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    Substrate for Optical Device
    1.
    发明申请
    Substrate for Optical Device 审中-公开
    光学元件基板

    公开(公告)号：US20140177242A1

    公开(公告)日：2014-06-26

    申请号：US14232593

    申请日：2012-07-11

    申请人： Ki Myung Nam ,  Young Chul Jun ,  Tae Hwan Song

    发明人： Ki Myung Nam ,  Young Chul Jun ,  Tae Hwan Song

    IPC分类号： H01L33/64

    CPC分类号： H01L33/647 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/62 ,  H01L33/644 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/48505 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/181 ,  H05K1/0204 ,  H05K2201/10106 ,  H05K2201/10416 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599

    摘要： The present invention relates to a substrate for an optical device, which is configured to connect an optical element substrate and an electrode substrate in a fitting manner, and simultaneously, to form one or more bridge pads which are insulated from the optical element substrate by a horizontal insulating layer, on the optical element substrate. The substrate for an optical device according to a first aspect of the present invention comprises: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which are made of an insulating material to form a conductive layer on at least a portion of the upper surface thereof, are connected to both side surfaces of the optical element substrate, respectively, and are wire-bonded to the electrodes of the optical elements; and a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate. The substrate for an optical device according to a second aspect of the present invention comprises: an optical element substrate which is made of a metal plate and contains a plurality of optical elements therein; a pair of electrode substrates which are made of a metal material to be connected to both side surfaces of the optical element substrate, respectively, and are wire-bonded to the electrodes of the optical elements; a fitting means which is formed on the side surfaces of the electrode substrate and the optical element substrate to fit the optical element substrate and the electrode substrate; and a fitting-type vertical insulating layer which is interposed between the optical element substrate and the electrode substrate so as to be connected to the fitting means.

    摘要翻译： 光学元件用基板技术领域本发明涉及一种用于光学元件的基板，其被配置为以配合的方式连接光学元件基板和电极基板，并且同时形成一个或多个与光学元件基板绝缘的桥接焊盘 水平绝缘层，在光学元件基板上。 根据本发明第一方面的用于光学器件的衬底包括：光学元件衬底，其由金属板制成并且在其中包含多个光学元件; 分别在光学元件基板的两个侧表面上分别连接由绝缘材料制成的一对电极基板，以在其上表面的至少一部分上形成导电层，并将其导线接合到电极 的光学元件; 以及形成在电极基板和光学元件基板的侧面上以配合光学元件基板和电极基板的嵌合装置。 根据本发明第二方面的用于光学器件的衬底包括：光学元件衬底，其由金属板制成并且在其中包含多个光学元件; 由金属材料制成的一对电极基片，分别与光学元件基板的两个侧面连接，并且被引线接合到光学元件的电极上; 形成在电极基板和光学元件基板的侧面上以配合光学元件基板和电极基板的嵌合装置; 以及插入在所述光学元件基板和所述电极基板之间的嵌合型垂直绝缘层，以便连接到所述装配装置。