公开(公告)号：US07653991B2

公开(公告)日：2010-02-02

申请号：US12007242

申请日：2008-01-08

申请人： Jee-Soo Mok ,  Jun-Heyoung Park ,  Ki-Hwan Kim ,  Sung-Yong Kim

发明人： Jee-Soo Mok ,  Jun-Heyoung Park ,  Ki-Hwan Kim ,  Sung-Yong Kim

IPC分类号： H05K3/02

CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H05K1/188 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49171 ,  Y10T29/49176

摘要： A method for manufacturing a printed circuit board having an embedded component is disclosed. The method includes: forming at least one contact bump and at least one electrode bump on one side of a base substrate; mounting the component such that the electrode bump is in correspondence with a contact terminal of the component; stacking an insulation layer, in which an opening is formed in correspondence to the component, on the one side of the base substrate, such that the contact bump penetrates the insulation layer; filling a filler in the opening; and stacking a metal layer on the insulation layer. Using the method, the reliability of circuit connections between the component and the circuit patterns can be improved, and the manufacturing process can be reduced in embedding the component in the printed circuit board.

摘要翻译： 公开了一种具有嵌入式部件的印刷电路板的制造方法。 该方法包括：在基底基板的一侧上形成至少一个接触凸块和至少一个电极凸块; 安装所述部件使得所述电极凸起与所述部件的接触端子相对应; 在所述基底基板的一侧上层叠形成有与所述部件对应的开口的绝缘层，使得所述接触凸块穿过所述绝缘层; 在开口填充填料; 并在绝缘层上层叠金属层。 使用该方法，可以提高部件和电路图案之间的电路连接的可靠性，并且可以减少将部件嵌入印刷电路板中的制造工艺。

公开(公告)号：US08222534B2

公开(公告)日：2012-07-17

申请号：US12076118

申请日：2008-03-13

申请人： Jun-Heyoung Park ,  Jee-Soo Mok ,  Ki-Hwan Kim ,  Sung-Yong Kim

发明人： Jun-Heyoung Park ,  Jee-Soo Mok ,  Ki-Hwan Kim ,  Sung-Yong Kim

IPC分类号： H05K1/11 ,  H05K3/02

CPC分类号： H05K3/4614 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4647 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/061 ,  Y10T29/49156

摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board, by forming at least one bump for interlayer conduction on a surface of a board and stacking an insulation layer on the surface of the board, can include the operations of forming at least one dam on the surface of the board that surrounds a region corresponding to the bump, forming the bump by printing conductive paste onto the region corresponding to the bump, and stacking the insulation layer onto the surface of the board. This method can be utilized to improve productivity and resolve the problem of spreading.

摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 制造印刷电路板的方法通过在基板的表面上形成至少一个用于层间导电的凸块并在该表面上堆叠绝缘层的方法可以包括在表面上形成至少一个坝的操作 围绕与凸块相对应的区域的板，通过将导电膏印刷到对应于凸块的区域上形成凸块，并将绝缘层堆叠到板的表面上。 该方法可用于提高生产力并解决传播问题。

公开(公告)号：US20080310132A1

公开(公告)日：2008-12-18

申请号：US12076118

申请日：2008-03-13

申请人： Jun-Heyoung Park ,  Jee-Soo Mok ,  Ki-Hwan Kim ,  Sung-Yong Kim

发明人： Jun-Heyoung Park ,  Jee-Soo Mok ,  Ki-Hwan Kim ,  Sung-Yong Kim

IPC分类号： H05K3/02 ,  H01R9/00

CPC分类号： H05K3/4614 ,  H05K3/0035 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4647 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2203/0554 ,  H05K2203/061 ,  Y10T29/49156

摘要： A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing a printed circuit board, by forming at least one bump for interlayer conduction on a surface of a board and stacking an insulation layer on the surface of the board, can include the operations of forming at least one dam on the surface of the board that surrounds a region corresponding to the bump, forming the bump by printing conductive paste onto the region corresponding to the bump, and stacking the insulation layer onto the surface of the board. This method can be utilized to improve productivity and resolve the problem of spreading.

摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 制造印刷电路板的方法通过在基板的表面上形成至少一个用于层间导电的凸块并在该表面上堆叠绝缘层的方法可以包括在表面上形成至少一个坝的操作 围绕与凸块相对应的区域的板，通过将导电膏印刷到对应于凸块的区域上形成凸块，并将绝缘层堆叠到板的表面上。 该方法可用于提高生产力并解决传播问题。

公开(公告)号：US20080263860A1

公开(公告)日：2008-10-30

申请号：US12007242

申请日：2008-01-08

申请人： Jee-Soo Mok ,  Jun-Heyoung Park ,  Ki-Hwan Kim ,  Sung-Yong Kim

发明人： Jee-Soo Mok ,  Jun-Heyoung Park ,  Ki-Hwan Kim ,  Sung-Yong Kim

IPC分类号： H05K3/02

CPC分类号： H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19041 ,  H05K1/188 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49171 ,  Y10T29/49176

摘要： A method for manufacturing a printed circuit board having an embedded component is disclosed. The method includes: forming at least one contact bump and at least one electrode bump on one side of a base substrate; mounting the component such that the electrode bump is in correspondence with a contact terminal of the component; stacking an insulation layer, in which an opening is formed in correspondence to the component, on the one side of the base substrate, such that the contact bump penetrates the insulation layer; filling a filler in the opening; and stacking a metal layer on the insulation layer. Using the method, the reliability of circuit connections between the component and the circuit patterns can be improved, and the manufacturing process can be reduced in embedding the component in the printed circuit board.

摘要翻译： 公开了一种具有嵌入式部件的印刷电路板的制造方法。 该方法包括：在基底基板的一侧上形成至少一个接触凸块和至少一个电极凸块; 安装所述部件使得所述电极凸起与所述部件的接触端子相对应; 在所述基底基板的一侧上层叠形成有与所述部件对应的开口的绝缘层，使得所述接触凸块穿过所述绝缘层; 在开口填充填料; 并在绝缘层上层叠金属层。 使用该方法，可以提高部件和电路图案之间的电路连接的可靠性，并且可以减少将部件嵌入印刷电路板中的制造工艺。

公开(公告)号：US08058558B2

公开(公告)日：2011-11-15

申请号：US11984115

申请日：2007-11-13

申请人： Jee-Soo Mok ,  Dong-Jin Park ,  Jun-Heyoung Park ,  Ki-Hwan Kim ,  Sung-Young Kim

发明人： Jee-Soo Mok ,  Dong-Jin Park ,  Jun-Heyoung Park ,  Ki-Hwan Kim ,  Sung-Young Kim

IPC分类号： H05K1/00 ,  H05K7/06

CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2203/0554 ,  Y10T29/49155

摘要： A printed circuit board and a manufacturing method thereof are disclosed. Using a method of manufacturing a printed circuit board which includes forming a circuit pattern, which includes lands, on a first board; forming a paste bump on the land of the first board; and stacking an insulation on a surface of the first board such that the paste bump penetrates the insulation, where the paste bump is formed to cover the land of the first board, the areas of the lands can be reduced to manufacture a printed circuit board of high density, and the contact reliability can be increased due to the increase in contact area between the lands and paste bumps to improve the performance of the high-density printed circuit-board.

摘要翻译： 公开了印刷电路板及其制造方法。 使用制造印刷电路板的方法，其包括在第一板上形成包括焊盘的电路图案; 在第一板的焊盘上形成焊膏; 并且在所述第一板的表面上堆叠绝缘体，使得所述焊膏凸块穿过形成所述焊膏以覆盖所述第一板的焊盘的所述绝缘体，所述焊盘的区域可以被减小以制造印刷电路板 高密度，并且由于焊盘和焊膏之间的接触面积的增加可以提高接触可靠性，以提高高密度印刷电路板的性能。

公开(公告)号：US20080115961A1

公开(公告)日：2008-05-22

申请号：US11984115

申请日：2007-11-13

申请人： Jee-Soo Mok ,  Dong-Jin Park ,  Jun-Heyoung Park ,  Ki-Hwan Kim ,  Sung-Young Kim

发明人： Jee-Soo Mok ,  Dong-Jin Park ,  Jun-Heyoung Park ,  Ki-Hwan Kim ,  Sung-Young Kim

IPC分类号： H05K1/00 ,  H05K3/10 ,  H05K7/06

CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K2201/0367 ,  H05K2201/09563 ,  H05K2203/0554 ,  Y10T29/49155

摘要： A printed circuit board and a manufacturing method thereof are disclosed. Using a method of manufacturing a printed circuit board which includes forming a circuit pattern, which includes lands, on a first board; forming a paste bump on the land of the first board; and stacking an insulation on a surface of the first board such that the paste bump penetrates the insulation, where the paste bump is formed to cover the land of the first board, the areas of the lands can be reduced to manufacture a printed circuit board of high density, and the contact reliability can be increased due to the increase in contact area between the lands and paste bumps to improve the performance of the high-density printed circuit-board.

摘要翻译： 公开了印刷电路板及其制造方法。 使用制造印刷电路板的方法，其包括在第一板上形成包括焊盘的电路图案; 在第一板的焊盘上形成焊膏; 并且在所述第一板的表面上堆叠绝缘体，使得所述焊膏凸块穿过形成所述焊膏以覆盖所述第一板的焊盘的所述绝缘体，所述焊盘的区域可以被减小以制造印刷电路板 高密度，并且由于焊盘和焊膏之间的接触面积的增加可以提高接触可靠性，以提高高密度印刷电路板的性能。

公开(公告)号：US20070059917A1

公开(公告)日：2007-03-15

申请号：US11520729

申请日：2006-09-14

申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Ki-Hwan Kim ,  Sung-Yong Kim

发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Ki-Hwan Kim ,  Sung-Yong Kim

IPC分类号： H01L21/44 ,  H01L21/4763

CPC分类号： H05K3/4664 ,  H05K3/0023 ,  H05K3/1216 ,  H05K3/1258 ,  H05K3/207 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09536 ,  H05K2203/0143 ,  H05K2203/0568

摘要： A manufacturing method for a printed circuit board having a fine pattern is disclosed, comprising: providing a carrier plate; coating the carrier plate with a photosensitive material; forming a first circuit pattern on the photosensitive material; forming a first circuit layer by drying a conductive paste printed into a space between the photosensitive materials where the first circuit pattern is formed; depositing an insulation layer on the first circuit layer; processing via holes penetrating the insulation layer; coating the insulation layer with the photosensitive material and then forming a second circuit pattern in the photosensitive material; forming a second circuit layer and filling the via holes by drying the conductive paste printed into a space between the photosensitive materials, where the second circuit pattern is formed, and the via holes; and removing the carrier plate.

摘要翻译： 公开了一种具有精细图案的印刷电路板的制造方法，包括：提供载板; 用感光材料涂覆载体板; 在感光材料上形成第一电路图案; 通过干燥印刷在形成有第一电路图案的感光材料之间的空间中的导电浆料形成第一电路层; 在第一电路层上沉积绝缘层; 通过贯穿绝缘层的孔加工; 用感光材料涂覆绝缘层，然后在感光材料中形成第二电路图案; 形成第二电路层，并通过干燥印刷在其中形成第二电路图案的感光材料之间的空间中的导电浆料和通孔来填充通孔; 并移除载体板。

公开(公告)号：US20090229875A1

公开(公告)日：2009-09-17

申请号：US12453741

申请日：2009-05-20

申请人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Ki-Hwan Kim ,  Sung-Yong Kim

发明人： Jee-Soo Mok ,  Chang-Sup Ryu ,  Eung-Suek Lee ,  Ki-Hwan Kim ,  Sung-Yong Kim

IPC分类号： H05K1/11

CPC分类号： H05K3/4664 ,  H05K3/0023 ,  H05K3/1216 ,  H05K3/1258 ,  H05K3/207 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09536 ,  H05K2203/0143 ,  H05K2203/0568

摘要： A printed circuit board having a fine pattern and related manufacturing method that includes providing a carrier plate; coating the carrier plate with a photosensitive material; forming a first circuit pattern on the photosensitive material; forming a first circuit layer by drying a conductive paste printed into a space between the photosensitive materials where the first circuit pattern is formed; depositing an insulation layer on the first circuit layer; processing via holes penetrating the insulation layer; coating the insulation layer with the photosensitive material and then forming a second circuit pattern in the photosensitive material; forming a second circuit layer and filling the via holes by drying the conductive paste printed into a space between the photosensitive materials, where the second circuit pattern is formed, and the via holes; and removing the carrier plate.

摘要翻译： 一种具有精细图案和相关制造方法的印刷电路板，包括提供载板; 用感光材料涂覆载体板; 在感光材料上形成第一电路图案; 通过干燥印刷在形成有第一电路图案的感光材料之间的空间中的导电浆料形成第一电路层; 在第一电路层上沉积绝缘层; 通过贯穿绝缘层的孔加工; 用感光材料涂覆绝缘层，然后在感光材料中形成第二电路图案; 形成第二电路层，并通过干燥印刷在其中形成第二电路图案的感光材料之间的空间中的导电浆料和通孔来填充通孔; 并移除载体板。

公开(公告)号：US07836590B2

公开(公告)日：2010-11-23

申请号：US12068124

申请日：2008-02-01

申请人： Jee-Soo Mok ,  Jun-Heyoung Park

发明人： Jee-Soo Mok ,  Jun-Heyoung Park

IPC分类号： H01K3/10

CPC分类号： H05K3/205 ,  H05K3/06 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4647 ,  H05K3/4682 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/0384 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49165

摘要： A manufacturing method for a printed circuit board is disclosed. The method includes: forming a first circuit pattern on a metal layer of a conductive carrier, which has the metal layer stacked on one side, pressing the conductive carrier and a first insulation layer together with the first circuit pattern facing the first insulation layer, forming a via by selectively removing the conductive carrier, and removing the metal layer. Using this method, a high-density thin package can be manufactured with increased reliability, and the productivity of the manufacturing process can also be improved.

摘要翻译： 公开了印刷电路板的制造方法。 该方法包括：在导电载体的金属层上形成第一电路图案，该金属层具有堆叠在一侧的金属层，将导电载体和第一绝缘层与第一电路图形一起压在第一绝缘层上，形成 通过选择性地去除导电载体并除去金属层。 使用这种方法，可以以更高的可靠性制造高密度薄封装，并且还可以提高制造工艺的生产率。

公开(公告)号：US20090321109A1

公开(公告)日：2009-12-31

申请号：US12352090

申请日：2009-01-12

申请人： Jun-Oh Hwang ,  Jee-Soo Mok ,  Jun-Heyoung Park ,  Kyung-Ah Lee ,  Eung-Suek Lee

发明人： Jun-Oh Hwang ,  Jee-Soo Mok ,  Jun-Heyoung Park ,  Kyung-Ah Lee ,  Eung-Suek Lee

IPC分类号： H05K7/20 ,  H05K3/10

CPC分类号： B82Y10/00 ,  H05K1/0206 ,  H05K1/056 ,  H05K1/183 ,  H05K3/005 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4647 ,  H05K3/4652 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0108 ,  H05K2203/1131 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165

摘要： A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.

摘要翻译： 公开了印刷电路板和印刷电路板的制造方法。 该方法可以包括 提供绝缘层，其中第一金属层形成在绝缘层的一侧上; 在绝缘层上形成凹槽; 在所述槽的内侧和所述绝缘层的另一侧上形成金属物质; 以及通过去除所述第一金属层的一部分，在所述绝缘层的一侧中的至少一个和形成在所述凹槽上的所述金属物质之间形成第一电路图案。 本发明通过设置与基板直接接触的散热器和印刷电路板的制造方法来提供具有高发热效率的印刷电路板。