公开(公告)号：US20090284423A1

公开(公告)日：2009-11-19

申请号：US12465416

申请日：2009-05-13

申请人： Kyung-Hack YI ,  Dong-Ho Lee

发明人： Kyung-Hack YI ,  Dong-Ho Lee

IPC分类号： H01Q1/24 ,  H01Q1/38

CPC分类号： H01Q1/2283 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q7/08

摘要： A portable terminal with an antenna for receiving broadcast signals, includes an antenna module having a chip antenna patterned on a dielectric chip so as to define a physical length of the antenna module that enables the chip antenna to operate within a broadcast band, and a conductive plate connected to the chip antenna and having an area such that conductive plate leads a main radiation of the antenna module on the broadcast band, whereby the physical length of the antenna module can be reduced as short as possible by employing the chip antenna. Accordingly, the chip antenna facilitates making the antenna module and the portable terminal be smaller in size. Also, the chip antenna is configured to lead a main radiation on the conductive plate, thereby increasing radio reception quality and improving radio performance.

摘要翻译： 具有用于接收广播信号的天线的便携式终端包括天线模块，其具有图案化在介质芯片上的芯片天线，以便限定天线模块的物理长度，使得芯片天线能够在广播频带内工作，并且导电 连接到芯片天线的板，并且具有使得导电板在广播频带上引导天线模块的主辐射的区域，由此可以通过采用芯片天线尽可能地减小天线模块的物理长度。 因此，芯片天线有助于使天线模块和便携式终端的尺寸更小。 此外，芯片天线被配置为引导导电板上的主辐射，从而增加无线电接收质量并提高无线电性能。

公开(公告)号：US08344952B2

公开(公告)日：2013-01-01

申请号：US12465416

申请日：2009-05-13

申请人： Kyung-Hack Yi ,  Dong-Ho Lee

发明人： Kyung-Hack Yi ,  Dong-Ho Lee

IPC分类号： H01Q1/24

CPC分类号： H01Q1/2283 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q7/08

摘要： A portable terminal with an antenna for receiving broadcast signals, includes an antenna module having a chip antenna patterned on a dielectric chip so as to define a physical length of the antenna module that enables the chip antenna to operate within a broadcast band, and a conductive plate connected to the chip antenna and having an area such that conductive plate leads a main radiation of the antenna module on the broadcast band, whereby the physical length of the antenna module can be reduced as short as possible by employing the chip antenna. Accordingly, the chip antenna facilitates making the antenna module and the portable terminal be smaller in size. Also, the chip antenna is configured to lead a main radiation on the conductive plate, thereby increasing radio reception quality and improving radio performance.

摘要翻译： 具有用于接收广播信号的天线的便携式终端包括天线模块，其具有图案化在介质芯片上的芯片天线，以便限定天线模块的物理长度，使得芯片天线能够在广播频带内工作，并且导电 连接到芯片天线的板，并且具有使得导电板在广播频带上引导天线模块的主辐射的区域，由此可以通过采用芯片天线尽可能地减小天线模块的物理长度。 因此，芯片天线有助于使天线模块和便携式终端的尺寸更小。 此外，芯片天线被配置为引导导电板上的主辐射，从而增加无线电接收质量并提高无线电性能。

公开(公告)号：US20130314787A1

公开(公告)日：2013-11-28

申请号：US13953569

申请日：2013-07-29

申请人： Ji-Woon Jung ,  Dong-Ho Lee ,  Seon-Chool Kim ,  Jong-Kap Jo ,  Sang-Kyu Kim

发明人： Ji-Woon Jung ,  Dong-Ho Lee ,  Seon-Chool Kim ,  Jong-Kap Jo ,  Sang-Kyu Kim

IPC分类号： G02B5/30

CPC分类号： G02B5/3033 ,  G02B5/3025 ,  G02F1/13338

摘要： A flat panel display apparatus is disclosed. In one embodiment, the apparatus includes a panel configured to display an image and an electrode pattern for touch manipulation disposed over the panel. The apparatus also includes a polarizing film disposed over the electrode pattern; and a window disposed on the polarizing film

摘要翻译： 公开了一种平板显示装置。 在一个实施例中，该设备包括被配置为显示图像的面板和设置在面板上方的用于触摸操作的电极图案。 该设备还包括设置在电极图案上的偏振膜; 以及设置在偏振膜上的窗口

公开(公告)号：US08497956B2

公开(公告)日：2013-07-30

申请号：US13078797

申请日：2011-04-01

申请人： Ji-Woon Jung ,  Dong-Ho Lee ,  Seon-Chool Kim ,  Jong-Kap Jo ,  Sang-Kyu Kim

发明人： Ji-Woon Jung ,  Dong-Ho Lee ,  Seon-Chool Kim ,  Jong-Kap Jo ,  Sang-Kyu Kim

IPC分类号： G02F1/1335

CPC分类号： G02B5/3033 ,  G02B5/3025 ,  G02F1/13338

摘要： A flat panel display apparatus is disclosed. In one embodiment, the apparatus includes a panel configured to display an image; a glass window covering the panel; and a polarizing film attached on a surface of the glass window, wherein the polarizing film is configured to prevent the scatter of broken pieces when the glass window breaks and also prevent reflection of an external light.

摘要翻译： 公开了一种平板显示装置。 在一个实施例中，该装置包括被配置为显示图像的面板; 覆盖面板的玻璃窗; 以及偏振膜，其安装在所述玻璃窗的表面上，其中，所述偏振膜被构造成在所述玻璃窗断裂时防止碎片的散射，并且还防止外部光的反射。

公开(公告)号：US20120229530A1

公开(公告)日：2012-09-13

申请号：US13474762

申请日：2012-05-18

申请人： Yong-Ho Yang ,  Dong-Ho Lee ,  Soong-Yong Joo

发明人： Yong-Ho Yang ,  Dong-Ho Lee ,  Soong-Yong Joo

IPC分类号： G09G3/36 ,  G09G5/10 ,  G09G5/02 ,  G02F1/1335

CPC分类号： G02F1/1362 ,  G02F1/133514 ,  G02F1/136286 ,  G02F2001/133388 ,  G09G3/3648 ,  G09G2310/0232

摘要： LCD device includes two substrates, a first and second color filters, two liquid crystal layers. The first color filters are formed on portions of the second substrate corresponding to border area The second color filters are formed on portions of the second substrate corresponding to the display area except the border area. A first liquid crystal layer between the first and the second substrate is comprised in border area, and a zero electric field is formed on the first liquid crystal layer so as to completely transmit light incident into the first liquid crystal layer therethrough. A borderline having various colors can be displayed by forming various patterns of color filters having various colors on portions of the second substrate corresponding to the border area under normally white mode, thereby producing picture frame effect while images are displayed on the screen.

摘要翻译： LCD装置包括两个基板，第一和第二滤色器，两个液晶层。 第一滤色器形成在对应于边界区域的第二基板的部分上。第二滤色器形成在对应于除了边界区域之外的显示区域的第二基板的部分上。 在第一和第二基板之间的第一液晶层包括在边界区域中，并且在第一液晶层上形成零电场，以便将入射到第一液晶层中的光完全透射。 具有各种颜色的边界线可以通过在正常白色模式下形成与边界区域对应的第二基板的各部分上形成具有各种颜色的各种图案的彩色滤光片来显示，从而在屏幕上显示图像时产生画面效果。

公开(公告)号：US08197772B2

公开(公告)日：2012-06-12

申请号：US12559789

申请日：2009-09-15

申请人： Tae-Seok Sim ,  Dong-Ho Lee

发明人： Tae-Seok Sim ,  Dong-Ho Lee

IPC分类号： B01L3/00

CPC分类号： B01L3/508 ,  B01L3/502707 ,  Y10T29/49 ,  Y10T436/11

摘要： A biochip package body, a method of forming the same, and a biochip package including the biochip package body are provided. The biochip package body includes a mounting package body having a mounting plate. The mounting plate has at least one protruding portion that protrudes therefrom. The protruding portion has a chip mounting portion and a chip protection portion. The chip mounting portion is disposed substantially in the center of the protruding portion. The chip protection portion surrounds the chip mounting portion.

摘要翻译： 提供一种生物芯片封装体，其形成方法以及包括生物芯片封装体的生物芯片封装。 生物芯片封装主体包括具有安装板的安装封装主体。 安装板具有从其突出的至少一个突出部分。 突出部分具有芯片安装部分和芯片保护部分。 芯片安装部分基本上设置在突出部分的中心。 芯片保护部分围绕芯片安装部分。

公开(公告)号：US08133452B2

公开(公告)日：2012-03-13

申请号：US12179219

申请日：2008-07-24

申请人： June-Young Lee ,  Dong-Ho Lee

发明人： June-Young Lee ,  Dong-Ho Lee

IPC分类号： G01N21/75 ,  C40B40/04 ,  C12M1/34

CPC分类号： C40B60/12 ,  B01L3/508 ,  B01L2200/16 ,  B01L2300/047 ,  B01L2300/0636

摘要： A biochip package allowing biochips optimized for high-volume production to be compatible with general-purpose devices and a biochip packaging substrate of the biochip package are provided. The biochip package can include a biochip having a probe array mounted thereon and a biochip packaging substrate on which the biochip is mounted and which has a through cavity exposing a rear surface of the biochip.

摘要翻译： 提供了一种生物芯片封装，允许针对大批量生产优化的生物芯片与通用器件和生物芯片封装的生物芯片封装衬底兼容。 生物芯片封装可以包括其上安装有探针阵列的生物芯片和其上安装有生物芯片的生物芯片封装衬底，并且具有暴露生物芯片后表面的通孔。

公开(公告)号：US08120177B2

公开(公告)日：2012-02-21

申请号：US12910260

申请日：2010-10-22

申请人： Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

发明人： Hyun-Soo Chung ,  Ho-Jin Lee ,  Dong-Hyun Jang ,  Dong-Ho Lee

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/13025 ,  H01L2224/274 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01079 ,  H01L2924/01087

摘要： In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability.

公开(公告)号：US08039937B2

公开(公告)日：2011-10-18

申请号：US12432003

申请日：2009-04-29

申请人： Hyun-Soo Chung ,  Seung-Kwan Ryu ,  Ju-Il Choi ,  Dong-Ho Lee ,  Seong-Deok Hwang

发明人： Hyun-Soo Chung ,  Seung-Kwan Ryu ,  Ju-Il Choi ,  Dong-Ho Lee ,  Seong-Deok Hwang

IPC分类号： H01L23/02

CPC分类号： H01L21/76898 ,  H01L23/3128 ,  H01L23/3178 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/02313 ,  H01L2224/02372 ,  H01L2224/02379 ,  H01L2224/0239 ,  H01L2224/036 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05009 ,  H01L2224/05548 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/1058 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/01028 ,  H01L2224/03

摘要： Provided are methods of fabricating semiconductor chips, semiconductor chips formed by the methods, and chip-stack packages having the semiconductor chips. One embodiment specifies a method that includes patterning a scribe line region of a semiconductor substrate to form a semiconductor strut spaced apart from edges of a chip region of the semiconductor substrate.

摘要翻译： 提供制造半导体芯片的方法，通过该方法形成的半导体芯片和具有半导体芯片的芯片堆叠封装。 一个实施例规定了一种方法，其包括图案化半导体衬底的划线区域以形成与半导体衬底的芯片区域的边缘间隔开的半导体支柱。

公开(公告)号：US07973886B2

公开(公告)日：2011-07-05

申请号：US12474192

申请日：2009-05-28

申请人： Young-Joon Rhee ,  Dong-Ho Lee ,  Chung-Hyo Lee

发明人： Young-Joon Rhee ,  Dong-Ho Lee ,  Chung-Hyo Lee

IPC分类号： G02F1/1335

CPC分类号： G02F1/1362 ,  G02F2001/136222

摘要： Thin film transistors are formed on a lower substrate, and red, green, blue and transparent color filters are formed thereon. An organic insulating layer is formed on the color filters, and pixel electrodes are formed thereon. A black matrix and a common electrode are formed on an upper substrate facing the lower substrate.

摘要翻译： 薄膜晶体管形成在下基板上，并且在其上形成红，绿，蓝和透明滤色器。 在滤色片上形成有机绝缘层，在其上形成像素电极。 在面向下基板的上基板上形成黑矩阵和公共电极。