公开(公告)号：US20070026572A1

公开(公告)日：2007-02-01

申请号：US10556535

申请日：2005-03-15

申请人： Keiichi Hatakeyama ,  Michio Uruno ,  Takayuki Matsuzaki ,  Yasumasa Morishima ,  Kenji Kita ,  Shunichi Ishiwata

发明人： Keiichi Hatakeyama ,  Michio Uruno ,  Takayuki Matsuzaki ,  Yasumasa Morishima ,  Kenji Kita ,  Shunichi Ishiwata

IPC分类号： H01L21/00

CPC分类号： C09J163/10 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/22 ,  C09J7/35 ,  C09J133/068 ,  C09J161/06 ,  C09J161/28 ,  C09J175/14 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2475/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/73265 ,  H01L2224/83191

摘要： The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing/die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.5 to 6% by weight of glycidyl acrylate or glycidyl methacrylate, and with a weight average molecular weight of at least 100,000, a filler (d), and a curing accelerator (e).

摘要翻译： 本发明提供一种切割/切片接合片，其可以在切割时用作切割带，能够在拾取期间将半导体元件和粘合剂层与压敏粘合剂层容易地分离，并且其中粘合剂层具有令人满意的 作为芯片接合材料的粘合性。 一种切片/芯片粘接片，其中所述压敏粘合剂层包含含有碘值为0.5至20的分子内，可辐射固化碳 - 碳双键的化合物（A）和至少一种选自以下的化合物（B）： 由聚异氰酸酯，三聚氰胺 - 甲醛树脂和环氧树脂组成的组，并且粘合剂层包含环氧树脂（a），羟基当量至少为150g / eq的酚醛树脂（b），环氧基 - 含有丙烯酸共聚物（c），包含0.5-6重量％的丙烯酸缩水甘油酯或甲基丙烯酸缩水甘油酯，重均分子量至少为100,000，填料（d）和固化促进剂（e）。

公开(公告)号：US07517724B2

公开(公告)日：2009-04-14

申请号：US10556535

申请日：2005-03-15

申请人： Keiichi Hatakeyama ,  Michio Uruno ,  Takayuki Matsuzaki ,  Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata

发明人： Keiichi Hatakeyama ,  Michio Uruno ,  Takayuki Matsuzaki ,  Yasumasa Morishima ,  Kenji Kita ,  Shinichi Ishiwata

IPC分类号： H01L21/00

CPC分类号： C09J163/10 ,  C08L63/00 ,  C08L2666/02 ,  C08L2666/22 ,  C09J7/35 ,  C09J133/068 ,  C09J161/06 ,  C09J161/28 ,  C09J175/14 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2475/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/73265 ,  H01L2224/83191

摘要： The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing/die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.5 to 6% by weight of glycidyl acrylate or glycidyl methacrylate, and with a weight average molecular weight of at least 100,000, a filler (d), and a curing accelerator (e).

摘要翻译： 本发明提供一种切割/切片接合片，其可以在切割时用作切割带，能够在拾取期间将半导体元件和粘合剂层与压敏粘合剂层容易地分离，并且其中粘合剂层具有令人满意的 作为芯片接合材料的粘合性。 一种切片/芯片粘接片，其中所述压敏粘合剂层包含含有碘值为0.5至20的分子内，可辐射固化碳 - 碳双键的化合物（A）和至少一种选自以下的化合物（B）： 由聚异氰酸酯，三聚氰胺 - 甲醛树脂和环氧树脂组成的组，并且粘合剂层包含环氧树脂（a），羟基当量至少为150g / eq的酚醛树脂（b），环氧基 - 含有丙烯酸共聚物（c），包含0.5-6重量％的丙烯酸缩水甘油酯或甲基丙烯酸缩水甘油酯，重均分子量至少为100,000，填料（d）和固化促进剂（e）。

公开(公告)号：US07070670B2

公开(公告)日：2006-07-04

申请号：US10240265

申请日：2001-03-30

申请人： Takeo Tomiyama ,  Teiichi Inada ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Yuuji Hasegawa ,  Masaya Nishiyama ,  Takayuki Matsuzaki ,  Michio Uruno ,  Masao Suzuki ,  Tetsurou Iwakura ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya ,  Keiji Sumiya

发明人： Takeo Tomiyama ,  Teiichi Inada ,  Masaaki Yasuda ,  Keiichi Hatakeyama ,  Yuuji Hasegawa ,  Masaya Nishiyama ,  Takayuki Matsuzaki ,  Michio Uruno ,  Masao Suzuki ,  Tetsurou Iwakura ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya ,  Keiji Sumiya

IPC分类号： B32B37/00

CPC分类号： H01L21/6835 ,  C08L2666/02 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2463/00 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0271 ,  Y10T156/1052 ,  Y10T428/24 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： There are disclosed an adhesive composition comprising: (a) an epoxy resin, (b) a curing agent and (c) a polymer compound with a weight average molecular weight of 100,000 or more, wherein a ratio of A/B exceeds 1 and is 10 or less, where A represents the total weight of (a) the epoxy resin and (b) the curing agent and B represents a weight of (c) the polymer compound; an adhesive composition, whose compositions are separated into a sea phase and an island phase, when viewed at a section in a cured state, and a ratio X/Y is in a range of 0.1 to 1.0, where X is an area of the sea phase and Y is an area of the island phase; a process for producing said adhesive composition; an adhesive film wherein said adhesive composition is formed into a film form; an adhesive film for bonding a semiconductor chip and a wiring board for mounting a semiconductor or for bonding semiconductor chips themselves, wherein the adhesive film can perform bonding by heat-pressing with a pressure of 0.01 to 0.5 MPa; a wiring board for mounting a semiconductor equipped with said adhesive film on a surface for mounting a semiconductor chip; and a semiconductor device using said adhesive film or said wiring board for mounting a semiconductor.

公开(公告)号：US08119737B2

公开(公告)日：2012-02-21

申请号：US13084773

申请日：2011-04-12

申请人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

发明人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

IPC分类号： C08L33/14 ,  C08L63/02 ,  C08L63/04 ,  H05K1/03 ,  H05K3/46

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor.

摘要翻译： 公开了一种粘合剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）与所述环氧树脂不相容的高分子化合物，并且还可任选地包括（d）填料和/或（e）固化 加速器。 还公开了一种制备粘合剂组合物的方法，包括将（a）环氧树脂和（b）固化剂与（d）填料混合，然后将所得混合物与（c）与环氧树脂不相容的高分子化合物混合 树脂; 包括形成为膜的上述粘合剂组合物的粘合膜; 用于安装包括布线板的半导体的基板和设置在其上的上述粘合膜在其上将要安装芯片的一侧; 以及包括上述粘合膜或用于安装半导体的基板的半导体器件。

公开(公告)号：US20110021005A1

公开(公告)日：2011-01-27

申请号：US12900092

申请日：2010-10-07

申请人： Teiichi INADA ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

发明人： Teiichi INADA ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

IPC分类号： H01L21/78 ,  B32B7/12 ,  B32B27/04

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor.

摘要翻译： 公开了一种粘合剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）与所述环氧树脂不相容的高分子化合物，并且还可任选地包括（d）填料和/或（e）固化 加速器。 还公开了一种制备粘合剂组合物的方法，包括将（a）环氧树脂和（b）固化剂与（d）填料混合，然后将所得混合物与（c）与环氧树脂不相容的高分子化合物混合 树脂; 包括形成为膜的上述粘合剂组合物的粘合膜; 用于安装包括布线板的半导体的基板和设置在其上的上述粘合膜在其上将要安装芯片的一侧; 以及包括上述粘合膜或用于安装半导体的基板的半导体器件。

公开(公告)号：US20120080808A1

公开(公告)日：2012-04-05

申请号：US13323113

申请日：2011-12-12

申请人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

发明人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

IPC分类号： H01L23/12

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor.

摘要翻译： 公开了一种粘合剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）与所述环氧树脂不相容的高分子化合物，并且还可任选地包括（d）填料和/或（e）固化 加速器。 还公开了一种制备粘合剂组合物的方法，包括将（a）环氧树脂和（b）固化剂与（d）填料混合，然后将所得混合物与（c）与环氧树脂不相容的高分子化合物混合 树脂; 包括形成为膜的上述粘合剂组合物的粘合膜; 用于安装包括布线板的半导体的基板和设置在其上的上述粘合膜在其上将要安装芯片的一侧; 以及包括上述粘合膜或用于安装半导体的基板的半导体器件。

公开(公告)号：US07947779B2

公开(公告)日：2011-05-24

申请号：US12900092

申请日：2010-10-07

申请人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

发明人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

IPC分类号： C08L33/14 ,  C08L63/02 ,  C08L63/04 ,  H05K1/03 ,  H05K3/46

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor.

摘要翻译： 公开了一种粘合剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）与所述环氧树脂不相容的高分子化合物，并且还可任选地包括（d）填料和/或（e）固化 加速器。 还公开了一种制备粘合剂组合物的方法，包括将（a）环氧树脂和（b）固化剂与（d）填料混合，然后将所得混合物与（c）与环氧树脂不相容的高分子化合物混合 树脂; 包括形成为膜的上述粘合剂组合物的粘合膜; 用于安装包括布线板的半导体的基板和设置在其上的上述粘合膜在其上将要安装芯片的一侧; 以及包括上述粘合膜或用于安装半导体的基板的半导体器件。

公开(公告)号：US20060100315A1

公开(公告)日：2006-05-11

申请号：US11319068

申请日：2005-12-28

申请人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

发明人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

IPC分类号： C08L63/00 ,  C08G59/50

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.

摘要翻译： 本发明提供了一种粘合剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）与所述环氧树脂不相容的高分子化合物，并且还任选地包含（d）填料和/或（e） 固化促进剂; 一种制备粘合剂组合物的方法，包括：（a）环氧树脂和（b）固化剂与（d）填料混合，然后将所得混合物与（c）与环氧树脂不相容的高分子化合物混合; 包含形成为膜的上述粘合剂组合物的粘合膜; 一种用于安装半导体的基板，包括布线板和其上安装有芯片的侧面上的粘合膜; 以及包括上述粘合膜或用于安装半导体的基板的半导体器件。

公开(公告)号：US20060106166A1

公开(公告)日：2006-05-18

申请号：US11319069

申请日：2005-12-28

申请人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka

发明人： Teiichi Inada ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka

IPC分类号： C08L63/00 ,  B32B27/38

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.

公开(公告)号：US20090186955A1

公开(公告)日：2009-07-23

申请号：US12414420

申请日：2009-03-30

申请人： Teiichi INADA ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

发明人： Teiichi INADA ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

IPC分类号： C08L63/00 ,  C08J9/00

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the fillers followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.

摘要翻译： 本发明提供了一种粘合剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）与所述环氧树脂不相容的高分子化合物，并且还任选地包含（d）填料和/或（e） 固化促进剂; 一种制备粘合剂组合物的方法，包括：（a）环氧树脂和（b）固化剂与（d）填料混合，然后将所得混合物与（c）与环氧树脂不相容的高分子化合物混合; 包含形成为膜的上述粘合剂组合物的粘合膜; 一种用于安装半导体的基板，包括布线板和其上安装有芯片的侧面上的粘合膜; 以及包括上述粘合膜或用于安装半导体的基板的半导体器件。