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    Method to make wafer laser marks visable after bumping process
    3.
    发明授权
    Method to make wafer laser marks visable after bumping process 失效
    晶圆激光标记在碰撞过程之后可见的方法

    公开(公告)号：US06784002B1

    公开(公告)日：2004-08-31

    申请号：US10176940

    申请日：2002-06-21

    申请人： Hui-Peng Wang ,  Kuo-Wei Lin ,  Hwei-Mei Yu ,  Ta-Yang Lin ,  Charles Tseng

    发明人： Hui-Peng Wang ,  Kuo-Wei Lin ,  Hwei-Mei Yu ,  Ta-Yang Lin ,  Charles Tseng

    IPC分类号： H01L2166

    CPC分类号： H01L23/544 ,  H01L24/11 ,  H01L2223/54406 ,  H01L2223/54433 ,  H01L2223/54453 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/3025 ,  Y10S438/975 ,  H01L2224/0401

    摘要： A wafer bumping method comprising the following steps of. A wafer having fields is provided. The wafer having at least one wafer identification character formed thereon within one or more of the fields. A dry film resist is formed over the wafer. Portions of the dry film resist are selectively exposed field by field using a mask whereby the mask is shifted over the one or more fields containing the at least one wafer identification character so that the one or more fields containing the at least one wafer identification character is double exposed after the mask shift so that all of the one or more fields containing the at least one wafer identification character is completely exposed. The selectively exposed dry film resist is developed to remove the non-exposed portions of the dry film resist. Solder is plated over the wafer exposed by the removed portions of the dry film resist to form solder bumps within the fields not containing at least one wafer identification character so that the at least one wafer identification character is readable by optical character recognition.

    摘要翻译： 一种晶片凸块方法，包括以下步骤。 提供具有场的晶片。 该晶片在一个或多个场内形成有至少一个晶片识别字符。 在晶片上形成干膜抗蚀剂。 通过使用掩模场地使干膜抗蚀剂的部分选择性曝光，由此掩模在包含至少一个晶片识别字符的一个或多个场上移动，使得包含至少一个晶片识别字符的一个或多个场是 在掩模移位之后双曝光，使得包含至少一个晶片识别字符的所有一个或多个场完全暴露。 显影出选择性暴露的干膜抗蚀剂以除去干膜抗蚀剂的未曝光部分。 将焊料电镀在由干膜抗蚀剂的去除部分暴露的晶片上，以在不包含至少一个晶片识别字符的场内形成焊料凸块，使得至少一个晶片识别字符可通过光学字符识别来读取。

    Peristaltic pump assembly
    4.
    发明授权
    Peristaltic pump assembly 失效
    蠕动泵总成

    公开(公告)号：US5263830A

    公开(公告)日：1993-11-23

    申请号：US029960

    申请日：1993-03-09

    申请人： Nobuaki Goi ,  Charles Tseng ,  Roberta Scola ,  Eric Myren ,  Dan Hamilton

    发明人： Nobuaki Goi ,  Charles Tseng ,  Roberta Scola ,  Eric Myren ,  Dan Hamilton

    IPC分类号： F04B43/08 ,  F04B43/12

    CPC分类号： F04B43/082

    摘要： A peristaltic pump assembly for pumping a fluid medium from a fluid source through a tubing having a compressible pumping section, which assembly comprises a housing including at least one support wall; a drive shaft journalled substantially loosely to the support wall; a plurality of cam plates eccentrically mounted on the drive shaft in a helical pattern along the drive shaft and rotatable together with the drive shaft for, during a rotation of the drive shaft, driving finger plates sequentially in a direction perpendicular to the drive shaft to cause respective finger tips of the finger plates to engage the pumping section thereby producing a moving zone of occlusion along the pumping section for pumping the fluid medium; and an adjustment mechanism mounted on the support wall for adjustably displacing the drive shaft together with the cam plates and the finger plates in a direction perpendicular thereto. The adjustment mechanism comprises a shaft bearing plate mounted on the support wall for movement in a linear direction parallel to the direction of movement of each finger plate and through which the drive shaft extends rotatably, and a drive member for adjustably moving the bearing plate in the linear direction.

    摘要翻译： 一种蠕动泵组件，用于从流体源通过具有可压缩泵送部分的管道泵送流体介质，该组件包括壳体，该壳体包括至少一个支撑壁; 驱动轴基本上松动地支承在支撑壁上; 沿着驱动轴以螺旋形图案偏心地安装在驱动轴上的多个凸轮板，并与驱动轴一起旋转，在驱动轴的转动期间，在垂直于驱动轴的方向依次驱动指板，使得 指板的相应指尖接合泵送部分，从而产生沿着泵送部分的阻塞运动区域，用于泵送流体介质; 以及安装在支撑壁上的调节机构，用于将驱动轴与凸轮板和指板一起沿与其垂直的方向可调地移动。 调节机构包括安装在支撑壁上的轴承板，用于沿平行于每个指板的运动方向的线性方向运动，并且驱动轴可旋转地延伸;以及驱动构件，用于可调节地将支承板移动到 线性方向。

    Wire-bonded semiconductor device with improved wire arrangement scheme for minimizing abnormal wire sweep
    5.
    发明授权
    Wire-bonded semiconductor device with improved wire arrangement scheme for minimizing abnormal wire sweep 有权
    具有改进的电线布置方案的线接半导体器件，用于最小化异常线扫

    公开(公告)号：US06441501B1

    公开(公告)日：2002-08-27

    申请号：US09678184

    申请日：2000-09-30

    申请人： Charles Tseng ,  Chin-Te Chen ,  Yu-Ting Lai ,  Chung-Pao Wang

    发明人： Charles Tseng ,  Chin-Te Chen ,  Yu-Ting Lai ,  Chung-Pao Wang

    IPC分类号： H01L2352

    CPC分类号： H01L24/85 ,  H01L21/565 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49179 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01074 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00

    摘要： A wire-bonded semiconductor device with an improved wire-arrangement scheme is proposed, which can help minimize abnormal wire sweep during encapsulation process. Among the bonding wires on the semiconductor device, those located in corners would be mostly susceptible to abnormal wire sweep, particularly a high-loop bonding wire that is located in immediate adjacency to a low-loop bonding wire located in one corner of the wire-bonded semiconductor device. To solve this problem, the low-loop bonding wire that is located in immediate adjacency to the sweep-susceptible high-loop bonding wire is erected substantially to the same loop height as the high-loop bonding wire, so that it can serve as a shield to the sweep-susceptible high-loop bonding wire against the flow of injected resin during encapsulation process, thus preventing abnormal wire sweep. Alternatively, if a pair of low-loop bonding wires are located in immediate adjacency to the sweep-susceptible high-loop bonding wire and are bonded to a common double-wire bond pad, these two low-loop bonding wires are arranged in an intercrossed manner, which can also help reduce the impact of the injected resin on the sweep-susceptible high-loop bonding wire, thus preventing abnormal wire sweep. The prevention of abnormal wire sweep allows the finished semiconductor device to be more assured in quality and reliability.

    摘要翻译： 提出了一种具有改进的布线方案的导线键合半导体器件，可以帮助最小化封装过程中的异常线扫。 在半导体器件中的接合线之中，位于拐角处的那些将主要容易受到异常的线扫，特别是位于与位于线的一个拐角处的低环路接合线紧邻的高环路接合线， 键合半导体器件。 为了解决这个问题，位于与扫描敏感的高回路接合线直接相邻的低环路接合线基本上竖立成与高环接合线相同的环高度，从而可以作为 在封装过程中屏蔽抗扫描敏感的高回路接合线，防止注入树脂的流动，从而防止异常的线扫。 或者，如果一对低环路接合线立即与扫描敏感的高环路接合线相邻并且被结合到公共双线接合焊盘，则这两个低环路接合线布置在交叉 方式，这也可以有助于减少喷射树脂对扫描敏感的高环接合线的影响，从而防止异常的线扫。 防止异常线扫使得成品半导体器件在质量和可靠性方面更加放心。