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公开(公告)号：US06425518B1
公开(公告)日：2002-07-30
申请号：US09912845
申请日：2001-07-25
IPC分类号： B23K3102
CPC分类号： B23K3/0638 , B23K2101/42 , H05K3/3468 , H05K2201/10424 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , H05K2203/128
摘要： There is provided a method for applying solder to an element on a surface of a substrate. The method comprises the steps of (a) placing a mold over the surface, where the mold includes a conduit that contains the solder, and (b) heating the solder to a molten state so that the solder flows from the conduit onto the element. The conduit enjoys two degrees of horizontal freedom with respect to the surface such that the conduit becomes substantially aligned with the element when the solder is in the molten state. There is also provided a system for applying solder to an element on a surface of a substrate.
摘要翻译： 提供了将焊料施加到基板表面上的元件的方法。 该方法包括以下步骤：（a）将模具放置在表面上，其中模具包括含有焊料的导管，和（b）将焊料加热至熔融状态，使得焊料从导管流到元件上。 导管相对于表面具有两度的水平自由度，使得当焊料处于熔融状态时，导管变得基本上与元件对齐。 还提供了一种用于将焊料施加到衬底表面上的元件的系统。
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公开(公告)号：US6029882A
公开(公告)日：2000-02-29
申请号：US67904
申请日：1998-04-27
CPC分类号： B23K3/0638 , H01L21/4853 , H05K3/3468 , B23K2201/40 , H01L2224/11003 , H01L2924/01019 , H01L2924/01068 , H01L2924/01322 , H01L2924/10253 , H05K2201/10424 , H05K2203/0113 , H05K2203/0338 , H05K2203/128
摘要： Disclosed is a solder injection mold apparatus and method for providing solder balls to a printed circuit board substrate using the solder injection mold apparatus in the plastic ball grid array (PBGA). The solder mold through holes are chamfered at entry and at exit ends to assist in receipt of molten solder and the formation and transfer of solder balls to lands on the substrate. A blind recess is provided in the second major surface of the mold, i.e. the side facing the substrate, in order to accommodate electronic components mounted thereon. Solder balls are delivered and metallurgically affixed to the lands in a process that requires only one reflow, leaving the through holes clean of solder and the mold ready for reuse. The material of which the substrate, mold and base plate are comprised is selected to be non-wettable by solder and mutually compatible with respect to CTE when exposed to temperatures of molten solder.
摘要翻译： 公开了一种使用塑料球栅阵列（PBGA）中的焊料注射模具装置向印刷电路板基板提供焊球的焊料注射模具装置和方法。 焊接模具通孔在入口处和出口端被倒角，以帮助接收熔融焊料，并且将焊球形成和转移到衬底上的焊盘上。 在模具的第二主表面，即面向衬底的一侧设置盲孔，以容纳安装在其上的电子部件。 焊球在仅需要一个回流的过程中输送和冶金地附着在焊盘上，留下通孔清洁焊料并且模具准备好重新使用。 选择基材，模具和基板的材料，当暴露于熔融焊料的温度时，被选择为不被焊料润湿并且相对于CTE相互兼容。
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公开(公告)号：US06708872B2
公开(公告)日：2004-03-23
申请号：US10107985
申请日：2002-03-27
IPC分类号： B23K3102
CPC分类号： B23K3/0638 , B23K2101/42 , H05K3/3468 , H05K2201/10424 , H05K2203/0113 , H05K2203/0338 , H05K2203/043 , H05K2203/128
摘要： There is provided a method for applying solder to an element on a surface of a substrate. The method comprises the steps of (a) placing a mold over the surface, where the mold includes a conduit that contains the solder, and (b) heating the solder to a molten state so that the solder flows from the conduit onto the element. The conduit enjoys two degrees of horizontal freedom with respect to the surface such that the conduit becomes substantially aligned with the element when the solder is in the molten state. There is also provided a system for applying solder to an element on a surface of a substrate.
摘要翻译： 提供了将焊料施加到基板表面上的元件的方法。 该方法包括以下步骤：（a）将模具放置在表面上，其中模具包括含有焊料的导管，和（b）将焊料加热至熔融状态，使得焊料从导管流到元件上。 导管相对于表面具有两度的水平自由度，使得当焊料处于熔融状态时，导管变得基本上与元件对齐。 还提供了一种用于将焊料施加到衬底表面上的元件的系统。
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公开(公告)号：US6153505A
公开(公告)日：2000-11-28
申请号：US388300
申请日：1999-09-01
CPC分类号： B23K3/0638 , H01L21/4853 , H05K2201/10424 , H05K2203/0113 , H05K2203/0338 , H05K2203/128
摘要： Disclosed is a solder injection mold apparatus and method for providing solder balls to a printed circuit board substrate using the solder injection mold apparatus in the plastic ball grid array (PBGA). The solder mold through holes are chamfered at entry and at exit ends to assist in receipt of molten solder and the formation and transfer of solder balls to lands on the substrate. A blind recess is provided in the second major surface of the mold, i.e. the side facing the substrate, in order to accommodate electronic components mounted thereon. Solder balls are delivered and metallurgically affixed to the lands in a process that requires only one reflow, leaving the through holes clean of solder and the mold ready for reuse. The material of which the substrate, mold and base plate are comprised is selected to be non-wettable by solder and mutually compatible with respect to CTE when exposed to temperatures of molten solder.
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公开(公告)号：US07867842B2
公开(公告)日：2011-01-11
申请号：US12181852
申请日：2008-07-29
IPC分类号： H01L21/8242
CPC分类号： B23K1/0016 , H01L21/4853 , H01L21/6835 , H01L23/3128 , H01L23/49816 , H01L24/11 , H01L24/13 , H01L24/16 , H01L2224/0554 , H01L2224/05567 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1183 , H01L2224/1184 , H01L2224/11848 , H01L2224/13099 , H01L2224/16225 , H01L2224/81192 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01032 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , Y10T428/24612 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for forming alloy deposits at selected areas on a receiving substrate includes the steps of: providing an alloy carrier including at least a first decal including a first plurality of openings and a second decal including a second plurality of openings, the first and second decals being arranged such that each of the first plurality of openings is in alignment with a corresponding one of the second plurality of openings; filling the first and second plurality of openings with molten alloy; cooling the molten alloy to thereby form at least first and second plugs, the first plug having a first surface and a second surface substantially parallel to one another, the second plug having a third surface and a fourth surface substantially parallel to one another; removing at least one of the first and second decals to at least partially expose the first and second plugs; aligning the alloy carrier with the receiving substrate so that the first and second plugs correspond to the selected areas on the receiving substrate; and transferring the first plug to a first of the selected areas and the second plug to a second of the selected areas.
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公开(公告)号：US20100025863A1
公开(公告)日：2010-02-04
申请号：US12510650
申请日：2009-07-28
申请人： Peter Alfred Gruber , Jae-Woong Nah
发明人： Peter Alfred Gruber , Jae-Woong Nah
IPC分类号： H01L23/50
CPC分类号： H01L23/49894 , H01L21/563 , H01L21/6835 , H01L23/49811 , H01L23/49816 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/11003 , H01L2224/11334 , H01L2224/13111 , H01L2224/16225 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01055 , H01L2924/01075 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/00
摘要： Techniques for interconnecting an IC chip and a receiving substrate are provided. A method includes the steps of: providing the IC chip, the IC chip including at least a first connection site formed thereon; providing the receiving substrate, the receiving substrate including at least a second connection site formed thereon; forming an alloy structure on at least a portion of an upper surface of the second connection site; orienting the IC chip relative to the receiving substrate so that the at least first connection site is aligned with the alloy deposit formed on the at least second connection site; and forming an electrical connection between the first and second connection sites, the electrical connection comprising a volume of electrically conductive fusible material, wherein a majority of the volume of electrically conductive fusible material is supplied from the alloy structure.
摘要翻译： 提供了用于互连IC芯片和接收基板的技术。 一种方法包括以下步骤：提供IC芯片，IC芯片至少包括形成在其上的第一连接部位; 提供接收基板，所述接收基板至少包括形成在其上的第二连接部位; 在所述第二连接部位的上表面的至少一部分上形成合金结构; 使所述IC芯片相对于所述接收基板定向，使得所述至少第一连接部位与形成在所述至少第二连接部位上的所述合金沉积物对准; 以及在所述第一和第二连接部位之间形成电连接，所述电连接包括一定体积的导电性易熔材料，其中大部分体积的导电性易熔材料从所述合金结构供给。
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公开(公告)号：US06390439B1
公开(公告)日：2002-05-21
申请号：US09287370
申请日：1999-04-07
申请人： Steven A. Cordes , David Hirsch Danovitch , Peter Alfred Gruber , James Louis Speidell , Joseph Peter Zinter
发明人： Steven A. Cordes , David Hirsch Danovitch , Peter Alfred Gruber , James Louis Speidell , Joseph Peter Zinter
IPC分类号： B29C3300
CPC分类号： B23K3/0623 , B23K3/0638 , B23K2101/40 , H05K3/3457 , Y10T156/10
摘要： Hybrid molds for molding a multiplicity of solder balls for use in a molten solder screening process and methods for preparing such molds are disclosed. A method for forming the multiplicity of cavities in a pyramidal shape by anisotropically etching a crystalline silicon substrate along a specific crystallographic plane is utilized to form a crystalline silicon face plate used in the present invention hybrid mold. In a preferred embodiment, a silicon face plate is bonded to a borosilicate glass backing plate by adhesive means in a method that ensures coplanarity is achieved between the top surfaces of the silicon face plate and the glass backing plate. In an alternate embodiment, an additional glass frame is used for bonding a silicon face plate to a glass backing plate, again with ensured coplanarity between the top surfaces of the silicon face plate and the glass frame. In a second alternate embodiment, a silicon face plate is encased in an extender material which may be borosilicate glass or a polymer. The encasing is performed on a leveling fixture such that the top surface of the silicon face plate and the top surface of the extender material after solidification are perfectly leveled.
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公开(公告)号：US6056191A
公开(公告)日：2000-05-02
申请号：US70121
申请日：1998-04-30
CPC分类号： H05K3/3457 , B23K3/0623 , H01L24/11 , H01L2224/05571 , H01L2224/05573 , H01L2224/056 , H01L2224/13099 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H05K2203/0113
摘要： The present invention discloses a method and apparatus for forming solder bumps by a molten solder screening technique in which a flexible die head constructed of a metal sheet is utilized for maintaining an intimate contact between the die head and a solder receiving mold surface. The flexible die head, when used in combination with a pressure means, is capable of conforming to any curved mold surface as long as the curvature is not more than 2.5 .mu.m per inch of die length. The present invention further provides a method and apparatus for filling a multiplicity of cavities in a mold surface by providing a stream of molten solder and then intimately contacting the surface of the molten solder with a multiplicity of cavities such that the molten solder readily fills the cavities. The apparatus further provides means for removing excess molten solder from the surface of the mold without disturbing the molten solder already filled in the cavities. The present invention further discloses a flexible die for dispensing molten solder consisting of a die body that is constructed of a metal sheet capable of flexing of not less than 1.5 .mu.m per inch of die length, a gate opening for receiving a supply of molten solder, a slot opening for dispensing the molten solder onto a solder receiving surface, and a pressure means associated with the die body for providing adequate pressure such that the die body intimately contacting the solder receiving mold surface.
摘要翻译： 本发明公开了一种通过熔融焊料筛选技术形成焊料凸块的方法和装置，其中使用由金属板构成的柔性模头来保持模头和焊料接收模具表面之间的紧密接触。 当与压力装置组合使用时，柔性模头能够符合任何弯曲的模具表面，只要曲率不超过每英寸模头长度2.5微米。 本发明还提供了一种用于通过提供熔融焊料流来填充模具表面中的多个空腔并随后使熔融焊料的表面与多个空腔紧密接触的方法和装置，使得熔融焊料容易地填充空腔 。 该装置还提供了用于从模具表面去除多余的熔融焊料而不干扰已经填充在空腔中的熔融焊料的装置。 本发明还公开了一种用于分配熔融焊料的柔性模具，其由由能够弯曲不小于每英寸模头长度1.5μm的金属板构成的模具本体构成，用于接收熔融焊料供应的门开口 ，用于将熔融焊料分配到焊料接收表面上的槽口，以及与模具本体相关联的压力装置，用于提供足够的压力，使得模具体与焊料接收模具表面紧密接触。
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公开(公告)号：US6003757A
公开(公告)日：1999-12-21
申请号：US70120
申请日：1998-04-30
CPC分类号： H05K3/3468 , B23K3/0623 , H01L21/67092 , H01L24/11 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K2203/0113 , H05K2203/0278 , H05K2203/0338 , H05K2203/128
摘要： An apparatus and a method for transferring solder bumps from a solder mold to a solder-receiving substrate are disclosed. The apparatus includes a transfer fixture constructed by a base member, a lid member and a compressible member for holding a mold/substrate assembly therein. A plurality of compression pins are mounted through the lid member for supplying a uniform pressure on the mold/substrate assembly and for allowing lateral motion of the mold/substrate assembly relative to the transfer fixture due to a mismatch in the coefficients of thermal expansion. The compressible member is a cellulosic foam sheet which applies a uniform joining force across the entire surface of a wafer and assures abutting contact between the entire wafer and the mold surface. The foam sheet further assists in the lateral movement of the mold/substrate assembly relative to the base member of the transfer fixture.
摘要翻译： 公开了一种用于将焊料凸起从焊料转移到焊料接收衬底的装置和方法。 该装置包括由基座构件，盖构件和用于将模具/基板组件保持在其中的可压缩构件构成的转移夹具。 通过盖构件安装多个压缩销，以在模具/基板组件上提供均匀的压力，并且由于热膨胀系数的不匹配而允许模具/衬底组件相对于转移夹具的横向运动。 可压缩构件是纤维素泡沫片材，其在晶片的整个表面上施加均匀的接合力，并确保整个晶片和模具表面之间的邻接接触。 泡沫片材还有助于模具/基材组件相对于转印夹具的基底部件的横向移动。
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公开(公告)号：US08703274B2
公开(公告)日：2014-04-22
申请号：US12244067
申请日：2008-10-02
申请人： Russell A. Budd , Bing Dang , William S. Graham , Peter Alfred Gruber , Richard Levine , Da-Yuan Shih
发明人： Russell A. Budd , Bing Dang , William S. Graham , Peter Alfred Gruber , Richard Levine , Da-Yuan Shih
IPC分类号： B32B3/00
CPC分类号： B23K1/0016 , B23K1/20 , B23K26/364 , B23K2101/40 , H05K1/111 , H05K3/3457 , H05K2201/09381 , H05K2201/0969 , H05K2201/09745 , H05K2203/043 , Y02P70/611 , Y10T428/24479
摘要： A microcavity structure is provided. The structure comprises a cavity layout that enables centering of reflowed solder at each of one or more interconnect locations and protrusion of the reflowed solder sufficiently from the cavity to facilitate wetting. Techniques are also provided for producing a microcavity structure, for using injection molded solder (IMS) for micro bumping, as well as for using injection molded solder (IMS) for three-dimensional (3D) packaging.
摘要翻译： 提供微腔结构。 该结构包括空腔布局，其能够使一个或多个互连位置中的每一个处的回流焊料居中并且使回流焊料从空腔充分突出以促进润湿。 还提供了用于制造微腔结构的技术，用于使用用于微型凸起的注射成型焊料（IMS）以及用于三维（3D）封装的注射成型焊料（IMS）。
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