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公开(公告)号：US20120161186A1
公开(公告)日：2012-06-28
申请号：US13393408
申请日：2010-10-22
申请人： Kousuke Katabe , Yuki Mori , Akira Miyake , Shingo Matsuura , Masayuki Mori
发明人： Kousuke Katabe , Yuki Mori , Akira Miyake , Shingo Matsuura , Masayuki Mori
IPC分类号： H01L33/50
CPC分类号： H01L33/60 , H01L33/507 , H01L2924/16195 , H01L2924/16315 , H01L2924/181 , H01L2924/00012
摘要： A light-emitting device includes a substrate mounted with a light-emitting element, and a frame disposed on the substrate. The frame includes a first frame portion disposed on the substrate and surrounding the light-emitting element, and having an inner wall surface substantially perpendicular to an upper surface of the substrate, an upper end of the inner wall surface being positioned at a level higher than that of an upper surface of the light-emitting element, and a second frame portion surrounding the inner wall surface of the first frame portion when viewed in a plan view, and having an inner periphery which is so shaped as to extend at an outward incline from a lower end of the inner periphery to an upper thereof. The light-emitting device includes a wavelength converter supported on the frame and opposed to the substrate with a gap.
摘要翻译： 发光装置包括安装有发光元件的基板和设置在基板上的框架。 所述框架包括设置在所述基板上并围绕所述发光元件的第一框架部分，并且具有基本上垂直于所述基板的上表面的内壁表面，所述内壁表面的上端定位在高于 发光元件的上表面以及围绕第一框架部分的内壁表面的平面图中的第二框架部分，并且具有内周，该内周被成形为在向外倾斜 从内周的下端到其上部。 发光装置包括支撑在框架上并与间隙相对的基板的波长转换器。
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公开(公告)号：US08710737B2
公开(公告)日：2014-04-29
申请号：US12294850
申请日：2007-03-28
申请人： Shingo Matsuura , Tomoya Tabuchi , Kousuke Katabe , Yuki Mori , Akira Miyake , Daisuke Sakumoto
发明人： Shingo Matsuura , Tomoya Tabuchi , Kousuke Katabe , Yuki Mori , Akira Miyake , Daisuke Sakumoto
IPC分类号： H01J1/62
CPC分类号： H05B33/02 , F21V13/04 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L2224/83385 , H01L2224/83951
摘要： To improve the luminance of light emitted by a light-emitting device, the light-emitting device includes a base (1) that has an opening part (1p) constituted by a light-reflecting surface (1r) and a bottom surface (1u), a light-emitting chip (2) that is mounted on the bottom surface (1u) of the opening part (1p), a transparent member (3) that covers the light-emitting chip (2), and an optical member (4) that is disposed on the transparent member (3). The transparent member (3) is disposed on the bottom surface (1u) of the opening part (1p) in a state where the transparent member (3) is spaced away from the light-reflecting surface (1r) of the opening part (1p).
摘要翻译： 为了提高发光装置发出的光的亮度，发光装置包括具有由光反射面（1r）和底面（1u）构成的开口部（1p）的基体（1） ，安装在开口部（1p）的底面（1u）上的发光芯片（2），覆盖发光芯片（2）的透明部件（3）和光学部件 ），其设置在透明构件（3）上。 在透明构件（3）与开口部（1p）的光反射面（1r）隔开的状态下，透明构件（3）设置在开口部（1p）的底面（1u） ）。
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公开(公告)号：US08529089B2
公开(公告)日：2013-09-10
申请号：US12810769
申请日：2008-12-26
申请人： Kousuke Katabe , Yuki Mori , Akira Miyake , Shingo Matsuura
发明人： Kousuke Katabe , Yuki Mori , Akira Miyake , Shingo Matsuura
IPC分类号： F21S4/00
CPC分类号： H01L33/60 , F21K9/64 , F21Y2115/10 , H01L33/507 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： A light emitting device includes a base, a sub-mount substrate, and a frame member. The light emitting device further includes a light emitting element and a wavelength converting member. The sub-mount substrate is disposed on the base, and has an upper surface made of a ceramic sintered body. The frame member has a light reflecting portion made of porous ceramics, is disposed on the base, and surrounds the sub-mount substrate. The light emitting element is mounted on the sub-mount substrate. The wavelength converting member covers the light emitting element and the light reflecting portion of the frame member.
摘要翻译： 发光装置包括基座，副安装基板和框架构件。 发光装置还包括发光元件和波长转换构件。 副安装基板设置在基座上，具有由陶瓷烧结体构成的上表面。 框架构件具有由多孔陶瓷制成的光反射部分，设置在基座上并且包围副安装基板。 发光元件安装在副安装基板上。 波长转换部件覆盖框架部件的发光元件和光反射部。
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公开(公告)号：US20080112165A1
公开(公告)日：2008-05-15
申请号：US11940769
申请日：2007-11-15
申请人： Yuki MORI , Akira Miyake , Shingo Matsuura , Kousuke Katabe
发明人： Yuki MORI , Akira Miyake , Shingo Matsuura , Kousuke Katabe
CPC分类号： F21V5/007 , F21K9/68 , F21Y2105/10 , F21Y2115/10
摘要： A lighting apparatus includes a substrate, a plurality of light-emitting chips and a light-emitting member. The substrate has a layer including a base material and a medium. The base material is formed of an inorganic material and includes a plurality of cells. The medium is provided in the cells and has a refractive index lower than that of the inorganic material. The light-emitting chips are made of a semiconductor material and mounted on the substrate. The light-emitting member includes a fluorescent material and is provided above the light-emitting chips.
摘要翻译： 照明装置包括基板，多个发光芯片和发光部件。 基板具有包括基材和介质的层。 基材由无机材料形成，并且包括多个单元。 介质设置在电池中，折射率低于无机材料的折射率。 发光芯片由半导体材料制成并安装在基板上。 发光构件包括荧光材料，并且设置在发光芯片的上方。
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公开(公告)号：US20130200784A1
公开(公告)日：2013-08-08
申请号：US12294850
申请日：2007-03-28
申请人： Shingo Matsuura , Tomoya Tabuchi , Kousuke Katabe , Yuki Mori , Akira Miyake , Daisuke Sakumoto
发明人： Shingo Matsuura , Tomoya Tabuchi , Kousuke Katabe , Yuki Mori , Akira Miyake , Daisuke Sakumoto
CPC分类号： H05B33/02 , F21V13/04 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L2224/83385 , H01L2224/83951
摘要： To improve the luminance of light emitted by a light-emitting device, the light-emitting device includes a base (1) that has an opening part (1p) constituted by a light-reflecting surface (1r) and a bottom surface (1u), a light-emitting chip (2) that is mounted on the bottom surface (1u) of the opening part (1p), a transparent member (3) that covers the light-emitting chip (2), and an optical member (4) that is disposed on the transparent member (3). The transparent member (3) is disposed on the bottom surface (1u) of the opening part (1p) in a state where the transparent member (3) is spaced away from the light-reflecting surface (1r) of the opening part (1p).
摘要翻译： 为了提高发光装置发出的光的亮度，发光装置包括具有由光反射面（1r）和底面（1u）构成的开口部（1p）的基体（1） ，安装在开口部（1p）的底面（1u）上的发光芯片（2），覆盖发光芯片（2）的透明部件（3）和光学部件 ），其设置在透明构件（3）上。 在透明构件（3）与开口部（1p）的光反射面（1r）隔开的状态下，透明构件（3）设置在开口部（1p）的底面（1u） ）。
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公开(公告)号：US20110096526A1
公开(公告)日：2011-04-28
申请号：US12810769
申请日：2008-12-26
申请人： Kousuke Katabe , Yuki Mori , Akira Miyake , Shingo Matsuura
发明人： Kousuke Katabe , Yuki Mori , Akira Miyake , Shingo Matsuura
IPC分类号： F21V9/16
CPC分类号： H01L33/60 , F21K9/64 , F21Y2115/10 , H01L33/507 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： A light emitting device includes a base, a sub-mount substrate, and a frame member. The light emitting device further includes a light emitting element and a wavelength converting member. The sub-mount substrate is disposed on the base, and has an upper surface made of a ceramic sintered body. The frame member has a light reflecting portion made of porous ceramics, is disposed on the base, and surrounds the sub-mount substrate. The light emitting element is mounted on the sub-mount substrate. The wavelength converting member covers the light emitting element and the light reflecting portion of the frame member.
摘要翻译： 发光装置包括基座，副安装基板和框架构件。 发光装置还包括发光元件和波长转换构件。 副安装基板设置在基座上，具有由陶瓷烧结体构成的上表面。 框架构件具有由多孔陶瓷制成的光反射部分，设置在基座上并且包围副安装基板。 发光元件安装在副安装基板上。 波长转换部件覆盖框架部件的发光元件和光反射部。
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7.发明申请Package for housing light-emitting element, light-emitting apparatus and illumination apparatus 审中-公开发光元件用包装体，发光装置和照明装置公开(公告)号：US20050133808A1
公开(公告)日：2005-06-23
申请号：US10978302
申请日：2004-10-29
申请人： Mitsugu Uraya , Daisuke Sakumoto , Akira Miyake , Fumiaki Sekine , Yuki Mori , Mitsuo Yanagisawa , Hiroshi Shibayama , Shingo Matsuura
发明人： Mitsugu Uraya , Daisuke Sakumoto , Akira Miyake , Fumiaki Sekine , Yuki Mori , Mitsuo Yanagisawa , Hiroshi Shibayama , Shingo Matsuura
CPC分类号： H01L33/486 , B41J2/455 , H01L33/508 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/1815 , H01L2933/0091 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting apparatus provides a ceramic-made base body, a frame body, a light-emitting element, a conductor layer and a light-transmitting member. The base body has on its upper surface a mounting portion for the light-emitting element. The frame body is joined to the upper surface of the base body so as to surround the mounting portion, with its inner peripheral surface shaped into a reflection surface. The wiring conductor has its one end formed on the upper surface of the base body and electrically connected to the light-emitting element, and has another end led to a side or lower surface of the base body. The light-transmitting member is disposed inside the frame body so as to cover the light-emitting element, which contains fluorescent materials for performing wavelength conversion. The base body is so designed that ceramic crystal grains range in average particle diameter from 1 to 5 μm.
摘要翻译： 发光装置提供陶瓷制的基体，框体，发光元件，导体层和透光构件。 基体在其上表面上具有用于发光元件的安装部分。 框架体以围绕安装部的方式与基体的上表面接合，其内周面形成为反射面。 布线导体的一端形成在基体的上表面上并与发光元件电连接，另一端被引导到基体的侧面或下表面。 透光构件设置在框体内，以覆盖包含用于进行波长转换的荧光材料的发光元件。 基体的设计使得陶瓷晶粒的平均粒径范围为1〜5μm。
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8.发明申请公开(公告)号：US20090296367A1
公开(公告)日：2009-12-03
申请号：US11909592
申请日：2006-03-23
CPC分类号： H01L33/60 , H01L33/62 , H01L2224/16
摘要： A package includes a base body having a mounting portion for mounting a light-emitting device, a frame-shaped first reflection member attached to the upper surface of the base body, an inner peripheral surface of which is shaped into a first light reflecting surface and surrounds the mounting portion, and a frame-shaped second reflection member attached to the upper surface of the base body, with a spacing secured between an inner peripheral surface of the second reflection member and an outer peripheral surface of the first reflection member, the inner peripheral surface surrounding the first reflection member and having a second light reflecting surface at a location above an upper end of the first reflection member.
摘要翻译： 一种包装体，包括具有用于安装发光装置的安装部的基体，安装在基体的上表面的框状的第一反射构件，其内周面成形为第一光反射面， 围绕安装部的框状的第二反射构件和安装在基体的上表面的框状的第二反射构件，其间隔固定在第二反射构件的内周面与第一反射构件的外周面之间， 围绕第一反射构件的周边表面，并且在第一反射构件的上端上方的位置具有第二光反射表面。
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9.发明授权公开(公告)号：US08029152B2
公开(公告)日：2011-10-04
申请号：US11909592
申请日：2006-03-23
IPC分类号： F21V9/16
CPC分类号： H01L33/60 , H01L33/62 , H01L2224/16
摘要： A package includes a base body having a mounting portion for mounting a light-emitting device, a frame-shaped first reflection member attached to the upper surface of the base body, an inner peripheral surface of which is shaped into a first light reflecting surface and surrounds the mounting portion, and a frame-shaped second reflection member attached to the upper surface of the base body, with a spacing secured between an inner peripheral surface of the second reflection member and an outer peripheral surface of the first reflection member, the inner peripheral surface surrounding the first reflection member and having a second light reflecting surface at a location above an upper end of the first reflection member.
摘要翻译： 一种包装体，包括具有用于安装发光装置的安装部的基体，安装在基体的上表面的框状的第一反射构件，其内周面成形为第一光反射面， 围绕安装部的框状的第二反射构件和安装在基体的上表面的框状的第二反射构件，其间隔固定在第二反射构件的内周面与第一反射构件的外周面之间， 围绕第一反射构件的周边表面，并且在第一反射构件的上端上方的位置具有第二光反射表面。
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公开(公告)号：US20110084295A1
公开(公告)日：2011-04-14
申请号：US12810487
申请日：2008-12-25
申请人： Shingo Matsuura , Daisuke Sakumoto
发明人： Shingo Matsuura , Daisuke Sakumoto
CPC分类号： H01L33/60 , H01L33/507 , H01L33/54 , H01L33/642 , H01L2224/14 , H01L2224/16225
摘要： A light emitting device includes a light emitting element, a base, and a transparent layer. The base has an upper side portion including a first portion and a second portion. The first portion includes a mounting region of the light emitting element, and has a first porosity. The second portion surrounds the first portion, includes a plurality of transparent particles, and has a second porosity larger than the first porosity. The light transmitting layer encapsulates the light emitting element, and is attached to the first portion in a state where the transparent layer is apart from the second portion.
摘要翻译： 发光器件包括发光元件，基底和透明层。 底座具有包括第一部分和第二部分的上侧部分。 第一部分包括发光元件的安装区域，并且具有第一孔隙率。 第二部分围绕第一部分，包括多个透明颗粒，并且具有大于第一孔隙率的第二孔隙率。 透光层封装发光元件，并且在透明层与第二部分分离的状态下附着到第一部分。
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