Method and apparatus for producing group III nitride based compound semiconductor
    7.
    发明授权
    Method and apparatus for producing group III nitride based compound semiconductor 有权
    制备III族氮化物基化合物半导体的方法和装置

    公开(公告)号:US08123856B2

    公开(公告)日:2012-02-28

    申请号:US12225550

    申请日:2007-04-05

    IPC分类号: C30B19/00 C30B19/06

    摘要: In the flux method, a source nitrogen gas is sufficiently heated before feeding to an Na—Ga mixture.The apparatus of the invention is provided for producing a group III nitride based compound semiconductor. The apparatus includes a reactor which maintains a group III metal and a metal differing from the group III metal in a molten state, a heating apparatus for heating the reactor, an outer vessel for accommodating the reactor and the heating apparatus, and a feed pipe for feeding a gas containing at least nitrogen from the outside of the outer vessel into the reactor. The feed pipe has a zone for being heated together with the reactor by means of the heating apparatus, wherein the zone is heated inside the outer vessel and outside the reactor.

    摘要翻译: 在通量法中,在将氮源充分加热至Na-Ga混合物之前,充分加热。 提供本发明的装置用于制造III族氮化物基化合物半导体。 该装置包括在熔融状态下维持III族金属和不同于III族金属的金属的反应器,用于加热反应器的加热装置,用于容纳反应器的外部容器和加热装置,以及用于 将从外部容器外部至少含有氮气的气体进料到反应器中。 进料管具有通过加热装置与反应器一起加热的区域,其中该区域在外部容器内部和反应器外部被加热。

    METHOD FOR PRODUCING GROUP III NITRIDE-BASED COMPOUND SEMICONDUCTOR CRYSTAL
    10.
    发明申请
    METHOD FOR PRODUCING GROUP III NITRIDE-BASED COMPOUND SEMICONDUCTOR CRYSTAL 有权
    用于生产III族氮化物化合物半导体晶体的方法

    公开(公告)号:US20100093157A1

    公开(公告)日:2010-04-15

    申请号:US12448207

    申请日:2007-12-10

    IPC分类号: H01L21/20

    摘要: A GaN single crystal 20 is grown on a crystal growth surface of a seed crystal (GaN layer 13) through the flux method in a nitrogen (N2) atmosphere at 3.7 MPa and 870° C. employing a flux mixture including Ga, Na, and Li at about 870° C. Since the back surface of the template 10 is R-plane of the sapphire substrate 11, the template 10 is readily corroded or dissolved in the flux mixture from the back surface thereof. Therefore, the template 10 is gradually dissolved or corroded from the back surface thereof, resulting in separation from the semiconductor or dissolution in the flux. When the GaN single crystal 20 is grown to a sufficient thickness, for example, about 500 μm or more, the temperature of the crucible is maintained at 850° C. to 880° C., whereby the entirety of the sapphire substrate 11 is dissolved in the flux mixture.

    摘要翻译: 在氮(N 2)气氛中,在3.7MPa和870℃下,通过助熔剂法在GaN晶体生长面(GaN层13)上生长GaN单晶20,使用包含Ga,Na和 Li在约870℃。由于模板10的背面是蓝宝石衬底11的R平面,所以模板10容易被腐蚀或溶解在焊剂混合物的背面。 因此,模板10从其背面逐渐溶解或腐蚀,导致与半导体的分离或焊剂的溶解。 当GaN单晶20生长至足够的厚度,例如约500μm或更大时,坩埚的温度保持在850℃至880℃,从而整个蓝宝石衬底11溶解 在助焊剂混合物中。