公开(公告)号：US6045605A

公开(公告)日：2000-04-04

申请号：US78668

申请日：1998-05-14

申请人： Kenji Doi ,  Naoto Miyashita ,  Masahiro Abe ,  Hiroyuki Kohno ,  Hiroshi Kato ,  Kazuhiko Hayashi

发明人： Kenji Doi ,  Naoto Miyashita ,  Masahiro Abe ,  Hiroyuki Kohno ,  Hiroshi Kato ,  Kazuhiko Hayashi

IPC分类号： B24B37/00 ,  B24B57/02 ,  C09G1/02 ,  C09K3/14 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B57/02 ,  B24B37/04 ,  C09G1/02 ,  C09K3/1463

摘要： An abrasive material is prepared by dispersing silicon nitride particles acting as abrasive particles in a solvent such as a pure water or an ultra pure water, followed by adding an adsorptive stickable to the abrasive particles to the dispersion. The resultant abrasive material permits diminishing the polishing rate of a silicon nitride film used as a stopper film, with the result that a CVD SiO.sub.2 film to be polished is selectively polished relative to the Si.sub.3 N.sub.4 film used as the stopper film. This makes it possible to make the stopper film as thin as possible and permits the CVD SiO.sub.2 film to be flattened efficiently without bringing about a dishing problem.

摘要翻译： 研磨材料通过将作为磨料颗粒的氮化硅颗粒分散在诸如纯水或超纯水的溶剂中，然后向分散体中添加粘附到磨料颗粒上的吸附剂来制备。 所得的研磨材料允许减少用作阻挡膜的氮化硅膜的抛光速率，结果是相对于用作阻挡膜的Si 3 N 4膜选择性地抛光待抛光的CVD SiO 2膜。 这使得可以使阻挡膜尽可能薄，并且可以有效地使CVD SiO 2膜平坦化，而不会产生凹陷问题。

公开(公告)号：US06354913B1

公开(公告)日：2002-03-12

申请号：US09214431

申请日：1999-01-06

申请人： Naoto Miyashita ,  Yoshihiro Minami ,  Kenji Doi ,  Jun Takayasu ,  Hiroyuki Kohno ,  Hiroshi Kato ,  Kazuhiko Hayashi

发明人： Naoto Miyashita ,  Yoshihiro Minami ,  Kenji Doi ,  Jun Takayasu ,  Hiroyuki Kohno ,  Hiroshi Kato ,  Kazuhiko Hayashi

IPC分类号： B24B100

CPC分类号： B24B37/24 ,  B24B37/0056 ,  B24B37/044 ,  B24D3/20 ,  B24D3/344 ,  C09G1/02 ,  H01L21/3212

摘要： A semiconductor wafer or a film formed thereon is polished by using a polishing agent comprising abrasive containing silica particles as the main component, water as a solvent, and a water-soluble cellulose, an alkali metal impurity content of the polishing agent being 5C ppm or less where the polishing agent contains C % by weight of the water-soluble cellulose, so as to flatten the semiconductor wafer without doing damage to the wafer or the film formed thereon and without bringing about a dishing problem in the polished surface.

摘要翻译： 通过使用包含二氧化硅颗粒作为主要成分的研磨剂，作为溶剂的水和水溶性纤维素，研磨剂的碱金属杂质含量为5ppm或以下，研磨半导体晶片或其上形成的膜 抛光剂含有C％（重量）的水溶性纤维素，以使得半导体晶片平坦化，而不会对晶片或其上形成的膜造成损害，而不会在抛光表面产生凹陷问题。

公开(公告)号：US5880032A

公开(公告)日：1999-03-09

申请号：US689111

申请日：1996-07-30

申请人： Kenji Doi ,  Ichiro Katakabe ,  Naoto Miyashita

发明人： Kenji Doi ,  Ichiro Katakabe ,  Naoto Miyashita

IPC分类号： H01L21/311 ,  H01L21/00

CPC分类号： H01L21/31116 ,  Y10S438/906

摘要： A method of manufacturing a semiconductor device comprises the steps of introducing a first gas containing steam or alcohol into a processing vessel housing a semiconductor substrate, and introducing a hydrogen fluoride gas as a second gas into the processing vessel after stopping introduction of the first gas into the process chamber.

摘要翻译： 一种制造半导体器件的方法包括以下步骤：将含有蒸汽或醇的第一气体引入到容纳半导体衬底的处理容器中，并且在停止将第一气体引入第一气体之后，将作为第二气体的氟化氢气体引入处理容器 处理室。

公开(公告)号：US5878191A

公开(公告)日：1999-03-02

申请号：US451509

申请日：1995-05-26

申请人： Naoto Miyashita ,  Ichiro Katakabe ,  Hiroshi Kawamoto ,  Kenji Doi ,  Tsuyoshi Okuda

发明人： Naoto Miyashita ,  Ichiro Katakabe ,  Hiroshi Kawamoto ,  Kenji Doi ,  Tsuyoshi Okuda

IPC分类号： H01L21/22 ,  H01L21/00 ,  H01L21/324 ,  C23L16/00

CPC分类号： H01L21/67115

摘要： A heat treatment apparatus for semiconductor wafers includes a reaction chamber, a heater, a heat-insulating member, a first cooling gas path, a second cooling gas path, a blower and a controller. The reaction chamber houses semiconductor wafers. The heater is provided outside the reaction chamber to heat it. The heat-insulating member is provided outside the heater to keep the temperature of the reaction chamber. The first cooling gas path is interposed between the reaction chamber and heater, while the second cooling gas path is disposed between the heater and heat-insulating member. The blower allows gas to flow through the first and second gas paths to cool the reaction chamber. The controller controls the heater to increase the temperature of the reaction chamber and does the blower to decrease the temperature thereof.

摘要翻译： 用于半导体晶片的热处理装置包括反应室，加热器，绝热构件，第一冷却气体路径，第二冷却气体路径，鼓风机和控制器。 反应室容纳半导体晶片。 加热器设置在反应室外部以加热。 隔热构件设置在加热器的外侧，以保持反应室的温度。 第一冷却气体路径介于反应室和加热器之间，而第二冷却气体路径设置在加热器和绝热构件之间。 鼓风机允许气体流过第一和第二气体通道以冷却反应室。 控制器控制加热器以增加反应室的温度，并且鼓风机降低其温度。

公开(公告)号：US20110087053A1

公开(公告)日：2011-04-14

申请号：US12997449

申请日：2009-06-03

申请人： Shinji Senoo ,  Kazuhiko Kato ,  Kenji Doi ,  Katsunari Higashi

发明人： Shinji Senoo ,  Kazuhiko Kato ,  Kenji Doi ,  Katsunari Higashi

IPC分类号： C07C15/02 ,  C07C37/08

CPC分类号： C07C2/864 ,  C07C37/08 ,  C07C407/00 ,  C07C2529/70 ,  Y02P20/52 ,  C07C15/085 ,  C07C39/04 ,  C07C409/10

摘要： The invention provides an efficient process for producing alkylated aromatic compounds such as cumene in a compact reactor. The invention also provides a process for producing phenol which includes a step of producing cumene by the above process.The process for producing alkylated aromatic compounds of the invention includes feeding raw materials including an aromatic compound and an alcohol in a gas-liquid downward concurrent flow mode to a fixed-bed reactor packed with a solid acid catalyst thereby to produce an alkylated aromatic compound, wherein the raw materials are fed to the reactor in a stream of a gas, and the reaction gas flow rate defined by the equation below is not less than 0.05 at an entrance of a solid acid catalyst layer: ρg·ug·[ρair·ρwater/(ρg·ρl)]1/2(kgm−2s−1).

摘要翻译： 本发明提供了在紧凑型反应器中生产烷基化芳族化合物如枯烯的有效方法。 本发明还提供一种生产苯酚的方法，其包括通过上述方法生产异丙基苯的步骤。 本发明的烷基化芳香族化合物的制造方法包括以气液向下并流模式将包含芳族化合物和醇的原料进料到填充有固体酸催化剂的固定床反应器中，从而制备烷基化芳族化合物， 其中原料以气流输送到反应器中，并且由下式确定的反应气体流速在固体酸催化剂层的入口处不小于0.05;＆rgg; g·ug·[＆rgr ;空气·水/（＆rgr g g＆rgr; l）] 1/2（kgm-2s-1）。

公开(公告)号：US07543755B2

公开(公告)日：2009-06-09

申请号：US10329927

申请日：2002-12-27

申请人： Kenji Doi ,  Takashi Nishiyama ,  Ryouji Nakajima ,  Masaru Hashimoto ,  Kenshi Suzuki ,  Yoshiko Tsuji ,  Tokuhisa Nishimura

发明人： Kenji Doi ,  Takashi Nishiyama ,  Ryouji Nakajima ,  Masaru Hashimoto ,  Kenshi Suzuki ,  Yoshiko Tsuji ,  Tokuhisa Nishimura

IPC分类号： G06K19/05

CPC分类号： G07C9/00309 ,  G07C9/00182 ,  G07C9/00857 ,  G07C2009/00793 ,  G07C2209/65

摘要： An electronic security system is provided with an electronic key and an electronic locking apparatus. The electronic key includes an identification data registry for storing one or more identification data for locking and unlocking. The electronic locking apparatus includes a key data registry for storing a key data having a predetermined relationship with an identification data of an electronic key corresponding to the electronic locking apparatus. The system includes with a reader/writer for reading and writing the identification data in and from the identification data registry. This system ensures an improved convenience by making a single key compatible with a plurality of objects.

摘要翻译： 电子安全系统设置有电子钥匙和电子锁定装置。 电子钥匙包括用于存储用于锁定和解锁的一个或多个识别数据的识别数据注册表。 电子锁定装置包括密钥数据注册表，用于存储与电子锁定装置对应的电子钥匙的识别数据具有预定关系的密钥数据。 该系统包括读写器，用于在标识数据注册表中读取和写入标识数据。 该系统通过使单个密钥与多个对象兼容来确保改进的便利性。

公开(公告)号：US08257445B2

公开(公告)日：2012-09-04

申请号：US12096963

申请日：2006-12-07

申请人： Kanji Tsuru ,  Satoshi Hayakawa ,  Akiyoshi Osaka ,  Atsushi Sugino ,  Kenji Doi ,  Koichi Kuramoto

发明人： Kanji Tsuru ,  Satoshi Hayakawa ,  Akiyoshi Osaka ,  Atsushi Sugino ,  Kenji Doi ,  Koichi Kuramoto

IPC分类号： A61C13/08 ,  A61F2/28

CPC分类号： A61L27/56 ,  A61L27/06 ,  A61L27/306 ,  A61L2430/02

摘要： By forming a bone-compatible implant wherein a groove or hole has been formed in the surface of a base material made of titanium metal or a titanium alloy at its joint with a bone tissue and the groove or hole has on the inner surface thereof an oxide film formed by heating in an oxygen-containing atmosphere, apatite is allowed to deposit on the inner surface of the groove or hole easily. Thus, an implant is provided which can be attached to a bone within a relatively short period of time even without resorting to bone cement.

摘要翻译： 通过形成骨相容的植入物，其中在与钛合金或钛合金的骨架组织的基底材料的表面中形成有凹槽或孔，并且其内表面上具有氧化物 通过在含氧气氛中加热形成的膜，允许磷灰石容易地沉积在槽或孔的内表面上。 因此，提供了一种植入物，即使在不采取骨水泥的情况下，也可以在相对短的时间内将其附着到骨骼上。

公开(公告)号：US07785765B2

公开(公告)日：2010-08-31

申请号：US11913173

申请日：2006-04-28

申请人： Masahiro Fujiwara ,  Kenji Doi ,  Yoshifumi Araki ,  Kazuyoshi Yamazawa

发明人： Masahiro Fujiwara ,  Kenji Doi ,  Yoshifumi Araki ,  Kazuyoshi Yamazawa

IPC分类号： G03F7/00 ,  G03F7/004 ,  G03F7/09

CPC分类号： G03F7/033 ,  Y10S430/106

摘要： The present invention relates to a photosensitive resin composition comprising at least a thermoplastic elastomer (a), a photopolymerizable unsaturated monomer (b), and a photopolymerization initiator (c), characterized in that the thermoplastic elastomer (a) comprises at least vinyl aromatic hydrocarbon units, butadiene units, and alkylene units and contains alkylene units not less than 5 wt % and not more than 80 wt % with respect to the total amount of butadiene units and alkylene units. The present invention provides a photosensitive resin composition that simultaneously achieves excellent fine line reproducibility, ester solvent resistance, and prevention of cracks occurring on plate surface.

摘要翻译： 本发明涉及至少含有热塑性弹性体（a），光聚合性不饱和单体（b）和光聚合引发剂（c）的感光性树脂组合物，其特征在于，所述热塑性弹性体（a）至少含有乙烯基芳香烃 单元，丁二烯单元和亚烷基单元，相对于丁二烯单元和亚烷基单元的总量，含有不少于5重量％且不大于80重量％的亚烷基单元。 本发明提供一种同时具有优异的细线再现性，耐酯溶剂性和防止板表面发生裂纹的感光性树脂组合物。

公开(公告)号：US20090068593A1

公开(公告)日：2009-03-12

申请号：US11913173

申请日：2006-04-28

申请人： Masahiro Fujiwara ,  Kenji Doi ,  Yoshifumi Araki ,  Kazuyoshi Yamazawa

发明人： Masahiro Fujiwara ,  Kenji Doi ,  Yoshifumi Araki ,  Kazuyoshi Yamazawa

IPC分类号： G03F7/004 ,  C08F2/46

CPC分类号： G03F7/033 ,  Y10S430/106

摘要： The present invention relates to a photosensitive resin composition comprising at least a thermoplastic elastomer (a), a photopolymerizable unsaturated monomer (b), and a photopolymerization initiator (c), characterized in that the thermoplastic elastomer (a) comprises at least vinyl aromatic hydrocarbon units, butadiene units, and alkylene units and contains alkylene units not less than 5 wt % and not more than 80 wt % with respect to the total amount of butadiene units and alkylene units. The present invention provides a photosensitive resin composition that simultaneously achieves excellent fine line reproducibility, ester solvent resistance, and prevention of cracks occurring on plate surface.

摘要翻译： 本发明涉及至少含有热塑性弹性体（a），光聚合性不饱和单体（b）和光聚合引发剂（c）的感光性树脂组合物，其特征在于，所述热塑性弹性体（a）至少含有乙烯基芳香烃 单元，丁二烯单元和亚烷基单元，相对于丁二烯单元和亚烷基单元的总量，含有不少于5重量％且不大于80重量％的亚烷基单元。 本发明提供一种同时具有优异的细线再现性，耐酯溶剂性和防止板表面发生裂纹的感光性树脂组合物。

公开(公告)号：US6034284A

公开(公告)日：2000-03-07

申请号：US175431

申请日：1998-10-20

申请人： Kenji Doi ,  Takuhiko Jinno ,  Ayao Moriyama ,  Shingo Uji

发明人： Kenji Doi ,  Takuhiko Jinno ,  Ayao Moriyama ,  Shingo Uji

IPC分类号： C07C29/38 ,  C07C29/80 ,  C07C31/18

CPC分类号： C07C29/80 ,  C07C29/38

摘要： High quality trimethylolalkane can be easily and efficiently produced at a high yield through a reaction between n-alkanal and formaldehyde in the presence of tertiary amine and water, in which a reaction mixture obtained after the reaction is heated up to a temperature at which a salt of tertiary amine with formic acid produced as a by-product can be thermally dissociated so as to distill tertiary amine and water from the reaction mixture, and a formate of trimethylolalkane produced in the distillation of tertiary amine and contained in a residue is reacted with water, ammonia, primary amine or secondary amine; and the tertiary amine distilled from the reaction mixture is reused in producing trimethylolalkane.

摘要翻译： 通过在叔胺和水的存在下通过正链烷醛和甲醛之间的反应，可以以高产率容易且有效地制备高品质的三羟甲基烷烃，其中将反应后获得的反应混合物加热到盐的​​温度 的叔胺与作为副产物产生的甲酸的热分解可以被热解离，以便从反应混合物中蒸馏出叔胺和水，并将在蒸馏叔胺中并含在残余物中的三羟甲基烷烃的甲酸酯与水 ，氨，伯胺或仲胺; 从反应混合物中蒸馏出的叔胺再次用于生产三羟甲基烷烃。