公开(公告)号：US20170210949A1

公开(公告)日：2017-07-27

申请号：US15300141

申请日：2015-04-02

Applicant: LINTEC CORPORATION

Inventor： Satoshi KAWADA ,  Kiichiro KATO ,  Kazue UEMURA ,  Yumiko AMINO ,  Shigeru SAITO ,  Koji TSUCHIBUCHI ,  Takamasa KASE

IPC: C09J7/02 ,  C08K3/34 ,  C09J133/08 ,  C09J5/00

CPC classification number: C09J7/383 ,  B05D1/36 ,  B05D3/108 ,  B05D5/00 ,  C08K3/013 ,  C08K3/34 ,  C08K3/346 ,  C08K3/36 ,  C08K7/00 ,  C08K2201/003 ,  C09J5/00 ,  C09J7/02 ,  C09J7/0207 ,  C09J7/0217 ,  C09J7/0253 ,  C09J7/026 ,  C09J7/0285 ,  C09J7/10 ,  C09J7/20 ,  C09J7/203 ,  C09J7/22 ,  C09J7/255 ,  C09J7/38 ,  C09J7/385 ,  C09J11/04 ,  C09J121/00 ,  C09J133/08 ,  C09J167/00 ,  C09J175/04 ,  C09J201/00 ,  C09J2201/16 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2205/10 ,  C09J2205/102 ,  C09J2205/114 ,  C09J2400/163 ,  C09J2421/00 ,  C09J2433/00 ,  C09J2467/006 ,  C09J2475/00 ,  C09J2483/005 ,  C08K3/00

Abstract: A pressure sensitive adhesive sheet containing, on a substrate or a release material, a resin layer that includes a resin part (X) containing a resin as a main component, and a particle part (Y) consisting of fine particles, at least a surface (α) of the resin layer being opposite to the side thereof on which the substrate or the release material is provided having pressure sensitive adhesiveness, wherein one or more concave portions exist on the surface (α), and when the surface (α) of the resin layer is adhered to a smooth surface of a light transmissive adherend having a smooth surface to give a laminate, the pressure sensitive adhesive sheet satisfies the following requirements (1) and (2). Requirement (1): in an environment at 23° C. and 50% RH, the areal ratio (S1) of the attached area against the smooth surface of the light transmissive adherend to the surface (α) before heating is 10 to 95%. Requirement (2): after the laminate is statically left in an environment at 80° C. for 30 minutes, the area increase rate {[(S2−S1)/S1]×100} calculated from the areal ratio (S2) of the attached area after heating of the smooth surface of the light transmissive adherend to the surface (α) and the areal ratio (S1) thereof before heating, is −10 to 20%.

公开(公告)号：US20240052206A1

公开(公告)日：2024-02-15

申请号：US18039901

申请日：2021-11-30

Applicant: LINTEC CORPORATION

Inventor： Koji TSUCHIBUCHI ,  Naoki TAYA

IPC: C09J7/35 ,  C09J11/04 ,  C09J123/06 ,  C09J9/00 ,  B32B37/12 ,  B32B3/26 ,  B32B7/12 ,  B32B5/02 ,  B32B5/26

CPC classification number: C09J7/35 ,  C09J11/04 ,  C09J123/06 ,  C09J9/00 ,  B32B37/12 ,  B32B3/263 ,  B32B7/12 ,  B32B5/02 ,  B32B5/26 ,  C09J2301/408 ,  C09J2400/143 ,  C09J2423/04 ,  B32B2310/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2307/7376 ,  B32B2307/204 ,  B32B2307/748 ,  B32B2264/1025

Abstract: A high-frequency-dielectric-heating adhesive configured to bond three or more adherends is provided. The high-frequency-dielectric-heating adhesive contains a thermoplastic resin and a dielectric filler configured to generate heat upon application of a high-frequency electric field. MVR of the high-frequency-dielectric-heating adhesive in a range from a lower-limit temperature TL to an upper-limit temperature TU is in a range from 1 to 300 cm3/10 min, where the lower-limit temperature TL (unit: degrees C.) is defined by a numerical formula (Numerical Formula 11) below and the upper-limit temperature TU (unit: degrees C.) is defined by a numerical formula (Numerical Formula 12) below,


TL=(softening temperature TM of the high-frequency-dielectric-heating adhesive)+10 degrees C.  (Numerical Formula 11)



TU=(thermal decomposition temperature TD of the high-frequency-dielectric-heating adhesive)−10 degrees C.  (Numerical Formula 12).

公开(公告)号：US20210008833A1

公开(公告)日：2021-01-14

申请号：US16980628

申请日：2019-03-13

Applicant: LINTEC CORPORATION

Inventor： Koji TSUCHIBUCHI ,  Kiichiro KATO

IPC: B32B7/06 ,  B32B7/12 ,  B32B27/32 ,  B32B3/26 ,  C09J7/38 ,  C09J7/40

Abstract: The present invention relates to a substrate for release sheet including a support, an adhesion layer (X1), and a resin layer (Y1) containing polyethylene having a density of 930 kg/m3 or more and 960 kg/m3 or less in this order, wherein convex portions are present on the surface of the resin layer (Y1), and a difference in height of the convex portions is 0.5 μm or more.

公开(公告)号：US20240002711A1

公开(公告)日：2024-01-04

申请号：US18039893

申请日：2021-11-30

Applicant: LINTEC CORPORATION

Inventor： Naoki TAYA ,  Koji TSUCHIBUCHI

IPC: C09J201/00 ,  C09J11/04

CPC classification number: C09J201/00 ,  C09J11/04 ,  C09J2301/312 ,  C09J2301/304 ,  C09J2301/50

Abstract: A high-frequency-dielectric-heating adhesive for bonding three or more adherends to each other is provided. A dielectric property DP1 of the adhesive and a dielectric property DP2 of each of the adherends satisfy a numerical formula (Numerical Formula 1). The adherends are each an adherend having no flow start temperature or an adherend having the flow start temperature. A flow start temperature TF2 (degrees C.) of the adherends and a flow start temperature TF1 (degrees C.) of the adhesive satisfy a numerical formula (Numerical Formula 2). The dielectric properties DP1, DP2 are defined by values of dielectric properties (tan δ/ε′r), where tan δ and ε′r are respectively a dielectric dissipation factor and a relative permittivity at 23 degrees C. and a frequency of 40.68 MHz,


0

公开(公告)号：US20230250316A1

公开(公告)日：2023-08-10

申请号：US18012755

申请日：2021-06-25

Applicant: LINTEC CORPORATION

Inventor： Koji TSUCHIBUCHI ,  Naoki TAYA

IPC: C09J7/35 ,  C09J9/02

CPC classification number: C09J7/35 ,  C09J9/02 ,  C09J2301/304 ,  C09J2301/408 ,  C09J2423/10 ,  C09J2423/04

Abstract: An adhesive agent for high-frequency dielectric heating at least contains a thermoplastic resin and a dielectric filler that generates heat upon application of a high-frequency electric field. The thermoplastic resin at least contains a first thermoplastic resin and a second thermoplastic resin. The thermoplastic resin is a silane-modified thermoplastic resin. The second thermoplastic resin is a thermoplastic resin that is not silane-modified.

公开(公告)号：US20170174943A1

公开(公告)日：2017-06-22

申请号：US15129892

申请日：2015-04-02

Applicant: LINTEC CORPORATION

Inventor： Kiichiro KATO ,  Kazue UEMURA ,  Yumiko AMINO ,  Shigeru SAITO ,  Koji TSUCHIBUCHI ,  Masaru MATSUSHIMA

IPC: C09J7/02

CPC classification number: C09J7/383 ,  B05D1/36 ,  B05D3/108 ,  B05D5/00 ,  C08K3/013 ,  C08K3/34 ,  C08K3/346 ,  C08K3/36 ,  C08K7/00 ,  C08K2201/003 ,  C09J5/00 ,  C09J7/10 ,  C09J7/20 ,  C09J7/203 ,  C09J7/22 ,  C09J7/255 ,  C09J7/38 ,  C09J7/385 ,  C09J11/04 ,  C09J121/00 ,  C09J133/08 ,  C09J167/00 ,  C09J175/04 ,  C09J201/00 ,  C09J2201/16 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2205/10 ,  C09J2205/102 ,  C09J2205/114 ,  C09J2400/163 ,  C09J2421/00 ,  C09J2433/00 ,  C09J2467/006 ,  C09J2475/00 ,  C09J2483/005 ,  C08K3/00

Abstract: Provided is a pressure sensitive adhesive sheet containing a resin layer on a substrate or a release material, at least a surface (α) of the resin layer being opposite to the side thereof on which the substrate or the release material is provided having pressure sensitive adhesiveness, wherein one or more concave portions formed not by transferring an emboss pattern exist on the surface (α). The pressure sensitive adhesive sheet has excellent air escape property capable of readily removing air accumulation that may be formed on attaching

公开(公告)号：US20230257636A1

公开(公告)日：2023-08-17

申请号：US18012852

申请日：2021-06-25

Applicant: LINTEC CORPORATION

Inventor： Koji TSUCHIBUCHI ,  Naoki TAYA

IPC: C09J123/12 ,  C08K5/5415 ,  B32B7/12 ,  B32B17/10 ,  B32B27/20 ,  B32B37/12 ,  B32B27/32 ,  B32B37/06

CPC classification number: C09J123/12 ,  C08K5/5415 ,  B32B7/12 ,  B32B17/10 ,  B32B27/20 ,  B32B37/1284 ,  B32B27/32 ,  B32B37/06 ,  C08K2003/2296

Abstract: A high-frequency dielectric heating adhesive sheet includes an adhesive layer. The adhesive layer contains a thermoplastic resin having a reactive site, a dielectric filler that generates heat upon application of a high-frequency electric field, and a silane coupling agent.

公开(公告)号：US20230111471A1

公开(公告)日：2023-04-13

申请号：US17914251

申请日：2021-03-31

Applicant: LINTEC CORPORATION

Inventor： Koji TSUCHIBUCHI ,  Naoki TAYA

IPC: C09J153/02 ,  C09J5/06 ,  C09J11/04 ,  C08K3/22

Abstract: A high-frequency dielectric heating adhesive contains a thermoplastic resin, in which the thermoplastic resin contains a styrene copolymer resin, an amount of the styrene copolymer resin contained in the thermoplastic resin is 40% or more by volume and 100% or less by volume, the styrene copolymer resin has a styrene monomer unit content of 10% or more by mass and 90% or less by mass, the high-frequency dielectric heating adhesive has a tensile modulus of 20 MPa or more, and the high-frequency dielectric heating adhesive has a dielectric property (tan δ/ε'r) of 0.005 or more, where tan δ is a dielectric loss tangent at 23° C. and a frequency of 40.68 MHz, and ε'r is a relative dielectric constant at 23° C. and a frequency of 40.68 MHz.

公开(公告)号：US20180265749A1

公开(公告)日：2018-09-20

申请号：US15762907

申请日：2016-09-27

Applicant: LINTEC CORPORATION

Inventor： Kazue UEMURA ,  Kiichiro KATO ,  Yumiko AMINO ,  Koji TSUCHIBUCHI ,  Takamasa KASE ,  Yusuke MATSUOKA

IPC: C09J7/38 ,  B32B7/06 ,  B32B7/12 ,  B32B27/36 ,  B32B27/08 ,  C09J7/25 ,  C09J11/04

Abstract: A pressure sensitive adhesive sheet including, on a substrate or a release material, a resin layer, at least a surface (α) of the resin layer on the opposite to the side on which the substrate or release material is provided having pressure sensitive adhesiveness, wherein a concave portion and a flat face exist on the surface (α) of the resin layer, and a width of the concave portion observed from the side of the surface (α) is non-uniform, and in a region (D) of 8 mm in length×10 mm in width as freely-selected on the surface (α), a concave portion having an area of 70 to 99.99% relative to 100% of a total area of the concave portions existing in the region (D) exists.

公开(公告)号：US20180264489A1

公开(公告)日：2018-09-20

申请号：US15763185

申请日：2016-09-27

Applicant: LINTEC CORPORATION

Inventor： Koji TSUCHIBUCHI ,  Kazue UEMURA ,  Kiichiro KATO

IPC: B05B5/10 ,  B05D7/24 ,  B32B27/00 ,  B32B3/30 ,  C09J11/04 ,  C09J201/00 ,  C09J7/20

CPC classification number: B05B5/10 ,  B05D7/24 ,  B32B3/30 ,  B32B27/00 ,  C08G2170/40 ,  C08K3/00 ,  C08K3/013 ,  C08K3/34 ,  C08K3/346 ,  C08K3/36 ,  C08K7/00 ,  C09J5/00 ,  C09J7/20 ,  C09J7/38 ,  C09J11/04 ,  C09J133/02 ,  C09J133/08 ,  C09J175/04 ,  C09J201/00 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2205/102 ,  C09J2421/00 ,  C09J2433/00 ,  C09J2467/006 ,  C09J2475/00 ,  C09D133/08

Abstract: Provided are a pressure sensitive adhesive sheet including, on a substrate, a resin layer containing a resin which is a resin layer containing a resin part (X) containing a resin as a main component and a particle part (Y) consisting of fine particles, at least a surface (α) of the resin layer on the side opposite to the side thereof on which the substrate is provided, having pressure sensitive adhesiveness, wherein a bending stress coefficient k in the MD direction of the substrate is 20 N·mm or less, a 10% elongation strength in the MD direction thereof is 260 N/15 mm or less, and concave portions satisfying specified requirements are included on the surface (α) of the resin layer; and a method for producing the pressure sensitive adhesive sheet.