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公开(公告)号：US5266654A
公开(公告)日：1993-11-30
申请号：US736439
申请日：1991-07-26
申请人： Mikio Kitahara , Koichi Machida , Takayuki Kubo , Motoyuki Torikai , Koutarou Asahina , Junsuke Tanaka , Akihiro Yamaguchi
发明人： Mikio Kitahara , Koichi Machida , Takayuki Kubo , Motoyuki Torikai , Koutarou Asahina , Junsuke Tanaka , Akihiro Yamaguchi
IPC分类号： C08K5/3415 , C08L61/06 , C08L63/00 , C08L65/00 , C08L79/08 , H01B3/30 , H01B3/36 , H01B3/40 , C08G73/10 , C08L61/32
摘要： A resin composition for sealing semiconductors which comprises an organic component (A) which contains (a) a polymaleimide compound represented by the formula (I): ##STR1## wherein R.sub.1 is a m-valent organic group having two or more carbon atoms and m is an integer of two or more and (b) a phenolic aralkyl resin represented by the formula (II): ##STR2## wherein X is a divalent group having the formula ##STR3## and n is an integer of from 0 to 100, or contains a mixture of the phenolic aralkyl resin and a phenol, and component (B) which contains an inorganic filler.
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2.发明授权Heat-resistant epoxy resin composition based on 2-(4-hydroxyphenyl)-2-(4-maleimidophenyl)propane 失效基于2-（4-羟基苯基）-2-（4-马来酰亚胺基苯基）丙烷的耐热环氧树脂组合物
公开(公告)号：US5079331A
公开(公告)日：1992-01-07
申请号：US527267
申请日：1990-05-23
申请人： Mikio Kitahara , Koichi Machida , Takayuki Kubo , Motoyuki Torikai , Koutarou Asahina , Yoshimitsu Tanabe , Keizaburo Yamaguchi , Akihiro Yamaguchi
发明人： Mikio Kitahara , Koichi Machida , Takayuki Kubo , Motoyuki Torikai , Koutarou Asahina , Yoshimitsu Tanabe , Keizaburo Yamaguchi , Akihiro Yamaguchi
IPC分类号： H01L23/29 , C07D207/44 , C07D207/452 , C08G59/40 , C08K5/3415 , H01L23/31
CPC分类号： C07D207/452 , C08K5/3415
摘要： Heat-resistant epoxy resin composition obtained by incorporation of 2-(4-hydroxyphenyl)-2-(4-maleimidophenyl)propane in a resin composition consisting esssentially of epoxy resin and an epoxy hardener is disclosed.
摘要翻译： 公开了通过在由环氧树脂和环氧固化剂组成的树脂组合物中引入2-（4-羟基苯基）-2-（4-马来酰亚胺基苯基）丙烷获得的耐热环氧树脂组合物。
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3.发明授权Composition of vinyl polymer-grafted, silicone polymer-modified epoxy resin and polymaleimide 失效乙烯基聚合物接枝，硅氧烷聚合物改性环氧树脂和聚马来酰亚胺的组成
公开(公告)号：US5015674A
公开(公告)日：1991-05-14
申请号：US386700
申请日：1989-07-31
IPC分类号： C08G59/00 , C08G59/14 , C08G59/40 , C08K3/00 , C08L63/00 , H01B3/30 , H01B3/40 , H01L23/29 , H01L23/31
CPC分类号： H01B3/40 , C08G59/4042 , C08L63/00 , H01B3/306
摘要： A resin composition for sealing semiconductors which comprises (a) an epoxy resin, (b) a hardening agent, (c) an inorganic filler and (d) a polymaleimide having a specific structure is herein provided. Preferably, the resin composition comprises, as all of or a part of the epoxy resin, a modified epoxy resin composed of (i) a graft polymer of an epoxy resin and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the graft polymer. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal semiconductor devices on a large scale having degree of integration or small-sized, thin semiconductors such as flat packages, these semiconductors provide high reliability.
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公开(公告)号：US5120803A
公开(公告)日：1992-06-09
申请号：US401841
申请日：1989-09-01
IPC分类号： C08G59/00 , C08G59/06 , C08G59/08 , C08G59/10 , C08G59/20 , C08G59/28 , C08G59/32 , C08K3/00 , C08L51/08 , C08L63/00 , C08L63/02 , C08L63/04 , H01L23/29 , H01L23/31
CPC分类号： C08L51/08 , C08G59/063 , C08G59/10 , C08G59/3218 , C08G59/3227 , C08L63/00
摘要： A resin composition for sealing semiconductors which comprises (a) a modified epoxy resin composed of (i) an epoxy resin having a specific structure or a graft polymer of an epoxy resin having a specific structure and a vinyl polymer and (ii) a silicone polymer in oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the epoxy resin or the graft polymer, (b) a hardening agent and (c) an inorganic filler, is herein provided. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal large-scale semiconductor devices having high degree of integration or small-sized, thin semiconductors such as flat packages, these semiconductors provide high reliability.
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5.发明授权Semiconductor sealing composition containing epoxy resin and polymaleimide 失效含有环氧树脂和聚马来酰亚胺的半导体密封组合物
公开(公告)号：US5082880A
公开(公告)日：1992-01-21
申请号：US404575
申请日：1989-09-08
IPC分类号： C08F283/10 , C08G59/00 , C08G59/06 , C08G59/08 , C08G59/10 , C08G59/32 , C08G59/40 , C08K3/00 , C08L63/00 , C08L63/02 , C08L63/04 , C09K3/10 , H01L23/29 , H01L23/31 , C08L79/08
CPC分类号： C09K3/1018 , C08F283/10 , C08G59/3218 , C08G59/3227 , C08G59/4042 , C08L63/00 , C09K2200/0625 , C09K2200/0647 , C09K2200/0672 , C09K2200/0685
摘要： A resin composition for sealing semiconductors which comprises (a) an epoxy resin having a specific structure, a modified epoxy resin composed of (i) an epoxy resin having a specific structure or a graft polymer of an epoxy resin having a specific structure and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the epoxy resin or the graft polymer, (b) a hardening agent (c) an inorganic filler and (d) a special polymaleimide is herein provided. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal large-scale semiconductor devices having high degree of integration or small-sized, this semiconductors such as flat packages, there semiconductors provide high reliability.
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公开(公告)号：US5134204A
公开(公告)日：1992-07-28
申请号：US516718
申请日：1990-05-01
CPC分类号： C08G59/621 , C08G59/3218 , C08G59/4042 , H01L23/293 , H01L2924/0002 , H01L2924/12044
摘要： A resin composition for sealing semiconductors which shows high heat resistance and is suitable for sealing semiconductor devices, etc., and which comprises an organic component containing a polymaleimide compound represented by the general formula: ##STR1## where R.sub.1 is a m-valent organic group having at least 2 carbon atoms and m is a positive integer of 2 or more, epoxy compounds mainly consisting of an epoxy compound represented by the general formula: ##STR2## where n is a positive integer of 3-16 and a compound having two or more phenolic hydroxyl groups, and an inorganic filler.
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公开(公告)号：US20050100738A1
公开(公告)日：2005-05-12
申请号：US10978379
申请日：2004-11-02
IPC分类号： C08L79/08 , B32B27/04 , B32B27/20 , C08K3/34 , C08K5/11 , C08K9/02 , C08L61/06 , C08L63/00 , H01B3/40 , H05K1/03
CPC分类号： C08K3/34 , H05K1/0373 , H05K2201/0209 , Y10T428/31504 , Y10T428/31721
摘要： The present invention is to provide a resin composition having sufficient rigidity and superior in the workability as well even if the thickness is as thin as 0.2 mm or less, and a prepreg and a laminate obtained from the resin composition. The resin composition comprises resin component containing a (A) compound having a maleimide group and (B) calcinated talc, wherein the calcinated talc is contained not less than 30 weight parts and not more than 250 weight parts to 100 weight parts of the total amount of the resin component containing a (A) compound having a maleimide group.
摘要翻译： 本发明提供一种树脂组合物，即使厚度薄至0.2mm以下也能够得到刚性好，加工性优异的树脂组合物，以及由树脂组合物得到的预浸料和层叠体。 树脂组合物包含含有具有马来酰亚胺基团的（A）化合物和（B）煅烧滑石的树脂组分，其中煅烧滑石含有不少于30重量份且不超过250重量份至100重量份的总量 的树脂组分含有具有马来酰亚胺基团的（A）化合物。
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公开(公告)号：US07470471B2
公开(公告)日：2008-12-30
申请号：US10978379
申请日：2004-11-02
IPC分类号： B32B27/04
CPC分类号： C08K3/34 , H05K1/0373 , H05K2201/0209 , Y10T428/31504 , Y10T428/31721
摘要： The present invention is to provide a resin composition having sufficient rigidity and superior in the workability as well even if the thickness is as thin as 0.2 mm or less, and a prepreg and a laminate obtained from the resin composition. The resin composition comprises resin component containing a (A) compound having a maleimide group and (B) calcinated talc, wherein the calcinated talc is contained not less than 30 weight parts and not more than 250 weight parts to 100 weight parts of the total amount of the resin component containing a (A) compound having a maleimide group.
摘要翻译： 本发明提供一种树脂组合物，即使厚度薄至0.2mm以下也能够得到刚性好，加工性优异的树脂组合物，以及由树脂组合物得到的预浸料和层叠体。 树脂组合物包含含有具有马来酰亚胺基团的（A）化合物和（B）煅烧滑石的树脂组分，其中煅烧滑石含有不少于30重量份且不超过250重量份至100重量份的总量 的树脂组分含有具有马来酰亚胺基团的（A）化合物。
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公开(公告)号：US20050095434A1
公开(公告)日：2005-05-05
申请号：US10978403
申请日：2004-11-02
CPC分类号： B32B5/26 , B32B2260/046 , B32B2305/076 , B32B2307/3065 , B32B2307/7242 , B32B2457/08 , C08L61/06 , C08L63/00 , H05K1/0353 , Y10T428/31511 , Y10T428/31515 , C08L2666/22
摘要： The present invention is to provide a laminate which is halogen-free, has sufficient flame retardancy even when a thickness is not more than 0.2 mm, and has sufficient humidity resistance and hygroscopic solder heat resistance. A resin composition comprising: (A) a compound having at least two or more maleimide groups; (B) a phenolic resin; and (C) an epoxy resin; wherein at least one of said (B) or (C) has a naphthalene ring; the total weight of the naphthalene ring when calculated using the OH equivalent and epoxy equivalent of (B) and (C) respectively is not less than 20 weight % to the total weight of (A), (B) and (C) components; and the total sum of the content ratio of the (A) component and that of the naphthalene ring is not less than 65 weight % to the total weight of the (A), (B) and (C) components, and a prepreg and laminate obtained from the same.
摘要翻译： 本发明提供一种无卤素的层压体，即使厚度不大于0.2mm也具有足够的阻燃性，并且具有足够的耐湿性和吸湿性的耐热性。 一种树脂组合物，其包含：（A）具有至少两个或更多个马来酰亚胺基团的化合物; （B）酚醛树脂; 和（C）环氧树脂; 其中所述（B）或（C）中的至少一个具有萘环; 当使用（B）和（C）的OH当量和环氧当量计算时，萘环的总重量不小于（A），（B）和（C）组分的总重量的20重量％ （A）成分和萘环的含有比例的总和相对于（A），（B）和（C）成分的总重量为65重量％以上，预浸料坯 从它们获得的层压板。
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