Abstract:
An interposer element in a multidimensional integrated circuit with stacked elements has one or more conductors, especially power supply lines, coupled through decoupling networks defining low impedance shunts for high frequency signals to ground. The interposer has successive tiers including silicon, metal and dielectric deposition layers. The decoupling network for a conductor has at least one and preferably two reactive transmission lines. A transmission line has an inductor in series with the conductor and parallel capacitances at the inductor terminals. The inductors are formed by traces in spaced metal deposition layers forming coil windings and through vias connecting between layers to permit conductor crossovers. The capacitances are formed by MOScaps in the interposer layers. An embodiment has serially coupled coils with capacitances at the input, output and junction between the coils, wherein the coils are magnetically coupled to form a transformer.
Abstract:
A snap hook has a body, a sliding latch, a resilient element, a swivel and a connector. The body has a shaft and a hook. The shaft is tubular and has an upper end and a lower end. The hook is connected to and extends from the upper end of the shaft. A guide slot is defined longitudinally the shaft and communicates with the lower end of the shaft. Accordingly, no sharp edges are formed near the sliding latch so a person opening the snap hook will not be injured. In addition, assembling the snap hook is easy.
Abstract:
A low power consumption analog-to-digital converter (ADC) is provided. The switched capacitor circuit and the operational amplifier of the pipelined stage within the present low power consumption ADC are designed to close loop, and the operational amplifier is operated at the incomplete settling of the linear settling, namely, the operational amplifier is not operated at the slew state. Therefore, the pipelined stage would not produce signal dependent distortion, such that the gain error produced by the operational amplifier could be seen as a constant gain error.
Abstract:
A low power consumption analog-to-digital converter (ADC) is provided. The switched capacitor circuit and the operational amplifier of the pipelined stage within the present low power consumption ADC are designed to close loop, and the operational amplifier is operated at the incomplete settling of the linear settling, namely, the operational amplifier is not operated at the slew state. Therefore, the pipelined stage would not produce signal dependent distortion, such that the gain error produced by the operational amplifier could be seen as a constant gain error.
Abstract:
Sacrificial electrodes with fractal-shaped are formed on a SAW (surface acoustic wave) device. The sacrificial electrodes discharge electro-static charge in the SAW device for protecting the IDT (inter-digital transducer) from electrostatic break. Moreover, the sacrificial electrodes can control the path and the discharging degree of the electro-static discharge to avoid losing the electro-static discharge protection due to the sacrificial electrodes are broken.
Abstract:
A circuit including a first switch receiving an input reference voltage, a second switch receiving an input testing voltage, the first switch and the second switch are electrically connected in parallel. The circuit further includes a first capacitor electrically connected in series with the first switch and the second switch. The circuit further includes a feedback stage comprising a feedback inverter electrically connected in parallel with a feedback switch, where the feedback stage is electrically connected in series with the first capacitor. The circuit further includes a first inverter electrically connected in series to the feedback stage, and a third switch electrically connected in series with the first inverter. The circuit further includes a second inverter electrically connected in parallel to a third inverter, the second inverter and the third inverter are electrically connected in series to the third switch, and the third inverter outputs a first output signal.
Abstract:
Sacrificial electrodes with fractal-shaped are formed on a SAW (surface acoustic wave) device. The sacrificial electrodes discharge electro-static charge in the SAW device for protecting the IDT (inter-digital transducer) from electrostatic break. Moreover, the sacrificial electrodes can control the path and the discharging degree of the electro-static discharge to avoid losing the electrostatic discharge protection due to the sacrificial electrodes are broken.
Abstract:
Sacrificial electrodes with fractal-shaped are formed on a SAW (surface acoustic wave) device. The sacrificial electrodes discharge electro-static charge in the SAW device for protecting the IDT (inter-digital transducer) from electrostatic break. Moreover, the sacrificial electrodes can control the path and the discharging degree of the electro-static discharge to avoid losing the electrostatic discharge protection due to the sacrificial electrodes are broken.
Abstract:
A method for fabricating a compound semiconductor epitaxial structure includes the following steps. Firstly, a first compound epitaxial layer is formed on a substrate. Then, a continuous epitaxial deposition process is performed to form a second compound epitaxial layer on the first compound epitaxial layer, so that the second compound epitaxial layer has a linearly-decreased concentration gradient of metal. Afterwards, a semiconductor material layer is formed on the second compound epitaxial layer.
Abstract:
A method comprises selecting a region from a layout pattern of an integrated circuit, wherein the region comprises a plurality of functional units, and wherein the functional units are not coupled to each other through a variety of connection components, identifying hot spots in the region using a first threshold and inserting a plurality of decoupling capacitors adjacent to the hot spots.