摘要:
A resin composition for sealing semiconductors which comprises an organic component (A) which contains (a) a polymaleimide compound represented by the formula (I): ##STR1## wherein R.sub.1 is a m-valent organic group having two or more carbon atoms and m is an integer of two or more and (b) a phenolic aralkyl resin represented by the formula (II): ##STR2## wherein X is a divalent group having the formula ##STR3## and n is an integer of from 0 to 100, or contains a mixture of the phenolic aralkyl resin and a phenol, and component (B) which contains an inorganic filler.
摘要:
Heat-resistant epoxy resin composition obtained by incorporation of 2-(4-hydroxyphenyl)-2-(4-maleimidophenyl)propane in a resin composition consisting esssentially of epoxy resin and an epoxy hardener is disclosed.
摘要:
A resin composition for sealing semiconductors which comprises (a) an epoxy resin, (b) a hardening agent, (c) an inorganic filler and (d) a polymaleimide having a specific structure is herein provided. Preferably, the resin composition comprises, as all of or a part of the epoxy resin, a modified epoxy resin composed of (i) a graft polymer of an epoxy resin and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the graft polymer. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal semiconductor devices on a large scale having degree of integration or small-sized, thin semiconductors such as flat packages, these semiconductors provide high reliability.
摘要:
A resin composition for sealing semiconductors which comprises (a) an epoxy resin having a specific structure, a modified epoxy resin composed of (i) an epoxy resin having a specific structure or a graft polymer of an epoxy resin having a specific structure and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the epoxy resin or the graft polymer, (b) a hardening agent (c) an inorganic filler and (d) a special polymaleimide is herein provided. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal large-scale semiconductor devices having high degree of integration or small-sized, this semiconductors such as flat packages, there semiconductors provide high reliability.
摘要:
A resin composition for sealing semiconductors which comprises (a) a modified epoxy resin composed of (i) an epoxy resin having a specific structure or a graft polymer of an epoxy resin having a specific structure and a vinyl polymer and (ii) a silicone polymer in oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the epoxy resin or the graft polymer, (b) a hardening agent and (c) an inorganic filler, is herein provided. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption. Therefore, if the composition is used to seal large-scale semiconductor devices having high degree of integration or small-sized, thin semiconductors such as flat packages, these semiconductors provide high reliability.
摘要:
A semiconductor sealing resin composition which comprises (a) a modified epoxy resin which is a graft copolymer of a epoxy resin and a vinyl polymer having dispersed therein a silicone rubber with an average particle diameter less than 1.0.mu.; (b) a curing agent; and (c) an inorganic filler. The sealing composition has a low elastic modulus, a low heat expansion coefficient, a high resistance to heat and a high resistance to thermal expansion.
摘要:
A resin composition for sealing semiconductors which shows high heat resistance and is suitable for sealing semiconductor devices, etc., and which comprises an organic component containing a polymaleimide compound represented by the general formula: ##STR1## where R.sub.1 is a m-valent organic group having at least 2 carbon atoms and m is a positive integer of 2 or more, epoxy compounds mainly consisting of an epoxy compound represented by the general formula: ##STR2## where n is a positive integer of 3-16 and a compound having two or more phenolic hydroxyl groups, and an inorganic filler.
摘要:
Arranged within a cylindrical housing are capturing cells each including a cylindrical outer electrode capable of capturing particulates and an inner electrode inserted into the outer electrode and lined at its outer surface with a dielectric. A divergent exhaust unit is arranged on an end of the housing so as to guide exhaust to interiors in the respective capturing cells. A convergent exhaust unit is arranged on the other end of the housing so as to communicate with a gap between an inner surface of the housing and outer surfaces of the outer electrodes in the respective cells. The inner and outer electrodes are connected to an electric discharge controller.
摘要:
A resin composition for sealing liquid crystal cells comprising as principal ingredients epoxy resin containing a polysulfide modified epoxy resin, hydrazide compounds and fillers.The said epoxy resin contains a polysulfide modified epoxy resin expressed by the general formula (1) in an amount of 20 to 100% by weight in the entire epoxy resin and the average molecular weight of the entire epoxy resin is between 300 and 3000. Formula (1) is defined as follows: ##STR1## where each of R.sup.1 and R.sup.3 represents at least one organic group selected from a group consisting of bisphenol structures, aliphatic oxyether structures and aliphatic thioether structures and R.sup.2 represents a polysulfide structure expressed by --(C.sub.2 H.sub.4 OCH.sub.2 OC.sub.2 H.sub.4 S.sub.m).sub.n --, wherein m represents the number of sulfur atoms contained in a polysulfide structure, which is 1 or 2, and n represents the average number of polysulfide structures contained in the above formula, which is between 1 and 50.A film-made liquid crystal cell made by using the resin composition is excellent in adhesion, flexibility, electric properties and has high reliability.
摘要翻译:一种用于密封液晶单元的树脂组合物,其包含含有多硫化物改性环氧树脂,酰肼化合物和填料的作为主要成分的环氧树脂。 所述环氧树脂在整个环氧树脂中含有由通式(1)表示的多硫化物改性环氧树脂,其量为20〜100重量%,整个环氧树脂的平均分子量为300-3000。式 (1)定义如下:其中R1和R3各自表示选自双酚结构,脂族氧醚结构和脂族硫醚结构中的至少一种有机基团,R 2表示由下式表示的多硫结构: - (C 2 H 4 OCH 2 OC 2 H 4 Sm)n - ,其中m表示多硫化物结构中所含的硫原子数,其为1或2,n表示上式中所含的多硫化物结构的平均数,介于1和50之间。 通过使用该树脂组合物制成的薄膜液晶单元具有优异的粘合性,柔韧性,电性能,并具有高可靠性。
摘要:
A control rod includes a tie-rod, a handle mounted to an upper end portion of the tie-rod, either a connector plate or a fall velocity limiter mounted to a lower end portion of the tie-rod, sheaths having a U-shaped cross-section, welded intermittently to the tie-rod at a plurality of locations in the axial direction of the tie-rod, and having an upper end welded to the handle and a lower end welded to either the connector plate or the fall velocity limiter, and a neutron absorbing member disposed inside each of the sheaths. An upper end of a weld portion located at uppermost position in an axial direction of the tie-rod among a plurality of weld portions between the tie-rod and the sheath is disposed at a position within a range between 0.8 and 13% of total axial length Ls of the sheath below an upper end of the sheath.