PROVIDING AN ELECTRICALLY CONDUCTIVE WALL STRUCTURE ADJACENT A CONTACT STRUCTURE OF AN ELECTRONIC DEVICE
    1.
    发明申请
    PROVIDING AN ELECTRICALLY CONDUCTIVE WALL STRUCTURE ADJACENT A CONTACT STRUCTURE OF AN ELECTRONIC DEVICE 有权
    提供电气导电壁结构附件电子设备的接触结构

    公开(公告)号:US20090224785A1

    公开(公告)日:2009-09-10

    申请号:US12044893

    申请日:2008-03-07

    IPC分类号: G01R31/26 H05K3/00

    摘要: Devices and methods for providing, making, and/or using an electronic apparatus having a wall structure adjacent a resilient contact structure on a substrate. The electronic apparatus can include a substrate and a plurality of electrically conductive resilient contact structures, which can extend from the substrate. A first of the contact structures can be part of an electrical path through the electronic apparatus. A first electrically conductive wall structure can also extend from the substrate, and the first wall structure can be disposed adjacent one of the contact structures. The first wall structure can be electrically connected to a return current path within the electronic apparatus for an alternating current signal or power on the first contact structure.

    摘要翻译: 用于提供,制造和/或使用具有邻近基板上的弹性接触结构的壁结构的电子设备的设备和方法。 电子设备可以包括基板和可从基板延伸的多个导电弹性接触结构。 接触结构中的第一个可以是通过电子设备的电路径的一部分。 第一导电壁结构也可以从衬底延伸,并且第一壁结构可以邻近一个接触结构设置。 第一壁结构可以电连接到电子设备内的回流电路,用于交流信号或第一接触结构上的功率。

    Providing an electrically conductive wall structure adjacent a contact structure of an electronic device
    2.
    发明授权
    Providing an electrically conductive wall structure adjacent a contact structure of an electronic device 有权
    提供邻近电子设备的接触结构的导电壁结构

    公开(公告)号:US07936177B2

    公开(公告)日:2011-05-03

    申请号:US12044893

    申请日:2008-03-07

    IPC分类号: G01R31/20

    摘要: Devices and methods for providing, making, and/or using an electronic apparatus having a wall structure adjacent a resilient contact structure on a substrate. The electronic apparatus can include a substrate and a plurality of electrically conductive resilient contact structures, which can extend from the substrate. A first of the contact structures can be part of an electrical path through the electronic apparatus. A first electrically conductive wall structure can also extend from the substrate, and the first wall structure can be disposed adjacent one of the contact structures. The first wall structure can be electrically connected to a return current path within the electronic apparatus for an alternating current signal or power on the first contact structure.

    摘要翻译: 用于提供,制造和/或使用具有邻近基板上的弹性接触结构的壁结构的电子设备的设备和方法。 电子设备可以包括基板和可从基板延伸的多个导电弹性接触结构。 接触结构中的第一个可以是通过电子设备的电路径的一部分。 第一导电壁结构也可以从衬底延伸,并且第一壁结构可以邻近一个接触结构设置。 第一壁结构可以电连接到电子设备内的回流电路,用于交流信号或第一接触结构上的功率。

    Probe card assembly with a mechanically decoupled wiring substrate
    3.
    发明授权
    Probe card assembly with a mechanically decoupled wiring substrate 有权
    具有机械去耦接线基板的探头卡组件

    公开(公告)号:US07622935B2

    公开(公告)日:2009-11-24

    申请号:US11551545

    申请日:2006-10-20

    IPC分类号: G01R31/02 G01R31/28

    CPC分类号: G01R31/2893

    摘要: A probe card assembly can comprise a probe head assembly and a wiring substrate. The probe head assembly can comprise a plurality of probes disposed to contact an electronic device disposed on a holder in a test housing. The wiring substrate can include an electrical interface to a test controller and a plurality of electrical wiring composing electrical paths between the electrical interface and ones of the probes, and the wiring substrate can comprise a first portion on which the electrical interface is disposed and a second portion composing the probe head assembly. The second portion of the wiring substrate can be moveable with respect to the first portion of the wiring substrate.

    摘要翻译: 探针卡组件可以包括探针头组件和布线衬底。 探针头组件可以包括多个探针,其设置成接触设置在测试壳体中的保持器上的电子设备。 布线基板可以包括与测试控制器的电接口以及构成电接口和探针之间的电气路径的多个电线,并且布线基板可以包括其上设置有电接口的第一部分和第二部分 组成探头组件的部分。 布线基板的第二部分能够相对于布线基板的第一部分移动。

    RESILIENT CONTACT ELEMENT AND METHODS OF FABRICATION
    4.
    发明申请
    RESILIENT CONTACT ELEMENT AND METHODS OF FABRICATION 失效
    灵活的接触元件和制造方法

    公开(公告)号:US20080157799A1

    公开(公告)日:2008-07-03

    申请号:US11617373

    申请日:2006-12-28

    IPC分类号: G01R1/067 G01R31/26

    摘要: Embodiments of resilient contact elements and methods for fabricating same are provided herein. In one embodiment, a resilient contact element for use in a probe card includes a lithographically formed resilient beam having a first end and an opposing second end; and a tip disposed proximate the first end of the beam and configured to break through an oxide layer of a surface of a device to be tested to establish a reliable electrical connection therewith; wherein at least a central portion of the beam has a continuous sloped profile defining, in a relaxed state, a height measured between the beam and a plane representing an upper surface of a device to be tested that is greater near the second end of the beam than near the first end of the beam.

    摘要翻译: 弹性接触元件的实施例及其制造方法在本文中提供。 在一个实施例中,用于探针卡的弹性接触元件包括光刻形成的弹性梁,其具有第一端和相对的第二端; 以及设置在所述梁的第一端附近并且被构造成突破待测试装置的表面的氧化物层以与其建立可靠的电连接的尖端; 其中所述梁的至少中心部分具有连续的倾斜轮廓,所述连续倾斜轮廓在松弛状态下限定在所述梁与表示待测试装置的上表面的平面之间测量的高度,其在所述梁的第二端附近较大 比梁的第一端附近。

    Method and apparatus for probe card alignment in a test system
    7.
    发明授权
    Method and apparatus for probe card alignment in a test system 有权
    测试系统中探针卡校准的方法和设备

    公开(公告)号:US07977956B2

    公开(公告)日:2011-07-12

    申请号:US12431271

    申请日:2009-04-28

    IPC分类号: G01R31/00 G01R31/20

    CPC分类号: G01R31/2891

    摘要: Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting a device to be tested, and having an identified set of one or more features that are preselected in accordance with selected criteria for aligning the probe card assembly within a prober after installation therein. In some embodiments, the identity of the identified set of one or more features may be communicated to the prober to facilitate a global alignment of the probe card assembly that minimizes an aggregate misalignment of all of the tips in the probe card assembly.

    摘要翻译: 本文提供了在测试系统中对准探针卡组件的方法和装置的实施例。 在一些实施例中,用于测试装置的装置可以包括具有多个探针的探针卡组件,每个探针具有用于接触要测试的装置的尖端,并且具有根据本发明的预选的一组或多个特征 在探针卡组件安装在其中之后将探针卡组件对准的选择标准。 在一些实施例中,所识别的一个或多个特征集合的身份可以被传送到探测器,以促进探针卡组件的全局对准,其最小化探针卡组件中的所有尖端的聚集失准。

    METHOD AND APPARATUS FOR PROBE CARD ALIGNMENT IN A TEST SYSTEM
    8.
    发明申请
    METHOD AND APPARATUS FOR PROBE CARD ALIGNMENT IN A TEST SYSTEM 有权
    检测系统中探针卡对齐的方法与装置

    公开(公告)号:US20100271062A1

    公开(公告)日:2010-10-28

    申请号:US12431271

    申请日:2009-04-28

    IPC分类号: G01R31/02

    CPC分类号: G01R31/2891

    摘要: Embodiments of methods and apparatus for aligning a probe card assembly in a test system are provided herein. In some embodiments, an apparatus for testing devices may include a probe card assembly having a plurality of probes, each probe having a tip for contacting a device to be tested, and having an identified set of one or more features that are preselected in accordance with selected criteria for aligning the probe card assembly within a prober after installation therein. In some embodiments, the identity of the identified set of one or more features may be communicated to the prober to facilitate a global alignment of the probe card assembly that minimizes an aggregate misalignment of all of the tips in the probe card assembly

    摘要翻译: 本文提供了在测试系统中对准探针卡组件的方法和装置的实施例。 在一些实施例中,用于测试装置的装置可以包括具有多个探针的探针卡组件,每个探针具有用于接触要测试的装置的尖端,并且具有根据本发明的预选的一组或多个特征 在探针卡组件安装在其中之后将探针卡组件对准的选择标准。 在一些实施例中,所识别的一组一个或多个特征的身份可以被传送到探测器,以促进探针卡组件的全局对准,其最小化探针卡组件中的所有尖端的聚集失准

    Resilient contact element and methods of fabrication
    9.
    发明授权
    Resilient contact element and methods of fabrication 失效
    弹性接触元件和制造方法

    公开(公告)号:US07674112B2

    公开(公告)日:2010-03-09

    申请号:US11617373

    申请日:2006-12-28

    IPC分类号: H01R31/02

    摘要: Embodiments of resilient contact elements and methods for fabricating same are provided herein. In one embodiment, a resilient contact element for use in a probe card includes a lithographically formed resilient beam having a first end and an opposing second end; and a tip disposed proximate the first end of the beam and configured to break through an oxide layer of a surface of a device to be tested to establish a reliable electrical connection therewith; wherein at least a central portion of the beam has a continuous sloped profile defining, in a relaxed state, a height measured between the beam and a plane representing an upper surface of a device to be tested that is greater near the second end of the beam than near the first end of the beam.

    摘要翻译: 弹性接触元件的实施例及其制造方法在本文中提供。 在一个实施例中,用于探针卡的弹性接触元件包括光刻形成的弹性梁,其具有第一端和相对的第二端; 以及设置在所述梁的第一端附近并且被构造成突破待测试装置的表面的氧化物层以与其建立可靠的电连接的尖端; 其中所述梁的至少中心部分具有连续的倾斜轮廓,所述连续倾斜轮廓在松弛状态下限定在所述梁与表示待测试装置的上表面的平面之间测量的高度,其在所述梁的第二端附近较大 比梁的第一端附近。

    WIRING SUBSTRATE WITH CUSTOMIZATION LAYERS
    10.
    发明申请
    WIRING SUBSTRATE WITH CUSTOMIZATION LAYERS 有权
    带有自定义层的布线基板

    公开(公告)号:US20110214910A1

    公开(公告)日:2011-09-08

    申请号:US12719136

    申请日:2010-03-08

    摘要: One or more customization layers can be added to a wiring substrate. The customization layers can provide customized electrical connections from electrical contacts of the base wiring substrate to electrical contacts at an outer surface of the customization layers, which can allow the contacts at the outer surface of the customization layers can be in a different pattern than the contacts at the surface of the base wiring substrate. The customization layers can comprise electrically insulating material, electrically conductive via structures through the insulating material, electrically conductive traces, electrically conductive jumpers electrically connecting two traces without contacting a trace disposed between the two traces, and/or other such elements. A jumper can be formed by making a relatively small deposit of electrically insulating material between the two traces to be connected and then making a relatively small deposit of electrically conductive material on parts of the two traces and the insulating material. Via structures can be coupled to traces and an insulating material can be cast around the via structures. Alternatively, via structures can be formed in openings with sloped side walls in an insulating layer.

    摘要翻译: 可以将一个或多个定制层添加到布线基板。 定制层可以提供从基底布线基板的电触点到定制层外表面处的电触点的定制电连接,这允许定制层外表面处的触点可以与触点不同的图案 在基极配线基板的表面。 定制层可以包括电绝缘材料,通过绝缘材料的导电通孔结构,导电迹线,电连接两个迹线的导电跳线,而不接触设置在两个迹线之间的迹线和/或其它这样的元件。 可以通过在要连接的两个迹线之间形成相对较小的电绝缘材料沉积,然后在两个迹线和绝缘材料的部分上形成相对较小的导电材料沉积物来形成跳线。 通孔结构可以耦合到迹线,并且绝缘材料可以围绕通孔结构铸造。 或者,通孔结构可以形成在具有绝缘层中的倾斜侧壁的开口中。