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26 条记录 (耗时 0.019 秒)

    Method of manufacturing a dual face package
    3.
    发明申请
    Method of manufacturing a dual face package 有权
    制造双面包装的方法

    公开(公告)号：US20110129994A1

    公开(公告)日：2011-06-02

    申请号：US12929614

    申请日：2011-02-03

    申请人： Seung Wook Park ,  Young Do Kweon ,  Jingli Yuan ,  Seon Hee Moon ,  Ju Pyo Hong ,  Jae Kwang Lee

    发明人： Seung Wook Park ,  Young Do Kweon ,  Jingli Yuan ,  Seon Hee Moon ,  Ju Pyo Hong ,  Jae Kwang Lee

    IPC分类号： H01L21/60

    CPC分类号： H01L21/76898 ,  H01L21/481 ,  H01L23/3114 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method of manufacturing a dual face package, including: preparing an upper substrate composed of an insulating layer including a post via-hole; forming a filled electrode in a semiconductor substrate, the filled electrode being connected to a die pad; applying an adhesive layer on one side of the semiconductor substrate including the filled electrode, and attaching the upper substrate to the semiconductor substrate; cutting another side of the semiconductor substrate in a thickness direction, thus making the filled electrode into a through-electrode; and forming a post electrode in the post via-hole, forming an upper redistribution layer connected to the post electrode of the semiconductor substrate, and forming a lower redistribution layer connected to the through-electrode on the other side of the semiconductor substrate.

    摘要翻译： 一种双面包装的制造方法，包括：准备由包括柱状通孔的绝缘层构成的上基板; 在半导体衬底中形成填充电极，所述填充电极连接到管芯焊盘; 在包括填充电极的半导体衬底的一侧上施加粘合剂层，并将上衬底附接到半导体衬底; 在厚度方向切割半导体衬底的另一侧，从而使填充的电极成为通孔; 在柱状通孔中形成柱状电极，形成与半导体衬底的柱状电极连接的上部再分配层，在半导体衬底的另一侧形成与贯通电极连接的下部再分布层。

    Fluorescent label compounds
    6.
    发明授权
    Fluorescent label compounds 有权
    荧光标签化合物

    公开(公告)号：US07465747B2

    公开(公告)日：2008-12-16

    申请号：US10506242

    申请日：2003-03-10

    申请人： Kazuko Matsumoto ,  Jingli Yuan ,  Guilan Wang ,  Mingqian Tan

    发明人： Kazuko Matsumoto ,  Jingli Yuan ,  Guilan Wang ,  Mingqian Tan

    IPC分类号： C07D401/02 ,  A61K31/44

    CPC分类号： C07D213/36 ,  C07D401/14 ,  G01N33/533

    摘要： It is intended to provide novel labeling reagents characterized by having a group capable of binding to a substance to be labeled (for example, a biological substance, a physiologically active substance, etc.), easily forming a complex together with a rare earth ion, the complex being stable in an aqueous solution, and having a sufficient fluorescence intensity and a long fluorescence life time regardless of buffer types; complexes composed of the above labeling reagent with a rare earth ion; fluorescence labels containing the above complex; a fluorescence assay method using the above fluorescent label; etc. Namely, labeling reagents comprising a compound having a 2,2′:6′,2″-tripyridine skeleton or a 2,6-dipyrazolopyridine skeleton and having a group capable of binding to a substance to be labeled (for example, a biological substance, a physiologically active substance, etc.) and a group capable of forming a complex together with a rare earth ion; complexes composed of the above labeling reagent with a rare earth ion; fluorescence labels containing the above complex; a fluorescence labeling method using the above complex as a label; and a fluorescence assay method using the above fluorescent label.

    摘要翻译： 旨在提供新颖的标记试剂，其特征在于具有能够与待标记的物质结合的基团（例如生物物质，生理活性物质等），容易与稀土离子一起形成络合物， 该复合物在水溶液中稳定，并且具有足够的荧光强度和长的荧光寿命，而不管缓冲液类型如何; 由上述标记试剂与稀土离子组成的络合物; 含有上述复合物的荧光标记物; 使用上述荧光标记物的荧光检测方法; 即，包括具有2,2'：6'，2“ - 三吡啶骨架或2,6-二吡唑并吡啶骨架的化合物的标记试剂，并具有能够结合待标记的物质的基团（例如， 生物物质，生理活性物质等）和能够与稀土离子一起形成络合物的基团; 由上述标记试剂与稀土离子组成的络合物; 含有上述复合物的荧光标记物; 使用上述复合物作为标签的荧光标记方法; 和使用上述荧光标记物的荧光测定方法。

    Dual face package having resin insulating layer
    8.
    发明授权
    Dual face package having resin insulating layer 失效
    具有树脂绝缘层的双面包装

    公开(公告)号：US08093705B2

    公开(公告)日：2012-01-10

    申请号：US12320286

    申请日：2009-01-22

    申请人： Seung Wook Park ,  Young Do Kweon ,  Jingli Yuan ,  Seon Hee Moon ,  Ju Pyo Hong ,  Jae Kwang Lee

    发明人： Seung Wook Park ,  Young Do Kweon ,  Jingli Yuan ,  Seon Hee Moon ,  Ju Pyo Hong ,  Jae Kwang Lee

    IPC分类号： H01L23/50 ,  H01L21/768

    CPC分类号： H01L21/76898 ,  H01L21/481 ,  H01L23/3114 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A dual face package includes a semiconductor substrate including a through-electrode connected to a die pad disposed on one side of the semiconductor substrate, and a lower redistribution layer disposed on another side thereof and connected to the through-electrode, an insulating layer including a post electrode connected to the through-electrode, and an upper redistribution layer disposed on one side thereof and connected to the post electrode, and an adhesive layer disposed on the one side of the semiconductor substrate so as to attach the insulating layer to the semiconductor substrate such that the through-electrode is connected to the post electrode.

    摘要翻译： 双面包装包括半导体衬底，其包括连接到设置在半导体衬底的一侧的管芯焊盘的通孔和设置在其另一侧并连接到通孔的下再分布层，绝缘层包括： 连接到所述贯通电极的后电极以及设置在其一侧并连接到所述柱电极的上再分配层，以及设置在所述半导体衬底的一侧上以将所述绝缘层附着到所述半导体衬底的粘合层 使得贯通电极连接到柱电极。

    Camera module package and method of manufacturing the same
    9.
    发明申请
    Camera module package and method of manufacturing the same 审中-公开
    相机模块包装及其制造方法相同

    公开(公告)号：US20080304821A1

    公开(公告)日：2008-12-11

    申请号：US12149751

    申请日：2008-05-07

    申请人： Won Kyu Jeung ,  Seog Moon Choi ,  Jingli Yuan ,  Chang Hyun Lim ,  Dae Jun Kim

    发明人： Won Kyu Jeung ,  Seog Moon Choi ,  Jingli Yuan ,  Chang Hyun Lim ,  Dae Jun Kim

    IPC分类号： G03B17/00 ,  H01L21/00

    CPC分类号： H01L27/14618 ,  H01L27/14627 ,  H01L27/14683 ,  H01L2224/48091 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014

    摘要： The present invention relates to a camera module package having flexibility and a method of manufacturing the same. Provided is the camera module package according to the invention including a silicon wafer mounted with the image sensor in the center of a top surface thereof and provided with pads both sides of the image sensor, a lens unit opened to form a convex lens in a mounting portion of the image sensor in an upper part of the wafer, and a flexible board tightly joined to a bottom surface of the wafer and electrically connected to the pads by an internal pattern. The camera module package can be thinly manufactured and since the camera module package has flexibility, the camera module package can be easily attached to a bendable substrate and to the inside an IT apparatus.

    摘要翻译： 本发明涉及一种具有灵活性的相机模块封装及其制造方法。 提供了根据本发明的相机模块包装，其包括安装有图像传感器的硅晶片在其顶表面的中心并且设置有图像传感器两侧的焊盘，透镜单元被打开以在安装中形成凸透镜 图像传感器的一部分在晶片的上部，以及柔性板，其紧密接合到晶片的底表面并且通过内部图案电连接到焊盘。 相机模块封装可以被薄制造，并且由于相机模块封装具有灵活性，所以相机模块封装可以容易地附接到可弯曲的基板和IT设备的内部。

    Camera module package
    10.
    发明申请
    Camera module package 审中-公开
    相机模块包

    公开(公告)号：US20080296577A1

    公开(公告)日：2008-12-04

    申请号：US12155268

    申请日：2008-05-30

    申请人： Jingli Yuan ,  Won Kyu Jeung ,  Dae Jun Kim ,  Chang Hyun Lim ,  Jae Cheon Doh

    发明人： Jingli Yuan ,  Won Kyu Jeung ,  Dae Jun Kim ,  Chang Hyun Lim ,  Jae Cheon Doh

    IPC分类号： H01L31/00 ,  H01L21/02

    CPC分类号： H01L27/14618 ,  H01L27/14687 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

    摘要： There is provided a camera module package including: a substrate having an image sensor disposed on one surface thereof and a pad electrically connected to the image sensor; a protective cap adhered onto the substrate by an adhesive surrounding the image sensor to seal the image sensor, the protective cap transmitting light; and a supporting part surrounding the protective cap, the supporting part adhering and supporting at least one lens formed corresponding to the image sensor. The camera module package is reduced in thickness and size, and minimized in an error of a focal length between the lens and the image sensor, thereby achieving accuracy and high reliability.

    摘要翻译： 提供了一种照相机模块包装，包括：具有设置在其一个表面上的图像传感器的基板和与图像传感器电连接的焊盘; 保护盖通过围绕图像传感器的粘合剂附着在基板上，以密封图像传感器，保护盖透射光; 以及围绕保护盖的支撑部分，支撑部分粘附并支撑形成对应于图像传感器的至少一个透镜。 相机模块包装的厚度和尺寸减小，并且在透镜和图像传感器之间的焦距误差最小化，从而实现精度和高可靠性。