摘要:
A generic wafer includes memory units separated by scribe lanes. Memory chips of different storage capacities can be produced from different numbers of memory units on the generic wafer by forming one or more interconnect layer specialized according to a desired storage capacity and cutting the wafer using a sawing pattern according to the desired storage capacity. The specialized layer can be formed using different masks sets that form a different conductive pattern for each storage capacity or forming a generic interconnect structure with fuses that are cut to select the storage capacity of the memory chips
摘要:
An apparatus for controlling an enable of a sense amplifier in a semiconductor memory device includes a test part for repeatedly varying a test code value until the enable of the sense amplifier has a zero margin with respect to data to be read by the sense amplifier, and for determining the test code value at a time point when the enable has the zero margin. A fuse array cuts a fuse corresponding to the determined test code value.
摘要:
In a method of manufacturing a dielectric structure, after a first dielectric layer is formed on a substrate by using a metal oxide doped with silicon, the substrate is placed on a susceptor of a chamber. By treating the first dielectric layer with a plasma in controlling a voltage difference between the susceptor and a ground, a second dielectric layer is formed on the first dielectric layer. The second dielectric layer including a metal oxynitride doped with silicon having enough content of nitrogen is formed on the first dielectric layer. Therefore, dielectric properties of the dielectric structure comprising the first and the second dielectric layers can be improved and a leakage current can be greatly decreased. By adapting the dielectric structure to a gate insulation layer and/or to a dielectric layer of a capacitor or of a non-volatile semiconductor memory device, capacitances and electrical properties can be improved.
摘要:
Disclosed herein is a waterproof sheet. More specifically, disclosed herein is a waterproof sheet with improved water resistance, airtightness and durability by which the waterproof sheet is produced by adhering a polyvinylchloride (PVC) alloy sheet as an plastic sheet to the at least one surface of a polyester film as an intermediate.
摘要:
A multilayer electrode structure has a conductive layer including aluminum, an oxide layer formed on the conductive layer, and an oxygen diffusion barrier layer. The oxide layer includes zirconium oxide and/or titanium oxide. The oxygen diffusion barrier layer is formed at an interface between the conductive layer and the oxide layer by re-oxidizing the oxide layer. The oxygen diffusion barrier layer includes aluminum oxide.
摘要:
A semiconductor memory device has a hierarchical bit line structure. The semiconductor memory device may include first and second memory cell clusters, which share the same bit line pair and are divided operationally; third and fourth memory cell clusters, which are connected respectively corresponding to word lines coupled with the first and second memory cell clusters, and which share a bit line pair different from the bit line pair and are divided operationally; and a column pass gate for switching one of bit line pairs connected with the first to fourth memory cell clusters, to a common sense amplifier, in response to a column selection signal. Whereby an operating speed decrease caused by load of peripheral circuits connected to the bit line is improved, and the number of column pass gates is reduced substantially with a reduction of chip size.
摘要:
Flash memory devices include a semiconductor substrate having an active region. A gate pattern on the active region includes a floating gate pattern and a control gate pattern with an inter-gate dielectric layer pattern therebetween. The inter-gate dielectric layer pattern includes a plurality of hafnium oxide layers and a plurality of aluminum oxide layers, ones of which are alternately arrayed.
摘要:
A method and circuit for sampling and writing data in a double data rate (DDR) memory device, capable of securing sufficient setup and hold margins regardless of the operation frequency. Transferring first and second sampled input data to a first path using a first path control signal. Transferring third and fourth sampled input data to a second path using a second path control signal. The first and second path control signals are one half-cycle out of phase. First to fourth data are successively sampled in synchronization with a rising or falling edge of a first external clock signal; The sampled first data is linked onto a first path and the sampled second data is linked onto a second path in response to the first path control signal (generated in synchronization with a falling edge of the external clock signal); the first data on the first path and the second data on the second path are written to the memory cells in response to a write clock signal.
摘要:
Disclosed are a material for advertisement and a method for manufacturing the same. The material for advertisement includes a surface film layer, a pressure-sensitive adhesive layer and a release layer stacked in sequence, in which the surface film layer is composed of a biodegradable film layer containing 5 to 40 wt % of a biodegradable polymer and 95 to 60 wt % of an aliphatic polyester. The material including the biodegradable film layer can be used for print advertisement to be discarded after being used for a short period of time, and has biodegradability of 60% or more as compared with cellulose within six months when discarded, so that a toxic environmental hormone due to polyvinylchloride (PVC) is not emitted, and the environment is protected, thereby being very friendly toward humans and the earth.
摘要:
A method of forming a semiconductor device includes forming a lower conductive pattern on a substrate, forming an insulating layer over the lower conductive pattern, forming a contact hole through the insulating layer to expose the lower conductive pattern, forming a first spacer along sides of the contact hole, and then forming a contact plug in the contact hole. The contact plug is formed so as to contact the lower conductive pattern.