公开(公告)号：US06686015B2

公开(公告)日：2004-02-03

申请号：US09885684

申请日：2001-06-20

申请人： Kurt Raab ,  John W. Smith

发明人： Kurt Raab ,  John W. Smith

IPC分类号： B32B300

CPC分类号： H01L21/6835 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/8319 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  Y10T428/14 ,  Y10T428/1457 ,  Y10T428/1462 ,  Y10T428/1471 ,  Y10T428/1476 ,  Y10T428/1486 ,  Y10T428/24851 ,  Y10T428/2486

摘要： A transferable resilient element assembly for fabricating a microelectronic package includes a first liner having a tacky material and a plurality of resilient elements, the plurality of resilient elements having a first surface being in contact with the the first liner. The plurality of resilient elements adhere to the tacky material so that upon removal of the plurality of resilient elements from the liner, the tacky material will adhere to the plurality of resilient elements and provide a tacky surface thereon.

摘要翻译： 用于制造微电子封装的可转移的弹性元件组件包括具有粘性材料和多个弹性元件的第一衬垫，所述多个弹性元件具有与第一衬垫接触的第一表面。 多个弹性元件粘附到粘性材料上，使得当从衬里移除多个弹性元件时，粘性材料将粘附到多个弹性元件并在其上提供粘性表面。

公开(公告)号：US06294040B1

公开(公告)日：2001-09-25

申请号：US08879922

申请日：1997-06-20

申请人： Kurt Raab ,  John W. Smith

发明人： Kurt Raab ,  John W. Smith

IPC分类号： B32B3100

CPC分类号： H01L21/6835 ,  H01L23/16 ,  H01L23/3107 ,  H01L23/4985 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/8319 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802

摘要： A method for making a microelectronic package includes providing first and second microelectronic elements having electrically conductive parts, juxtaposing the first and second microelectronic elements with one another, bonding electrically conductive parts of the microelectronic elements together to form electrical interconnection, providing a resilient element having one or more tacky surface regions in contact with one or more liners separately from the first and second microelectronic elements, assembling the resilient element with at least one of said microelectronic elements, and removing the resilient element from the one or more liners prior to the juxtaposing step so that the resilient element is disposed between the microelectronic elements after the juxtaposing and bonding steps. In other embodiments, the method of making a microelectronic package includes providing a resilient element having one or more tacky surface regions separately from the first and second microelectronic elements, and assembling the resilient elements with at least one of the microelectronic elements prior to the juxtaposing step so that the resilient element is disposed between the microelectronic elements after the juxtaposing and bonding steps, wherein the step of assembling the resilient element with at least one of the microelectronic elements is performed less than 24 hours prior to the bonding step. In certain embodiments the resilient elements include an adhesive at one or more tacky surface regions thereof. In other embodiments, the resilient elements include partially-cured surfaces at the one or more tacky surface regions. Also disclosed is a method of fabricating a resilient element of a microelectronic package having one or more tacky surface regions. The method includes the steps of providing a first liner, providing a mass of a curable material on the liner, and curing the mass so that a region of the mass in contact with the liner is tacky.

公开(公告)号：US5915170A

公开(公告)日：1999-06-22

申请号：US931680

申请日：1997-09-16

申请人： Kurt Raab ,  Thomas Pickett ,  Thomas H. Di Stefano

发明人： Kurt Raab ,  Thomas Pickett ,  Thomas H. Di Stefano

IPC分类号： H01L21/56 ,  H01L21/60 ,  H01L23/48 ,  H01L23/498 ,  H05K1/11 ,  H05K3/36 ,  H05K3/40 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/81 ,  H01L21/56 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/72 ,  H05K3/4084 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01087 ,  H01L2924/014 ,  H05K1/118 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2203/063 ,  H05K3/361

摘要： A method of making a multiple part compliant interface for a microelectronic package including the steps of providing a first microelectronic element having electrically conductive parts, providing an array of curable elastomer support pads in contact with the first microelectronic element, curing the curable elastomer support pads while the support pads remain in contact with the first microelectronic element and providing an array of adhesive pads in contact with the support pads, whereby each adhesive pad is disposed over and in substantial alignment with one of the support pads. A second microelectronic element having electrically conductive parts is then assembled in contact with the array of adhesive pads by abutting the second microelectronic element against the array of adhesive pads and compressing the adhesive pads and support pads between the first and second microelectronic elements. The array of adhesive pads are then cured and the electrically conductive parts of the first and second microelectronic elements are interconnected. The array of support pads define channels running between any two adjacent support pads. A flowable curable elastomer encapsulant may be disposed within the channels after the electrically connecting step. Preferably, the support pads, adhesive pads and the encapsulant comprise substantially similar materials, such as silicone, in order to avoid problems associated with thermal cycling, such as air entrapment and/or voiding.

摘要翻译： 制造用于微电子封装的多部件兼容接口的方法，包括以下步骤：提供具有导电部件的第一微电子元件，提供与第一微电子元件接触的可固化弹性体支撑垫阵列，固化可固化弹性体支撑垫，同时 所述支撑垫保持与所述第一微电子元件接触并提供与所述支撑垫接触的粘合剂垫阵列，由此每个粘合垫设置在所述支撑垫中的一个上并且与所述支撑垫中的一个基本对齐。 具有导电部件的第二微电子元件然后通过将第二微电子元件抵靠粘合剂焊盘阵列并将第一和第二微电子元件之间的粘合剂焊盘和支撑焊盘压紧而组装成与粘合剂焊盘阵列接触。 然后固化粘合垫阵列，并且第一和第二微电子元件的导电部分互连。 支撑垫的阵列限定在任何两个相邻支撑垫之间运行的通道。 在电连接步骤之后，可流动的可固化的弹性体密封剂可以设置在通道内。 优选地，支撑垫，粘合垫和密封剂包括基本相似的材料，例如硅树脂，以避免与热循环相关的问题，例如空气截留和/或排空。

公开(公告)号：US06309910B1

公开(公告)日：2001-10-30

申请号：US09313402

申请日：1999-05-18

申请人： Belgacem Haba ,  Kurt Raab

发明人： Belgacem Haba ,  Kurt Raab

IPC分类号： H01L2144

CPC分类号： H01L24/86 ,  H01L21/4846 ,  H01L23/49572 ,  H01L23/49833 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014

摘要： Flexible leads for making electrical connection in microelectronic components include a frangible intermediate section. The frangible intermediate section is formed by a region within the lead having weakened mechanical integrity. The lead is formed by depositing a layer of lead forming material over an irregularity provided on a supporting substrate so as to provide a region of altered crystal morphology. The region of altered crystal morphology provides the lead with the weakened region.

摘要翻译： 用于在微电子部件中进行电连接的柔性引线包括易碎的中间部分。 易碎中间部分由引线内的区域形成，机械完整性降低。 引线通过在提供在支撑衬底上的不规则层上沉积铅层形成材料层而形成，以提供改变晶体形态的区域。 改变晶体形态的区域提供了弱化区域的铅。

公开(公告)号：US06687980B1

公开(公告)日：2004-02-10

申请号：US09636664

申请日：2000-08-11

申请人： Joseph Link ,  Kurt Raab

发明人： Joseph Link ,  Kurt Raab

IPC分类号： B23P1900

CPC分类号： H01L21/67333 ,  H01L2221/68313 ,  Y10T29/49121 ,  Y10T29/53265 ,  Y10T29/53961 ,  Y10T29/53978

摘要： An apparatus for processing flexible tape for microelectronic assemblies includes a base having a top surface, a bottom surface and an aperture extending between the top and bottom surfaces, and a platform having a top surface for engaging a flexible tape used for making microelectronic assemblies, such as semiconductor chip packages. The platform is sized to fit within the aperture extending between the top and bottom surfaces of the base. The base is pivotally secured at one end of the platform so that when the base pivots with respect to the platform, the flexible tape engaged by the platform remains on the platform. The assembly also includes a carrier frame having a slot and a clamp sized to pass through the slot and the carrier frame and the aperture in the base for securing the flexible tape to the top surface of the platform as the base pivots with respect to the platform.

摘要翻译： 一种用于处理微电子组件的柔性带的装置包括具有顶表面，底表面和在顶表面和底表面之间延伸的孔的底座，以及具有用于接合用于制造微电子组件的柔性带的顶表面的平台， 作为半导体芯片封装。 该平台的大小适合于在基座的顶表面和底表面之间延伸的孔内。 基座在平台的一端可枢转地固定，使得当基座相对于平台枢转时，由平台接合的柔性带保留在平台上。 组件还包括具有槽和夹具的承载框架，其尺寸设置成穿过槽和承载框架以及底座中的孔，用于当柔性带相对于平台枢转时将软带固定到平台的顶表面 。

公开(公告)号：US06300254B1

公开(公告)日：2001-10-09

申请号：US09293005

申请日：1999-04-16

申请人： Kurt Raab

发明人： Kurt Raab

IPC分类号： H01L2144

CPC分类号： H01L23/562 ,  H01L21/481 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of making a compliant interface includes providing a support structure and forming a plurality of compliant pads on the support structure by moving a sheet or mold having apertures toward a layer of flowable composition disposed on the support structure. A method of making a microelectronic package includes juxtaposing a microelectronic element with the compliant interface. Leads are formed between the microelectronic element and the substrate. An encapsulant may be disposed between the microelectronic element and the substrate.

摘要翻译： 制造合规界面的方法包括提供支撑结构并通过将具有孔的片或模具移动到设置在支撑结构上的可流动组合物层上而在支撑结构上形成多个柔性垫。 制造微电子封装的方法包括将微电子元件与兼容接口并置。 在微电子元件和衬底之间形成引线。 密封剂可以设置在微电子元件和衬底之间。

公开(公告)号：US06170151B2

公开(公告)日：2001-01-09

申请号：US09443530

申请日：1999-11-19

申请人： Joseph Link ,  Kurt Raab

发明人： Joseph Link ,  Kurt Raab

IPC分类号： B23P1904

CPC分类号： H01L21/67346 ,  H01L2221/68313 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/5136 ,  Y10T29/5137 ,  Y10T29/52 ,  Y10T29/5313 ,  Y10T29/53178 ,  Y10T29/53183

摘要： An assembly for processing a flexible tape comprises a carrier frame having a slot and a cut-out region contiguous with one end of the slot for selectively transferring the flexible tape from the top surface of the carrier frame to the bottom surface of the carrier frame. An apparatus for processing the flexible tape is also disclosed and includes the carrier frame, a base having an aperture and a platform sized to fit within the aperture of the base. The base is pivotable around one end of the platform.

摘要翻译： 一种用于处理柔性带的组件包括具有槽和与槽的一端邻接的切口区域的载体框架，用于选择性地将柔性带从承载框架的顶表面转移到承载框架的底表面。 还公开了一种用于处理柔性带的装置，并且包括载体框架，具有孔径的基座和尺寸适于安装在基部的孔内的平台。 基座可围绕平台的一端枢转。

公开(公告)号：US6049972A

公开(公告)日：2000-04-18

申请号：US12590

申请日：1998-01-23

申请人： Joseph Link ,  Kurt Raab

发明人： Joseph Link ,  Kurt Raab

IPC分类号： H01L21/673 ,  H01R43/00

CPC分类号： H01L21/67346 ,  H01L2221/68313 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/5136 ,  Y10T29/5137 ,  Y10T29/52 ,  Y10T29/5313 ,  Y10T29/53178 ,  Y10T29/53183

摘要： A method of making a microelectronic assembly includes providing a flexible tape having first and second surfaces with a plurality of connection components in a central region of the flexible tape, providing a carrier frame having top and bottom surfaces and a slot extending therebetween and placing the flexible tape in contact with the top surface of the carrier frame. Next a resilient element is provided on each connection component and the flexible tape is passed through the slot so that the flexible tape disengages from the top surface of the carrier frame, passes through the slot and engages the bottom surface of the carrier frame. The carrier frame includes one or more interior edges defining the slot and a cut-out region contiguous with one end of the slot. The cut-out region also extends between the top and bottom surfaces of the carrier frame and the width of the cut-out region is greater than the width of the flexible tape so that at least one side border region of the flexible tape is pivotally secured to the carrier frame.

摘要翻译： 一种制造微电子组件的方法包括提供具有第一和第二表面的柔性带，其中柔性带的中心区域具有多个连接部件，提供具有顶表面和底表面的承载框架以及在其间延伸的槽， 胶带与载体框架的顶表面接触。 接下来，在每个连接部件上设置弹性元件，并且柔性带通过狭槽，使得柔性带从载体框架的顶表面脱离，穿过狭槽并接合载体框架的底表面。 载体框架包括限定槽的一个或多个内部边缘和与槽的一个端部邻接的切口区域。 切除区域也在承载架的顶表面和底表面之间延伸，并且切出区域的宽度大于柔性带的宽度，使得柔性带的至少一个侧边区域被枢转地固定 到载体框架。