公开(公告)号：US20120211269A1

公开(公告)日：2012-08-23

申请号：US13460403

申请日：2012-04-30

Applicant: Kouichi SAITOU ,  Toshiya SHIMIZU

Inventor： Kouichi SAITOU ,  Toshiya SHIMIZU

IPC: H05K1/18 ,  B32B38/10 ,  H05K1/02

CPC classification number: H05K3/38 ,  H01L21/486 ,  H01L23/3114 ,  H01L23/49827 ,  H01L23/525 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/0235 ,  H01L2224/02351 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05647 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/114 ,  H05K3/381 ,  H05K2201/0355 ,  H05K2201/2072 ,  H05K2203/0369 ,  H05K2203/1152 ,  Y10T156/1039 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A device mounting board includes: an insulating resin layer; a wiring layer formed on one of the principal surfaces of the insulating resin layer; a protection layer covering the insulating resin layer and the wiring layer; a protruding electrode electrically connected to the wiring layer, the protruding electrode protruding from the wiring layer toward the insulating resin layer and penetrating through the insulating resin layer; a wiring-layer-side convex portion protruding from the wiring layer toward the insulating resin layer and having the top end thereof located inside the insulating resin layer; and a resin-layer-side convex portion protruding from the protection layer toward the insulating resin layer and having the top end thereof located inside the insulating resin layer.

Abstract translation: 装置安装板包括：绝缘树脂层; 形成在绝缘树脂层的一个主表面上的布线层; 覆盖绝缘树脂层和布线层的保护层; 电连接到所述布线层的突出电极，所述突出电极从所述布线层向所述绝缘树脂层突出并且穿过所述绝缘树脂层; 从布线层向绝缘树脂层突出并且其顶端位于绝缘树脂层内部的布线层侧凸部; 以及从保护层朝向绝缘树脂层突出并且其顶端位于绝缘树脂层内部的树脂层侧凸部。

公开(公告)号：US20090218686A1

公开(公告)日：2009-09-03

申请号：US12394721

申请日：2009-02-27

Applicant: Kouichi SAITOU ,  Yoshio OKAYAMA ,  Yasuyuki YANASE ,  Takahiro FUJII

Inventor： Kouichi SAITOU ,  Yoshio OKAYAMA ,  Yasuyuki YANASE ,  Takahiro FUJII

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L23/5389 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/544 ,  H01L24/11 ,  H01L24/12 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02319 ,  H01L2224/02333 ,  H01L2224/0401 ,  H01L2224/1132 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3511

Abstract: A semiconductor module includes a device mounting board and a semiconductor device mounted on the device mounting board. The device mounting board includes an insulating resin layer, a wiring layer provided on one main surface of the insulating resin layer, and bump electrodes, electrically connected to the wiring layer, which are protruded from the wiring layer toward the insulating resin layer. The semiconductor device has device electrodes which are disposed counter to a semiconductor substrate and the bump electrodes, respectively. The surface of a metallic layer provided on the device electrode lies on the same plane as the surface of a protective layer.

Abstract translation: 半导体模块包括装置安装板和安装在装置安装板上的半导体装置。 装置安装板包括绝缘树脂层，设置在绝缘树脂层的一个主表面上的布线层和从布线层向绝缘树脂层突出的与布线层电连接的凸起电极。 半导体器件具有分别与半导体衬底和凸起电极相对设置的器件电极。 设置在器件电极上的金属层的表面位于与保护层的表面相同的平面上。

公开(公告)号：US20090168391A1

公开(公告)日：2009-07-02

申请号：US12345019

申请日：2008-12-29

Applicant: Kouichi SAITOU ,  Yoshio OKAYAMA ,  Yoh TAKANO ,  Mayumi NAKASATO

Inventor： Kouichi SAITOU ,  Yoshio OKAYAMA ,  Yoh TAKANO ,  Mayumi NAKASATO

IPC: H05K7/00 ,  H01R12/04

CPC classification number: H05K3/4647 ,  H01L21/486 ,  H01L23/3114 ,  H01L23/48 ,  H01L23/49827 ,  H01L23/525 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/81208 ,  H01L2224/81801 ,  H01L2224/81894 ,  H01L2224/83101 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/351 ,  H05K3/4652 ,  H05K2203/0369 ,  Y10T29/4913 ,  Y10T29/49156 ,  H01L2924/00

Abstract: A substrate for mounting a device comprises: an insulating resin layer; a plurality of projected electrodes that are connected electrically to a wiring layer provided on one major surface of the insulating resin layer, and that project toward the insulating resin layer from the wiring layer; and a counter electrode provided at a position corresponding to each of the plurality of projected electrodes on the other major surface of the insulating resin layer. Among the projected electrodes, a projected length of part of the projected electrodes is smaller than that of the other projected electrodes; and the projected electrode and the counter electrode corresponding thereto are capacitively-coupled, and the projected electrode and the counter electrode are connected electrically.

Abstract translation: 用于安装装置的基板包括：绝缘树脂层; 多个突起电极，其电连接到设置在所述绝缘树脂层的一个主表面上的布线层，并且从所述布线层向所述绝缘树脂层突出; 以及设置在与绝缘树脂层的另一个主表面上的多个突出电极中的每一个对应的位置处的对置电极。 在投影电极中，部分投影电极的投影长度小于其他投射电极的投影长度; 并且对应于其的投影电极和对电极电容耦合，并且投影电极和对电极电连接。