公开(公告)号：US4732636A

公开(公告)日：1988-03-22

申请号：US866516

申请日：1986-05-23

申请人： Kenneth J. Varker

发明人： Kenneth J. Varker

IPC分类号： B29B11/16 ,  B29B15/08 ,  B29B15/12 ,  B29C37/00 ,  B29C70/50 ,  B29C70/54 ,  B29K105/06 ,  B29L9/00 ,  C08J5/24 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46 ,  B32B31/10 ,  B32B31/18

CPC分类号： B29C37/005 ,  B29B15/08 ,  B29C70/50 ,  B29C70/545 ,  H05K1/0366 ,  H05K3/0011 ,  B29C2793/0045 ,  B29K2105/24 ,  B29K2105/243 ,  H05K2201/029 ,  H05K2203/0228 ,  H05K2203/107 ,  H05K2203/1105 ,  H05K3/0026 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T156/13 ,  Y10T428/24314

摘要： Shrinking of partially cured or B-staged resin coated fabric, also known as prepreg, during C-staging or full curing is reduced by cutting at least a plurality of the warp of the fabric in at least one location before C-staging. Prepreg is useful in the computer industry in the manufacture of printed circuit boards.

摘要翻译： 在C阶段或完全固化期间，部分固化或B阶树脂涂层织物（也称为预浸料）的收缩通过在C阶段之前在至少一个位置切割至少多个织物的翘曲来减少。 预浸料在印刷电路板的制造中在计算机工业中是有用的。

公开(公告)号：US4554405A

公开(公告)日：1985-11-19

申请号：US659485

申请日：1984-10-10

申请人： Kenneth J. Varker

发明人： Kenneth J. Varker

IPC分类号： H05K3/10 ,  H05K3/38 ,  H05K3/46 ,  H05K7/06 ,  H05K1/03

CPC分类号： H05K3/103 ,  H05K3/4641 ,  H05K7/06 ,  H05K2201/09309 ,  H05K2201/10287 ,  H05K3/386

摘要： A high density dimensionally stable encapsulated circuit board and a method of making such a board is described. A curable adhesive is utilized to bond insulated wires to a substrate, the dimensional stability of which is maintained by a sheet of relatively thick copper foil. Since the adhesive is cured and since the copper foil returns to the same dimensions when thermally, mechanically or chemically cycled, the entire composite is dimensionally stable.At each location where a connection is to be made to a wire, the wire has a non-linear geometrical portion. The increased dimensional stability plus non-linear shaped portion of the wires allows connections to be made to the board utilizing a very small drill. The result is a high density stable circuit board.

摘要翻译： 描述了高密度尺寸稳定的封装电路板和制造这种板的方法。 使用可固化粘合剂将绝缘电线连接到基板上，其尺寸稳定性由一片较厚的铜箔保持。 由于粘合剂被固化，并且由于铜箔在热，机械或化学循环时返回相同的尺寸，因此整个复合材料尺寸稳定。 在要连接线的每个位置处，线具有非线性几何部分。 增加的尺寸稳定性加上线的非线形部分允许使用非常小的钻头连接到板。 结果是高密度稳定的电路板。

公开(公告)号：US4544439A

公开(公告)日：1985-10-01

申请号：US634527

申请日：1984-07-26

申请人： Joseph M. Solomon ,  Kenneth J. Varker

发明人： Joseph M. Solomon ,  Kenneth J. Varker

IPC分类号： H05K3/26 ,  H05K3/00 ,  H05K3/06 ,  H05K3/22 ,  H05K3/42 ,  C23F1/02 ,  B44C1/22 ,  C03C15/00 ,  C03C25/06

CPC分类号： H05K3/0088 ,  H05K3/225 ,  H05K2203/0763 ,  H05K2203/1147 ,  H05K2203/175 ,  H05K3/06 ,  H05K3/42 ,  H05K3/429 ,  Y10S134/902

摘要： A system for cleaning a thru hole on a substantially planar electrical board. The electrical board has two major surfaces, upper and lower. A first gas and liquid transmission device is connected to the board to introduce etching gas and liquid into the thru hole. The device is adapted to surround the thru hole and seal the periphery thereof on one surface of the board. A second gas and liquid transmission device is connected to the board to remove the etching gas and liquid from the thru hole. This second device is adapted to surround the thru hole and seal the periphery thereof on the other surface of the board. A vacuum system is used to force gas and liquid to move through the thru hole from the first transmission device to the second transmission device, thereby etching and/or cleaning material from the thru hole.In another embodiment of the present invention there are provided transmission devices that are adapted to surround a plurality of thru holes and seal the peripheries thereof on both surfaces of the board.

摘要翻译： 一种用于清洁基本上平面的电路板上的通孔的系统。 电路板有两个主表面，上下两面。 第一气体和液体传输装置连接到板上以将蚀刻气体和液体引入通孔中。 该装置适于围绕通孔并将其周边密封在该板的一个表面上。 第二气体和液体传输装置连接到板上以从通孔去除蚀刻气体和液体。 该第二装置适于围绕通孔并将其周边密封在板的另一表面上。 使用真空系统来迫使气体和液体从第一传动装置穿过通孔移动到第二传动装置，从而从通孔中蚀刻和/或清洁材料。 在本发明的另一个实施例中，提供了适于围绕多个通孔并将其周边密封在板的两个表面上的传动装置。

公开(公告)号：US4662963A

公开(公告)日：1987-05-05

申请号：US762604

申请日：1985-09-11

申请人： Kenneth J. Varker

发明人： Kenneth J. Varker

IPC分类号： H05K3/10 ,  H05K3/38 ,  H05K3/46 ,  H05K7/06 ,  H05K1/03

CPC分类号： H05K3/103 ,  H05K3/4641 ,  H05K7/06 ,  H05K2201/09309 ,  H05K2201/10287 ,  H05K3/386 ,  Y10T29/49162

摘要： A method of making a high density dimensionally stable encapsulated circuit board. A curable adhesive is utilized to bond insulated wires to a substrate, the dimensional stability of which is maintained by a sheet of relatively thick copper foil. Since the adhesive is cured and since the copper foil returns to the same dimensions when thermally, mechanically or chemically cycled, the entire composite is dimensionally stable.At each location where a connection is to be made to a wire, the wire has a non-linear geometrical portion. The increased dimensional stability plus non-linear shaped portion of the wires allows connections to be made to the board utilizing a very small drill. The result is a high density stable circuit board.

摘要翻译： 一种制造高密度尺寸稳定的封装电路板的方法。 使用可固化粘合剂将绝缘电线连接到基板上，其尺寸稳定性由一片较厚的铜箔保持。 由于粘合剂被固化，并且由于铜箔在热，机械或化学循环时返回相同的尺寸，因此整个复合材料尺寸稳定。 在要连接线的每个位置处，线具有非线性几何部分。 增加的尺寸稳定性加上线的非线形部分允许使用非常小的钻头连接到板。 结果是高密度稳定的电路板。