公开(公告)号：US5083632A

公开(公告)日：1992-01-28

申请号：US336829

申请日：1989-04-12

申请人： Kazuhiko Saito ,  Yoshio Oka

发明人： Kazuhiko Saito ,  Yoshio Oka

IPC分类号： B62J9/00 ,  B62K5/00

CPC分类号： B62K19/46 ,  B62J9/00 ,  B62K5/01

摘要： A saddle type, off-road vehicle, comprising a frame, an engine supported by the frame, at least one front wheel, a pair of rear wheels disposed on opposite sides of the frame, a seat supported on an upper portion of the frame, and a storage receptacle provided above the rear frame. The storage receptacle includes an element for reinforcing the strength and rigidity of an inner surface thereof and a partition for dividing the receptacle into a plurality of storage sections.

摘要翻译： 一种鞍式越野车，包括框架，由框架支撑的发动机，至少一个前轮，设置在框架的相对侧上的一对后轮，支撑在框架的上部的座椅， 以及设置在后框架上方的存储容器。 存储容器包括用于增强其内表面的强度和刚度的元件和用于将容器分成多个存储部分的隔板。

公开(公告)号：US08309853B2

公开(公告)日：2012-11-13

申请号：US12526917

申请日：2008-02-15

申请人： Yoshio Oka ,  Takashi Kasuga ,  Jinjoo Park ,  Kouki Nakama

发明人： Yoshio Oka ,  Takashi Kasuga ,  Jinjoo Park ,  Kouki Nakama

IPC分类号： H05K1/00

CPC分类号： H05K3/4685 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/118 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0394 ,  H05K2201/10363 ,  H05K2203/1581

摘要： A flexible printed wiring board includes a substrate, conductor wirings, a coverlay film, a jumper wiring, and through holes. The conductor wirings are disposed on a first surface of the substrate. The coverlay film covers at least part of the conductor wirings. The jumper wiring electrically connects the conductor wirings to each other. The through holes are formed in the substrate and respectively open to the surfaces of the conductor wirings. The jumper wiring is composed of a hardened material of a conductive paste and is formed so that a second surface of the substrate is continuous with respective surfaces of the conductor wirings to which the through holes open.

摘要翻译： 柔性印刷电路板包括基板，导体布线，覆盖膜，跳线布线和通孔。 导体布线设置在基板的第一表面上。 覆盖膜覆盖导体布线的至少一部分。 跳线将导体布线彼此电连接。 通孔形成在基板中并分别向导体配线的表面开口。 跳线布线由导电浆料的硬化材料构成，并且形成为使得基板的第二表面与通孔打开的导体布线的各个表面连续。

公开(公告)号：US5830603A

公开(公告)日：1998-11-03

申请号：US785881

申请日：1997-01-21

申请人： Yoshio Oka ,  Takafumi Uemiya ,  Takeshi Sakamoto ,  Akira Harada

发明人： Yoshio Oka ,  Takafumi Uemiya ,  Takeshi Sakamoto ,  Akira Harada

IPC分类号： H01M2/14 ,  H01M2/16 ,  H01M2/18

CPC分类号： H01M2/145 ,  H01M2/1653 ,  H01M2/1686 ,  H01M2/18

摘要： A separator film for a battery is formed as a hydrophilized porous biaxially oriented film. The porous biaxially oriented film has a porosity of at least about 70%, a thickness in the range of about 10 to about 500 .mu.m, and a pore size in the range of about 0.01 to about 20 .mu.m. The porous film is made of hydrophobic resin, and a hydrophilic high polymer which is fixed in the pores of the film. The hydrophilic high polymer may be heterogeneously distributed in the porous film, so that the separator film has a hydrophilic portion and a hydrophobic portion. The porosity and/or the pore size of the porous film can be varied in the direction of film thickness. The separator film is applied in an alkaline storage battery or a nonaqueous electrolyte battery such as a lithium battery.

摘要翻译： 形成电池用隔膜作为亲水化多孔双轴取向膜。 多孔双轴取向膜具有至少约70％的孔隙率，约10至约500μm范围内的厚度和约0.01至约20μm的孔径。 该多孔膜由疏水性树脂制成，并且该亲水性高分子固定在膜的孔中。 亲水性高分子可以非均匀地分布在多孔膜中，使得隔膜具有亲水部分和疏水部分。 多孔膜的孔隙率和/或孔径可以在膜厚度方向上变化。 隔膜用于碱性蓄电池或锂电池等非水电解质电池中。

公开(公告)号：US4069009A

公开(公告)日：1978-01-17

申请号：US730720

申请日：1976-10-08

申请人： Masao Yamawaki ,  Katsuo Aoki ,  Yoshio Oka ,  Takao Suzuki ,  Osamu Ina ,  Kinihiko Hara

发明人： Masao Yamawaki ,  Katsuo Aoki ,  Yoshio Oka ,  Takao Suzuki ,  Osamu Ina ,  Kinihiko Hara

IPC分类号： B65G35/00 ,  H01L21/50 ,  H01L21/677 ,  F27B9/14

CPC分类号： H01L21/67712 ,  B65G35/00 ,  H01L21/6773

摘要： An apparatus for automatically transferring semiconductor wafers is disclosed. Semiconductor wafers are loaded on a boat which is placed on a pair of first supporting bars. A pair of second supporting bars are driven by a motor to repeat circular motion between the first supporting bars. The second supporting bars, circularly moving in parallel with the first supporting bars, forwardly transfer the boat. The boat is kept uplifted over the first supporting bars during the forward transfer thereof. Repetition of the circular motion of the second supporting bars makes the automatic transfer of the semiconductor wafers to be heat-treated in a semiconductor manufacturing system.

摘要翻译： 公开了一种用于自动转移半导体晶片的设备。 将半导体晶片装载在放置在一对第一支撑杆上的船上。 一对第二支撑杆由马达驱动以在第一支撑杆之间重复圆周运动。 与第一支撑杆平行移动的第二支撑杆向前移动船。 在向前转移期间，船在第一支撑杆上保持隆起。 第二支撑杆的圆周运动的重复使半导体制造系统中半导体晶片的自动转印被热处理。

公开(公告)号：US20100116525A1

公开(公告)日：2010-05-13

申请号：US12526917

申请日：2008-02-15

申请人： Yoshio Oka ,  Takashi Kasuga ,  Jinjoo Park ,  Kouki Nakama

发明人： Yoshio Oka ,  Takashi Kasuga ,  Jinjoo Park ,  Kouki Nakama

IPC分类号： H05K1/02

CPC分类号： H05K3/4685 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/118 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0394 ,  H05K2201/10363 ,  H05K2203/1581

摘要： A flexible printed wiring board includes a substrate, conductor wirings, a coverlay film, a jumper wiring, and through holes. The conductor wirings are disposed on a first surface of the substrate. The coverlay film covers at least part of the conductor wirings. The jumper wiring electrically connects the conductor wirings to each other. The through holes are formed in the substrate and respectively open to the surfaces of the conductor wirings. The jumper wiring is composed of a hardened material of a conductive paste and is formed so that a second surface of the substrate is continuous with respective surfaces of the conductor wirings which the through holes open.

摘要翻译： 柔性印刷电路板包括基板，导体布线，覆盖膜，跳线布线和通孔。 导体布线设置在基板的第一表面上。 覆盖膜覆盖导体布线的至少一部分。 跳线将导体布线彼此电连接。 通孔形成在基板中并分别向导体配线的表面开口。 跳线布线由导电膏的硬化材料构成，并且形成为使得基板的第二表面与通孔打开的导体布线的各个表面连续。

公开(公告)号：US20100044094A1

公开(公告)日：2010-02-25

申请号：US12518398

申请日：2008-01-16

申请人： Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

发明人： Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K3/44 ,  H01B1/22 ,  H05K1/056 ,  H05K1/097 ,  H05K3/4069 ,  H05K2201/09554 ,  H05K2203/0315 ,  H05K2203/105 ,  H05K2203/1136 ,  Y10T29/49128 ,  Y10T29/49165

摘要： The printed wiring board 1 includes the metallic substrate 2, the insulating layer 3 provided on the surface of the metallic substrate 2, and the conductive layer 4 formed on the surface of the insulating layer 3. The conductive layer 4 is electrically connected to the metallic substrate 2. A bottomed via hole or a through hole 6 is formed in the insulating layer 3 and the conducive layer 4. The via hole has a bottom in the metallic substrate 2, and has a wall surface in the insulating layer 3 and in the conductive layer 4. The through hole 6 extends through the insulating layer 3, the conductive layer 4, and the metallic substrate 2. Conductive paste 7 fills the bottomed via hole or the through hole 6 to electrically connect the metallic substrate 2 and the conductive layer 4 with each other. The printed wiring board 1 is subjected to a process in which current is applied to the interface between the metallic substrate 2 and the conductive paste 7.

摘要翻译： 印刷电路板1包括金属基板2，设置在金属基板2的表面上的绝缘层3和形成在绝缘层3的表面上的导电层4.导电层4电连接到金属 基板2.在绝缘层3和导电层4中形成有底的通孔或通孔6.通孔在金属基板2中具有底部，并且在绝缘层3中具有壁表面 通孔6延伸穿过绝缘层3，导电层4和金属基底2.导电浆料7填充有底的通孔或通孔6，以将金属基底2和导电层 4与彼此。 对印刷布线板1进行电流施加到金属基板2和导电浆料7之间的界面的处理。

公开(公告)号：US20080063792A1

公开(公告)日：2008-03-13

申请号：US11976490

申请日：2007-10-25

申请人： Noriki Hayashi ,  Yoshio Oka ,  Masahiko Kanda ,  Narito Yagi ,  Kenji Miyazaki ,  Kyouichirou Nakatsugi

发明人： Noriki Hayashi ,  Yoshio Oka ,  Masahiko Kanda ,  Narito Yagi ,  Kenji Miyazaki ,  Kyouichirou Nakatsugi

IPC分类号： H05K3/00

CPC分类号： H05K3/246 ,  H05K1/095 ,  H05K3/108 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/16 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2203/072 ,  H05K2203/095 ,  Y10T29/49126

摘要： A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.

摘要翻译： 一种用于印刷布线的新型印刷电路板，包括具有透明且有利的边界线的精细导体布线，并通过诸如丝网印刷的顺序印刷法，使用其的印刷线路板及其制造方法制造。 印刷电路板及其制造方法的特征在于，对板的表面进行表面处理之一：（a）粗糙化，（2）等离子体处理，（3）粗糙化，然后进行等离子体处理， 和（4）通过溅射粗化然后形成金属膜涂层。 印刷电路板及其制造方法的特征在于，使用含有平均粒径为4μm以下，最大粒径为15μm的金属粒子的导电糊进行印刷，制造导体布线 或更少。 另一种印刷线路板及其制造方法的特征在于，使用含有金属粒子M和粘合剂B的M / B的体积比为1/1〜1.9 / 1的导电性糊剂制造的导体布线的表面 被蚀刻，在表面上形成镀覆层。

公开(公告)号：US4946193A

公开(公告)日：1990-08-07

申请号：US284370

申请日：1988-12-14

申请人： Yoshio Oka

发明人： Yoshio Oka

IPC分类号： B62K7/04

CPC分类号： B62K7/04 ,  Y10S180/907 ,  Y10S180/908

摘要： Utility vehicles having four wheels, one or more seats, a steering column and a forward mounting power unit. The devices are shown to be either two of four wheel drive. Extending from behind the rear wheels to a position behind the steering column, a flat floor provides substantial storage area. When two seats are employed, the driver seat is displaced to one side of the vehicle and racks extend fore-and-aft in the same plane. The passenger's seat back may be lowered to further define that plane. The engine is mounted directly between the front wheels for compactness and protection.

摘要翻译： 具有四个轮子，一个或多个座椅，转向柱和前部安装动力单元的多用途车辆。 这些设备显示为四轮驱动器中的两个。 从后轮后延伸到转向柱后面的位置，平坦的地板提供了大量的存储区域。 当使用两个座位时，驾驶员座椅移动到车辆的一侧，并且机架在同一平面内前后延伸。 乘客的座椅靠背可能会下降，以进一步限定该平面。 发动机直接安装在前轮之间，以实现紧凑和保护。

公开(公告)号：US4574652A

公开(公告)日：1986-03-11

申请号：US639283

申请日：1984-08-09

申请人： Takashi Shichinohe ,  Masahiro Imaizumi ,  Ryoichi Ikejima ,  Yoshio Oka

发明人： Takashi Shichinohe ,  Masahiro Imaizumi ,  Ryoichi Ikejima ,  Yoshio Oka

IPC分类号： B62K23/06 ,  F16H61/26 ,  F16H63/00 ,  F16H63/04 ,  F16H63/18 ,  F16H63/30 ,  F16H63/38 ,  G05G5/06

CPC分类号： F16H63/18 ,  Y10T74/19279 ,  Y10T74/20055 ,  Y10T74/20085

摘要： An improved transmission in a motor vehicle including a body, an engine located in the vicinity of the center of the body, a pair of footrests attached to the body near the engine, and front and rear wheels. The transmission is integral with the engine and has a casing, a shift spindle having one end projecting from the casing and rotatable for shifting the transmission, and a control lever coupled to the shift spindle. According to the improvement, a cam means is interposed between the control lever and the casing for limiting shifting operation of the control lever. The cam means comprises a cam member having a cam surface and fixed to the casing, a shaft member axially slidably fitted in the control lever and having a control knob on a first end thereof, and a spring disposed between the shaft member and the control lever for urging the shaft member to cause a second end of the shaft member to abut against the cam surface of the cam member. The cam means makes gear shifting operation more reliable and convenient.

摘要翻译： 一种改进的机动车辆的变速器，包括主体，位于主体中心附近的发动机，附接到发动机附近的主体的一对脚踏板以及前轮和后轮。 变速器与发动机成一体，并具有壳体，换档主轴具有从壳体突出并可旋转的变速器的换档轴和连接到换档主轴的控制杆。 根据改进，凸轮装置插在控制杆和壳体之间，用于限制控制杆的换档操作。 凸轮装置包括具有凸轮表面并固定到壳体的凸轮构件，轴构件，轴向可滑动地装配在控制杆中，并且在其第一端上具有控制旋钮，以及设置在轴构件和控制杆之间的弹簧 用于推动轴构件使轴构件的第二端抵靠凸轮构件的凸轮表面。 凸轮装置使换档操作更可靠和方便。

公开(公告)号：US08597459B2

公开(公告)日：2013-12-03

申请号：US11664393

申请日：2005-09-26

申请人： Yoshio Oka ,  Hitoshi Takii ,  Noriki Hayashi

发明人： Yoshio Oka ,  Hitoshi Takii ,  Noriki Hayashi

IPC分类号： B29C65/00 ,  B32B37/00

CPC分类号： H01B1/22 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0245 ,  H05K2201/0394

摘要： There is provided a conductive paste obtained by kneading conductive particles into an epoxy resin and having good filling ability into a via hole, which can form a connected portion wherein the connection resistance does not change with time even under high temperature and high humidity conditions. Also, there is provided a method for manufacturing a multilayer printed wiring board using the conductive paste.A conductive paste containing conductive particles and a resin mixture wherein the content of the epoxy resin having a molecular weight of 10,000 or more is from 30 to 90% by weight in the total resin component and whose elastic modulus at 85° C. after curing is 2 GPa or less, the content of the conductive particle being from 30 to 75% by volume. Furthermore, a method for manufacturing a multilayer printed wiring board using the conductive paste.

摘要翻译： 提供一种通过将导电性粒子混入环氧树脂中并且具有良好的填充能力进入通孔而获得的导电膏，其可以形成连接部分，其中连接电阻即使在高温和高湿度条件下也不随时间变化。 此外，提供了一种使用导电浆料制造多层印刷线路板的方法。 含有导电性粒子和树脂混合物的导电性糊剂，其中分子量为10,000以上的环氧树脂的含量为总树脂成分的30〜90重量％，固化后85℃的弹性模量为 2GPa以下，导电性粒子的含量为30〜75体积％。 另外，使用该导电性糊料的多层印刷电路板的制造方法。