Resin composition for pattern formation, pattern formation method and process for producing light-emitting element
    1.
    发明授权
    Resin composition for pattern formation, pattern formation method and process for producing light-emitting element 有权
    用于图案形成的树脂组合物,图案形成方法和用于制造发光元件的方法

    公开(公告)号:US08628673B2

    公开(公告)日:2014-01-14

    申请号:US13319928

    申请日:2010-05-12

    IPC分类号: B29D11/00

    摘要: Disclosed are: a resin composition for pattern formation, which enables the stable formation of a pattern at a level of the wavelength of light; a method for forming a pattern having a sea-island structure using the composition; and a process for producing a light-emitting element that can achieve high luminous efficiency properties. The resin composition for pattern formation comprises: (a) a specific block copolymer containing an aromatic ring-containing polymer and a poly(meth)acrylate as block moieties; (b) a homopolymer of a specific aromatic ring-containing polymer; and (c) a homopolymer of a specific poly(meth)acrylate, wherein the ratio of the total amount of the aromatic ring-containing homopolymer (b) and the poly(meth)acrylate homopolymer (c) relative to the entire resin composition is 0% by weight to 90% by weight, and the total amount of an aromatic ring-containing polymer moiety contained in the block copolymer (a) as a block moiety and the aromatic ring-containing homopolymer (b) relative to the entire resin composition is 10% by weight to 60% by weight.

    摘要翻译: 公开了一种用于图案形成的树脂组合物,其能够在光的波长水平上稳定地形成图案; 使用该组合物形成具有海岛结构的图案的方法; 以及能够实现高发光效率的发光元件的制造方法。 用于图案形成的树脂组合物包括:(a)含有含芳环的聚合物和聚(甲基)丙烯酸酯作为嵌段部分的特定嵌段共聚物; (b)特定含芳环聚合物的均聚物; 和(c)特定聚(甲基)丙烯酸酯的均聚物,其中所述含芳环的均聚物(b)和聚(甲基)丙烯酸酯均聚物(c)的总量相对于整个树脂组合物的比例为 0重量%〜90重量%,作为嵌段部分的嵌段共聚物(a)中含有的含芳香环的聚合物部分和含芳环的均聚物(b)的总量相对于树脂组合物的总量 为10重量%〜60重量%。

    RESIN COMPOSITION FOR PATTERN FORMATION, PATTERN FORMATION METHOD AND PROCESS FOR PRODUCING LIGHT-EMITTING ELEMENT
    2.
    发明申请
    RESIN COMPOSITION FOR PATTERN FORMATION, PATTERN FORMATION METHOD AND PROCESS FOR PRODUCING LIGHT-EMITTING ELEMENT 有权
    图案形成树脂组合物,图案形成方法和生产发光元件的方法

    公开(公告)号:US20120097640A1

    公开(公告)日:2012-04-26

    申请号:US13319928

    申请日:2010-05-12

    摘要: Disclosed are: a resin composition for pattern formation, which enables the stable formation of a pattern at a level of the wavelength of light; a method for forming a pattern having a sea-island structure using the composition; and a process for producing a light-emitting element that can achieve high luminous efficiency properties. The resin composition for pattern formation comprises: (a) a specific block copolymer containing an aromatic ring-containing polymer and a poly(meth)acrylate as block moieties; (b) a homopolymer of a specific aromatic ring-containing polymer; and (c) a homopolymer of a specific poly(meth)acrylate, wherein the ratio of the total amount of the aromatic ring-containing homopolymer (b) and the poly(meth)acrylate homopolymer (c) relative to the entire resin composition is 0% by weight to 90% by weight, and the total amount of an aromatic ring-containing polymer moiety contained in the block copolymer (a) as a block moiety and the aromatic ring-containing homopolymer (b) relative to the entire resin composition is 10% by weight to 60% by weight.

    摘要翻译: 公开了一种用于图案形成的树脂组合物,其能够在光的波长水平上稳定地形成图案; 使用该组合物形成具有海岛结构的图案的方法; 以及能够实现高发光效率的发光元件的制造方法。 用于图案形成的树脂组合物包括:(a)含有含芳环的聚合物和聚(甲基)丙烯酸酯作为嵌段部分的特定嵌段共聚物; (b)特定含芳环聚合物的均聚物; 和(c)特定聚(甲基)丙烯酸酯的均聚物,其中所述含芳环的均聚物(b)和聚(甲基)丙烯酸酯均聚物(c)的总量相对于整个树脂组合物的比例为 0重量%〜90重量%,作为嵌段部分的嵌段共聚物(a)中含有的含芳香环的聚合物部分和含芳环的均聚物(b)相对于树脂组合物的总量 为10重量%〜60重量%。

    Semiconductor light-emitting device and process for production thereof
    3.
    发明授权
    Semiconductor light-emitting device and process for production thereof 有权
    半导体发光装置及其制造方法

    公开(公告)号:US09324914B2

    公开(公告)日:2016-04-26

    申请号:US12712693

    申请日:2010-02-25

    IPC分类号: H01L33/00 H01L33/38 H01L33/40

    摘要: A semiconductor light-emitting device capable of keeping high luminance intensity even if electric power increases, and suitable for lighting instruments such as lights and lamps. The semiconductor device includes a metal electrode layer provided with openings, and is so large in size that the electrode layer has, for example, an area of 1 mm2 or more. The openings have a mean diameter of 10 nm to 2 μm, and penetrate through the metal electrode layer. The metal electrode layer can be produced by use of self-assembling of block copolymer or by nano-imprinting techniques.

    摘要翻译: 即使电力增加也能够保持高亮度强度的半导体发光装置,适用于灯具等照明装置。 半导体器件包括设置有开口的金属电极层,其尺寸如此大,使得电极层具有例如1mm 2以上的面积。 开口的平均直径为10nm〜2μm,贯穿金属电极层。 金属电极层可以通过使用嵌段共聚物的自组装或通过纳米压印技术来制备。

    Semiconductor light emitting device and method for manufacturing the same
    4.
    发明授权
    Semiconductor light emitting device and method for manufacturing the same 有权
    半导体发光器件及其制造方法

    公开(公告)号:US08921887B2

    公开(公告)日:2014-12-30

    申请号:US13221319

    申请日:2011-08-30

    IPC分类号: H01L33/62 H01L33/38

    摘要: According to one embodiment, a semiconductor light emitting device includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer. The device also includes a first electrode layer having electrical continuity with the first semiconductor layer and a second electrode layer provided on the second semiconductor layer, the second electrode layer including a metal portion having a thickness not less than 10 nanometers and not more than 100 nanometers along a direction from the first semiconductor layer to the second semiconductor layer. A plurality of apertures penetrates the metal portion along the direction, each of the apertures viewed along the direction having equivalent circle diameters of not less than 10 nanometers and not more than 5 micrometers, and a Schottky barrier is provided between the second semiconductor layer and the metal portion.

    摘要翻译: 根据一个实施例,半导体发光器件包括第一导电类型的第一半导体层,第二导电类型的第二半导体层和设置在第一半导体层和第二半导体层之间的发光层。 该器件还包括与第一半导体层具有电连续性的第一电极层和设置在第二半导体层上的第二电极层,第二电极层包括厚度不小于10纳米且不大于100纳米的金属部分 沿着从第一半导体层到第二半导体层的方向。 多个孔沿着该方向穿过金属部分,沿着具有等于10纳米且不超过5微米的等效圆直径的方向观察每个孔,并且在第二半导体层和第二半导体层之间设置肖特基势垒 金属部分。

    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    5.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    半导体发光器件及其制造方法

    公开(公告)号:US20120132948A1

    公开(公告)日:2012-05-31

    申请号:US13229972

    申请日:2011-09-12

    IPC分类号: H01L33/36

    CPC分类号: H01L33/38 H01L2933/0016

    摘要: According to one embodiment, a semiconductor light emitting device includes a light emitter, a first and a second electrode layer, a pad electrode and an auxiliary electrode portion. The emitter includes a first semiconductor layer provided on one side of the emitter, a second semiconductor layer provided on one other side of the emitter, and a light emitting layer provided between the first and second semiconductor layers. The first electrode layer is provided on opposite side of the second semiconductor layer from the first semiconductor layer and includes a metal layer and a plurality of apertures penetrating through the metal layer. The second electrode layer is electrically continuous with the first semiconductor layer. The pad electrode is electrically continuous with the first electrode layer. The auxiliary electrode portion is electrically continuous with the first electrode layer and extends in a second direction orthogonal to the first direction.

    摘要翻译: 根据一个实施例,半导体发光器件包括光发射器,第一和第二电极层,焊盘电极和辅助电极部分。 发射极包括设置在发射极一侧的第一半导体层,设置在发射极的另一侧的第二半导体层以及设置在第一和第二半导体层之间的发光层。 第一电极层设置在第二半导体层的与第一半导体层相反的一侧上,并且包括金属层和贯穿金属层的多个孔。 第二电极层与第一半导体层电连接。 焊盘电极与第一电极层电连接。 辅助电极部分与第一电极层电连续并沿与第一方向正交的第二方向延伸。

    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    6.
    发明申请
    SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
    半导体发光器件及其制造方法

    公开(公告)号:US20120056155A1

    公开(公告)日:2012-03-08

    申请号:US13037990

    申请日:2011-03-01

    摘要: A semiconductor light emitting device includes a structural body, a first electrode layer, and a second electrode layer. The structural body includes a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, and a light emitting layer between the first semiconductor layer and the second semiconductor layer. The first electrode layer includes a metal portion, a plurality of first opening portions, and at least one second opening portion. The metal portion has a thickness of not less than 10 nanometers and not more than 200 nanometers along a direction from the first semiconductor layer toward the second semiconductor layer. The plurality of first opening portions each have a circle equivalent diameter of not less than 10 nanometers and not more than 1 micrometer. The at least one second opening portion has a circle equivalent diameter of more than 1 micrometer and not more than 30 micrometers.

    摘要翻译: 半导体发光器件包括结构体,第一电极层和第二电极层。 结构体包括第一导电类型的第一半导体层,第二导电类型的第二半导体层以及第一半导体层和第二半导体层之间的发光层。 第一电极层包括金属部分,多个第一开口部分和至少一个第二开口部分。 金属部分沿着从第一半导体层朝向第二半导体层的方向具有不小于10纳米且不大于200纳米的厚度。 多个第一开口部分的圆当量直径不小于10纳米且不超过1微米。 至少一个第二开口部分具有大于1微米且不超过30微米的圆当量直径。

    SEMICONDUCTOR LIGHT-EMITTING DEVICE, LIGHTING INSTRUMENT EMPLOYING THE SAME AND PROCESS FOR PRODUCTION OF THE SEMICONDUCTOR LIGHT-EMITTING DEVICE
    7.
    发明申请
    SEMICONDUCTOR LIGHT-EMITTING DEVICE, LIGHTING INSTRUMENT EMPLOYING THE SAME AND PROCESS FOR PRODUCTION OF THE SEMICONDUCTOR LIGHT-EMITTING DEVICE 有权
    半导体发光器件,使用其的照明器具和用于生产半导体发光器件的工艺

    公开(公告)号:US20110220936A1

    公开(公告)日:2011-09-15

    申请号:US12876318

    申请日:2010-09-07

    IPC分类号: H01L33/40 H01L21/283

    摘要: A semiconductor light-emitting device according to the embodiment includes a substrate, a compound semiconductor layer, a metal electrode layer provided with particular openings, a light-extraction layer, and a counter electrode. The light-extraction layer has a thickness of 20 to 120 nm and covers at least partly the metal part of the metal electrode layer; or otherwise the light-extraction layer has a rugged structure and covers at least partly the metal part of the metal electrode layer. The rugged structure has projections so arranged that their summits are positioned at intervals of 100 to 600 nm, and the heights of the summits from the surface of the metal electrode layer are 200 to 700 nm.

    摘要翻译: 根据实施例的半导体发光器件包括衬底,化合物半导体层,设置有特定开口的金属电极层,光提取层和对电极。 光提取层的厚度为20〜120nm,至少部分覆盖金属电极层的金属部分。 否则光提取层具有坚固的结构并且至少部分地覆盖金属电极层的金属部分。 凹凸结构具有突出部,使得它们的顶点以100至600nm的间隔定位,并且来自金属电极层的表面的顶点的高度为200至700nm。

    Displaying device and lighting device employing organic electroluminescence element
    8.
    发明授权
    Displaying device and lighting device employing organic electroluminescence element 有权
    使用有机电致发光元件的显示装置和照明装置

    公开(公告)号:US07928353B2

    公开(公告)日:2011-04-19

    申请号:US12392691

    申请日:2009-02-25

    IPC分类号: H01J1/46

    摘要: The Present invention provides an organic EL display and a lighting device having high efficiency. The organic EL display comprises a substrate, a pixel-driving circuit unit, and pixels arranged in the form of a matrix on the substrate. The pixel comprises a light-emitting part, and the light-emitting part is composed of a first electrode placed near to the substrate, a second electrode placed far from the substrate, and at least one organic layer placed between the first and second electrodes. The second electrode has a metal electrode layer having a thickness of 10 nm to 200 nm, and the metal electrode layer comprises a metal part and plural openings penetrating through the layer. The metal part is seamless and formed of metal continuously connected without breaks between any points therein. The openings have an average opening diameter of 10 nm to 780 nm, and are arranged so periodically that the distribution of the arrangement is represented by a radial distribution function curve having a half-width of 5 nm to 300 nm.

    摘要翻译: 本发明提供一种高效率的有机EL显示器和照明装置。 有机EL显示器包括基板,像素驱动电路单元和在基板上以矩阵形式布置的像素。 像素包括发光部分,并且发光部分由放置在基板附近的第一电极,远离基板的第二电极和放置在第一和第二电极之间的至少一个有机层组成。 第二电极具有厚度为10nm至200nm的金属电极层,并且金属电极层包括金属部分和贯穿该层的多个开口。 金属部件是无缝的,并且由连续连接的金属形成,其中任何点之间没有断裂。 开口的平均开口直径为10nm〜780nm,并且周期性地布置,使得布置的分布由半宽度为5nm至300nm的径向分布函数曲线表示。

    Semiconductor light-emitting element and process for production thereof
    9.
    发明授权
    Semiconductor light-emitting element and process for production thereof 失效
    半导体发光元件及其制造方法

    公开(公告)号:US08450768B2

    公开(公告)日:2013-05-28

    申请号:US13335984

    申请日:2011-12-23

    IPC分类号: H01L33/00

    CPC分类号: H01L33/38 H01L2933/0091

    摘要: The present invention provides a semiconductor light-emitting element comprising an electrode part excellent in ohmic contact and capable of emitting light from the whole surface. An electrode layer placed on the light-extraction side comprises a metal part and plural openings. The metal part is so continuous that any pair of point-positions in the part is continuously connected without breaks, and the metal part in 95% or more of the whole area continues linearly without breaks by the openings in a straight distance of not more than ⅓ of the wavelength of light emitted from an active layer. The average opening diameter is of 10 nm to ⅓ of the wavelength of emitted light. The electrode layer has a thickness of 10 nm to 200 nm, and is in good ohmic contact with a semiconductor layer.

    摘要翻译: 本发明提供一种半导体发光元件,其包括欧姆接触性优异且能够从整个表面发光的电极部。 放置在光提取侧的电极层包括金属部分和多个开口。 金属部分是连续的,使得零件中的任何一个点位置连续地连接而不断裂,并且整个区域的95%或更多的金属部分在直线上不间断地继续直线而不断裂,直线距离不大于 从活性层发射的光的1/3。 平均开口直径为发射光波长的10nm至1/3。 电极层的厚度为10nm〜200nm,与半导体层良好的欧姆接触。

    Semiconductor light-emitting device and process for production thereof
    10.
    发明授权
    Semiconductor light-emitting device and process for production thereof 有权
    半导体发光装置及其制造方法

    公开(公告)号:US08357557B2

    公开(公告)日:2013-01-22

    申请号:US12717537

    申请日:2010-03-04

    IPC分类号: H01L33/54

    CPC分类号: H01L33/22 H01L33/005

    摘要: One aspect of the present invention provides a semiconductor light-emitting device improved in luminance, and also provides a process for production thereof. The process comprises a procedure of forming a relief structure on the light-extraction surface of the device by use of a self-assembled film. In that procedure, the light-extraction surface is partly covered with a protective film so as to protect an area for an electrode to be formed therein. The electrode is then finally formed there after the procedure. The process thus reduces the area incapable, due to thickness of the electrode, of being provided with the relief structure. Between the electrode and the light-extraction surface, a contact layer is formed so as to establish ohmic contact between them.

    摘要翻译: 本发明的一个方面提供了一种提高亮度的半导体发光器件,并且还提供了其生产方法。 该方法包括通过使用自组装膜在装置的光提取表面上形成浮雕结构的步骤。 在该过程中,光提取表面部分地被保护膜覆盖,以保护其中形成电极的区域。 然后在程序之后最后形成电极。 该方法因此减小了由于电极的厚度而不能设置有浮雕结构的区域。 在电极和光提取表面之间,形成接触层以在它们之间建立欧姆接触。