedja Kecman

发明人： D. Scott Thompson ,  Fedja Kecman

IPC分类号： H01L33/00 ,  H01L33/54 ,  H01L33/56

CPC分类号： H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting device comprises an LED die, a dome lens encapsulating the LED die, the dome lens having a first outer curved surface, and a photopolymerizable composition disposed on the dome lens. The photopolymerizable composition forms a meniscus lens defined by a second outer curved surface and an inner curved surface, the inner curved surface being in contact with only a portion of the first outer curved surface. The dome lens and the meniscus lens in combination form an elongated dome lens.

公开(公告)号：US09308680B2

公开(公告)日：2016-04-12

申请号：US12698251

申请日：2010-02-02

申请人： D. Scott Thompson ,  Larry D. Boardman ,  Catherine A. Leatherdale

发明人： D. Scott Thompson ,  Larry D. Boardman ,  Catherine A. Leatherdale

IPC分类号： H01L27/15 ,  B29C45/16 ,  C08L83/04 ,  B29C45/14 ,  B29C35/08 ,  B29K83/00 ,  C08G77/12 ,  C08G77/20 ,  C08G77/00 ,  H01L33/56

CPC分类号： B29C45/1671 ,  B29C45/14655 ,  B29C2035/0833 ,  B29K2083/00 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08G77/80 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C08L2312/06 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light emitting device that includes a light emitting diode and a multilayer encapsulant is disclosed. The multilayer encapsulant includes a first encapsulant in contact with the light emitting diode and a photopolymerizable composition in contact with the first encapsulant. The first encapsulant may be a silicone gel, silicone gum, silicone fluid, organosiloxane, polysiloxane, polyimide, polyphosphazene, sol-gel composition, or another photopolymerizable composition. The photopolymerizable compositions include a silicon-containing resin and a metal-containing catalyst, the silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation. Actinic radiation having a wavelength of 700 nm or less can be applied to initiate hydrosilylation within the silicon-containing resins.

摘要翻译： 公开了一种包括发光二极管和多层密封剂的发光器件。 多层密封剂包括与发光二极管接触的第一密封剂和与第一密封剂接触的光聚合组合物。 第一密封剂可以是有机硅凝胶，硅酮胶，硅氧烷流体，有机硅氧烷，聚硅氧烷，聚酰亚胺，聚磷腈，溶胶 - 凝胶组合物或另一种光聚合组合物。 可光聚合组合物包括含硅树脂和含金属的催化剂，所述含硅树脂包含与硅键合的氢和脂肪族不饱和键。 可以应用波长为700nm或更小的光化辐射以引发含硅树脂内的氢化硅烷化。

公开(公告)号：US08092735B2

公开(公告)日：2012-01-10

申请号：US11834137

申请日：2007-08-06

申请人： D. Scott Thompson ,  Larry D. Boardman ,  Catherine A. Leatherdale

发明人： D. Scott Thompson ,  Larry D. Boardman ,  Catherine A. Leatherdale

IPC分类号： H01L21/56

CPC分类号： H01L33/52 ,  B29C35/02 ,  B29C39/006 ,  B29C39/021 ,  B29C39/12 ,  B29C65/02 ,  B29C65/1416 ,  B29C66/71 ,  B29C66/7375 ,  B29C66/73754 ,  B29C66/73941 ,  B29C70/72 ,  B29C2035/0827 ,  B29K2105/243 ,  B29K2105/246 ,  B29L2011/00 ,  B29L2031/747 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  B29K2083/00 ,  B29K2063/00

摘要： Disclosed herein is a method of making a light emitting device having an LED die and a molded encapsulant made by polymerizing at least two polymerizable compositions. The method includes: (a) providing an LED package having an LED die disposed in a reflecting cup, the reflecting cup filled with a first polymerizable composition such that the LED die is encapsulated; (b) providing a mold having a cavity filled with a second polymerizable composition; (c) contacting the first and second polymerizable compositions; (d) polymerizing the first and second polymerizable compositions to form first and second polymerized compositions, respectively, wherein the first and second polymerized compositions are bonded together; and (e) optionally separating the mold from the second polymerized composition. Light emitting devices prepared according to the method are also described.

公开(公告)号：US07790347B2

公开(公告)日：2010-09-07

申请号：US12218105

申请日：2008-07-11

申请人： Catherine A. Leatherdale ,  Craig R. Schardt ,  D. Scott Thompson ,  Wendy L. Thompson

发明人： Catherine A. Leatherdale ,  Craig R. Schardt ,  D. Scott Thompson ,  Wendy L. Thompson

IPC分类号： C08K3/22 ,  C08K3/36 ,  G03C5/00 ,  G03C1/00

CPC分类号： C08F2/50 ,  G03F7/0047 ,  G03F7/029 ,  G03F7/0295 ,  G03F7/031 ,  G03F7/038 ,  G03F7/2053 ,  Y10T428/24612 ,  Y10T428/2982

摘要： A three-dimensional shaped structure is prepared from a multi-photon reactive composition including: (a) at least one reactive species; (b) a multi-photon photoinitiator system; and (c) a plurality of substantially inorganic particles, wherein the particles have an average particle size of less than about 10 microns in diameter.

摘要翻译： 由多光子反应性组合物制备三维形状结构，包括：（a）至少一种反应性物质; （b）多光子光引发剂体系; 和（c）多个基本上无机的颗粒，其中颗粒的直径平均粒径小于约10微米。

公开(公告)号：US07595515B2

公开(公告)日：2009-09-29

申请号：US11551323

申请日：2006-10-20

申请人： D. Scott Thompson ,  Catherine A. Leatherdale ,  Larry D. Boardman ,  Andrew J. Ouderkirk ,  Fedja Kecman

发明人： D. Scott Thompson ,  Catherine A. Leatherdale ,  Larry D. Boardman ,  Andrew J. Ouderkirk ,  Fedja Kecman

IPC分类号： H01L33/00 ,  H01L21/00 ,  B32B9/04

CPC分类号： H01L33/54 ,  C08J3/243 ,  C08J2383/04 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01067 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0091 ,  Y10T428/31663 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed herein is a method of making a light emitting device comprising an LED and a molded silicon-containing encapsulant. The method includes contacting the LED with a photopolymerizable composition containing a silicon-containing resin having silicon-bonded hydrogen and aliphatic unsaturation and two metal-containing catalysts. One catalyst may be activated by actinic radiation, and the second by heat but not the actinic radiation. Polymerization of the photopolymerizable composition to form the encapsulant may be carried out by selectively activating the different catalysts. At some point before polymerization is complete, a mold is used to impart a predetermined shape to the encapsulant.

摘要翻译： 本文公开了一种制造包括LED和模制含硅密封剂的发光器件的方法。 该方法包括使LED与含有硅键合的氢和脂族不饱和的含硅树脂和两种含金属的催化剂的光聚合组合物接触。 一种催化剂可以通过光化辐射活化，第二种是通过热而不是光化辐射。 可光聚合组合物聚合以形成密封剂可以通过选择性活化不同的催化剂来进行。 在聚合完成之前的某一时刻，使用模具将预定的形状赋予密封剂。

公开(公告)号：US09944031B2

公开(公告)日：2018-04-17

申请号：US12018298

申请日：2008-01-23

申请人： D. Scott Thompson ,  Larry D. Boardman ,  Fedja Kecman ,  Catherine Leatherdale

发明人： D. Scott Thompson ,  Larry D. Boardman ,  Fedja Kecman ,  Catherine Leatherdale

IPC分类号： B29D11/00 ,  G02B1/04

CPC分类号： B29D11/0073 ,  G02B1/041 ,  Y10T428/28 ,  C08L83/04

摘要： Molded optical articles and methods of making them are disclosed herein. Optical articles comprise a photopolymerizable composition disposed on a major surface of a substrate. The photopolymerizable composition comprises: a silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation, and a platinum catalyst providing from about 0.5 to about 30 parts per million of platinum. The major surface imparts a positive or negative lens to the photopolymerizable composition. Optical articles also include those that have been photopolymerized using actinic radiation having a wavelength of 700 nm or less.

公开(公告)号：US20100133574A1

公开(公告)日：2010-06-03

申请号：US12698251

申请日：2010-02-02

申请人： D. Scott Thompson ,  Larry D. Boardman ,  Catherine A. Leatherdale

发明人： D. Scott Thompson ,  Larry D. Boardman ,  Catherine A. Leatherdale

IPC分类号： H01L33/00

CPC分类号： B29C45/1671 ,  B29C45/14655 ,  B29C2035/0833 ,  B29K2083/00 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08G77/80 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C08L2312/06 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light emitting device that includes a light emitting diode and a multilayer encapsulant is disclosed. The multilayer encapsulant includes a first encapsulant in contact with the light emitting diode and a photopolymerizable composition in contact with the first encapsulant. The first encapsulant may be a silicone gel, silicone gum, silicone fluid, organosiloxane, polysiloxane, polyimide, polyphosphazene, sol-gel composition, or another photopolymerizable composition. The photopolymerizable compositions include a silicon-containing resin and a metal-containing catalyst, the silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation. Actinic radiation having a wavelength of 700 nm or less can be applied to initiate hydrosilylation within the silicon-containing resins.

摘要翻译： 公开了一种包括发光二极管和多层密封剂的发光器件。 多层密封剂包括与发光二极管接触的第一密封剂和与第一密封剂接触的光聚合组合物。 第一密封剂可以是有机硅凝胶，硅酮胶，硅氧烷流体，有机硅氧烷，聚硅氧烷，聚酰亚胺，聚磷腈，溶胶 - 凝胶组合物或另一种光聚合组合物。 可光聚合组合物包括含硅树脂和含金属的催化剂，所述含硅树脂包含与硅键合的氢和脂肪族不饱和键。 可以应用波长为700nm或更小的光化辐射以引发含硅树脂内的氢化硅烷化。

公开(公告)号：US20090076184A1

公开(公告)日：2009-03-19

申请号：US11855524

申请日：2007-09-14

申请人： D. Scott Thompson ,  Larry D. Boardman

发明人： D. Scott Thompson ,  Larry D. Boardman

IPC分类号： C08F2/46

CPC分类号： C08F2/46 ,  H01L33/52 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  Y10T428/31663 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Disclosed herein is a light emitting device including an LED die and a photopolymerizable composition comprising a silicon-containing resin comprising silicon-bonded hydrogen and aliphatic unsaturation, and from about 0.5 to about 30 parts per million of a platinum catalyst. The photopolymerizable composition may be free of catalyst inhibitor. Also disclosed herein are methods of making the light emitting device.

摘要翻译： 本文公开了一种发光器件，其包括LED管芯和可光聚合组合物，其包含含硅键合的氢和脂族不饱和度的含硅树脂和约0.5至约30ppm的铂催化剂。 可光聚合组合物可以不含催化剂抑制剂。 本文还公开了制造发光器件的方法。

公开(公告)号：US20090035528A1

公开(公告)日：2009-02-05

申请号：US12218105

申请日：2008-07-11

申请人： Catherine A. Leatherdale ,  Craig R. Schardt ,  D. Scott Thompson ,  Wendy L. Thompson

发明人： Catherine A. Leatherdale ,  Craig R. Schardt ,  D. Scott Thompson ,  Wendy L. Thompson

IPC分类号： B32B3/10 ,  C08J3/28

CPC分类号： C08F2/50 ,  G03F7/0047 ,  G03F7/029 ,  G03F7/0295 ,  G03F7/031 ,  G03F7/038 ,  G03F7/2053 ,  Y10T428/24612 ,  Y10T428/2982

摘要： A three-dimensional shaped structure is prepared from a multi-photon reactive composition including: (a) at least one reactive species; (b) a multi-photon photoinitiator system; and (c) a plurality of substantially inorganic particles, wherein the particles have an average particle size of less than about 10 microns in diameter.

摘要翻译： 由多光子反应性组合物制备三维形状结构，包括：（a）至少一种反应性物质; （b）多光子光引发剂体系; 和（c）多个基本上无机的颗粒，其中颗粒的直径平均粒径小于约10微米。

公开(公告)号：US20070269586A1

公开(公告)日：2007-11-22

申请号：US11383916

申请日：2006-05-17

申请人： Catherine A. Leatherdale ,  D. Scott Thompson ,  Larry D. Boardman

发明人： Catherine A. Leatherdale ,  D. Scott Thompson ,  Larry D. Boardman

IPC分类号： B05D5/06

CPC分类号： H01L33/58 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00

摘要： A method of making a light emitting device is disclosed. The method includes providing a light emitting diode; providing an optical element; attaching the optical element to the light emitting diode with a photopolymerizable composition, the photopolymerizable composition comprising a silicon-containing resin and a metal-containing catalyst, wherein the silicon-containing resin comprises silicon-bonded hydrogen and aliphatic unsaturation; and applying actinic radiation having a wavelength of 700 nm or less to initiate hydrosilylation within the silicon-containing resin.

摘要翻译： 公开了一种制造发光器件的方法。 该方法包括：提供发光二极管; 提供光学元件; 所述光聚合组合物包含含硅树脂和含金属的催化剂，其中所述含硅树脂包括与硅键合的氢和脂族不饱和键; 并施加波长为700nm以下的光化辐射，以引发含硅树脂内的氢化硅烷化。