Single crystal and semiconductor wafer and apparatus and method for producing a single crystal
    1.
    发明申请
    Single crystal and semiconductor wafer and apparatus and method for producing a single crystal 审中-公开
    单晶和半导体晶片及其制造方法

    公开(公告)号:US20070163485A1

    公开(公告)日:2007-07-19

    申请号:US11655509

    申请日:2007-01-18

    IPC分类号: C30B15/00 C30B11/00 C30B21/06

    摘要: The disclosure relates to an apparatus and a method for producing a single crystal of semiconductor material. The apparatus comprises a chamber and a crucible which is arranged in the chamber and is enclosed by a crucible heater, a radiation shield for shielding a growing single crystal and thermal insulation between the crucible heater and an inner wall of the chamber. The apparatus may include a resilient seal which seals a gap between the inner wall and the thermal insulation and forms an obstacle for the transport of gaseous iron carbonyls to the single crystal. The disclosure also relates to a method for producing a single crystal of semiconductor material by using the apparatus, the single crystal which is produced and a semiconductor wafer cut therefrom. The single crystal and the semiconductor wafer are distinguished by an edge region, which extends from the circumference to a distance of up to R-5 mm radially into the single crystal or the semiconductor wafer and has an iron concentration, wherein the iron concentration in the edge region is less than 1*109 atoms/cm3.

    摘要翻译: 本公开涉及一种用于制造半导体材料的单晶的装置和方法。 该装置包括一个室和一个坩埚,该坩埚被布置在室中并由坩埚加热器封闭,用于屏蔽增长的单晶的辐射屏蔽以及坩埚加热器和室的内壁之间的绝热。 该装置可以包括密封内壁和隔热层之间的间隙的弹性密封件,并且形成用于将气态铁羰基转移到单晶的障碍物。 本公开还涉及通过使用该装置制造半导体材料的单晶的方法,所制造的单晶和从其切下的半导体晶片。 单晶和半导体晶片的区别在于边缘区域,其从圆周延伸到直径为R-5mm的距离,直到单晶或半导体晶片,并具有铁浓度,其中铁浓度 边缘区域小于1×10 9原子/ cm 3。

    SINGLE CRYSTAL AND SEMICONDUCTOR WAFER AND APPARATUS AND METHOD FOR PRODUCING A SINGLE CRYSTAL
    2.
    发明申请
    SINGLE CRYSTAL AND SEMICONDUCTOR WAFER AND APPARATUS AND METHOD FOR PRODUCING A SINGLE CRYSTAL 审中-公开
    单晶和半导体晶体及其制造方法

    公开(公告)号:US20090031945A1

    公开(公告)日:2009-02-05

    申请号:US12175376

    申请日:2008-07-17

    IPC分类号: C30B15/10

    摘要: The disclosure relates to an apparatus and a method for producing a single crystal of semiconductor material. The apparatus comprises a chamber and a crucible which is arranged in the chamber and is enclosed by a crucible heater, a radiation shield for shielding a growing single crystal and thermal insulation between the crucible heater and an inner wall of the chamber. The apparatus may include a resilient seal which seals a gap between the inner wall and the thermal insulation and forms an obstacle for the transport of gaseous iron carbonyls to the single crystal. The disclosure also relates to a method for producing a single crystal of semiconductor material by using the apparatus, the single crystal which is produced and a semiconductor wafer cut therefrom. The single crystal and the semiconductor wafer are distinguished by an edge region, which extends from the circumference to a distance of up to R-5 mm radially into the single crystal or the semiconductor wafer and has an iron concentration, wherein the iron concentration in the edge region is less than 1*109 atoms/cm3.

    摘要翻译: 本公开涉及一种用于制造半导体材料的单晶的装置和方法。 该装置包括一个室和一个坩埚,该坩埚被布置在室中并由坩埚加热器封闭,用于屏蔽增长的单晶的辐射屏蔽以及坩埚加热器和室的内壁之间的绝热。 该装置可以包括密封内壁和隔热层之间的间隙的弹性密封件,并且形成用于将气态铁羰基转移到单晶的障碍物。 本公开还涉及通过使用该装置制造半导体材料的单晶的方法,所制造的单晶和从其切下的半导体晶片。 单晶和半导体晶片的区别在于边缘区域,其从圆周延伸到直径为R-5mm的距离,直到单晶或半导体晶片,并具有铁浓度,其中铁浓度 边缘区域小于1×10 9原子/ cm 3。

    Process for producing a semiconductor wafer
    3.
    发明授权
    Process for producing a semiconductor wafer 失效
    半导体晶片的制造方法

    公开(公告)号:US06416393B2

    公开(公告)日:2002-07-09

    申请号:US09824394

    申请日:2001-04-02

    IPC分类号: B24B719

    摘要: A process is for producing a semiconductor wafer with a front surface and a back surface, in which the semiconductor wafer is subjected to two-sided polishing. The process includes the following: (a) producing a hydrophobic surface on the semiconductor wafer by treating the semiconductor wafer with an aqueous HF solution; (b) simultaneous polishing of the front surface and the back surface of the semiconductor wafer with a surface which has been rendered hydrophobic, with an alkaline polishing abrasive being continuously supplied between two rotating upper and lower polishing plates, which are both covered with a polishing cloth, the pH of the polishing abrasive being from pH 8.5 to pH 12.5; (c) after an intended polishing abrasion has been reached, supplying a stopping agent to the semiconductor wafer; and (d) removing the semiconductor wafer from the polishing plates. There is also a carrier for the double-side polishing of at least one semiconductor wafer, having a cutout for holding the semiconductor wafer which is lined with a shaped part made from plastic. The shaped part is constructed in such a manner that it divides a free space between an edge of the semiconductor wafer and the carrier into a plurality of separate empty spaces.

    摘要翻译: 一种制造具有正面和背面的半导体晶片的方法,其中半导体晶片进行双面抛光。 该方法包括以下步骤:(a)通过用HF水溶液处理半导体晶片在半导体晶片上产生疏水表面; (b)用已经变得疏水的表面同时抛光半导体晶片的前表面和后表面,碱性抛光磨料被连续地供应在两个旋转的上和下抛光板之间,两个旋转的上和下抛光板都被抛光 布,抛光磨料的pH为pH8.5至pH12.5; (c)在达到预期的抛光磨损之后,向半导体晶片供应止动剂; 和(d)从抛光板上去除半导体晶片。 还有一种用于至少一个半导体晶片的双面抛光的载体,具有用于保持半导体晶片的切口,该半导体晶片衬有由塑料制成的成形部件。 成形部分以这样的方式构造,即将半导体晶片的边缘与载体之间的自由空间分成多个分开的空间。

    Recycling of high-boiling compounds within an integrated chlorosilane system
    4.
    发明授权
    Recycling of high-boiling compounds within an integrated chlorosilane system 有权
    在一体化氯硅烷系统内回收高沸点化合物

    公开(公告)号:US08557210B2

    公开(公告)日:2013-10-15

    申请号:US12281550

    申请日:2007-02-21

    IPC分类号: C01B33/107

    CPC分类号: C01B33/10763

    摘要: Trichlorosilane production is increased while simultaneously lowering environmental burden due to destruction and disposition of high boilers by feeding high boilers from trichlorosilane production or from polycrystalline silicon production into a fluidized bed for production of trichlorosilane from metallic silicon and hydrogen chloride.

    摘要翻译: 三氯硅烷生产增加,同时通过将来自三氯硅烷生产的高锅炉或从多晶硅生产送入用于从金属硅和氯化氢生产三氯硅烷的流化床,由于高锅炉的破坏和处置而降低环境负荷。

    Method of removing damaged crystal regions from silicon wafers
    5.
    发明授权
    Method of removing damaged crystal regions from silicon wafers 失效
    从硅晶片去除损坏的晶体区域的方法

    公开(公告)号:US5911889A

    公开(公告)日:1999-06-15

    申请号:US629378

    申请日:1996-04-08

    IPC分类号: H01L21/306 B44C1/22

    CPC分类号: H01L21/02019

    摘要: A method is provided to remove crystal regions from silicon wafers which are damaged as a consequence of mechanical machining of the silicon wafers. The silicon wafers are pretreated with an aqueous solution containing hydrogen fluoride. Then the wafers are etched in an aqueous solution exposed to ultrasound and containing alkali metal hydroxide at temperatures from 55.degree. C. to 95.degree. C.

    摘要翻译: 提供了一种从硅晶片去除由于硅晶片的机械加工而损坏的晶体区域的方法。 硅晶片用含氟化氢的水溶液预处理。 然后将晶片在暴露于超声波的水溶液中蚀刻,并在55℃至95℃的温度下包含碱金属氢氧化物。

    Cosmetic preparation for teeth
    6.
    发明授权
    Cosmetic preparation for teeth 失效
    化妆品准备牙齿

    公开(公告)号:US4482535A

    公开(公告)日:1984-11-13

    申请号:US387859

    申请日:1982-05-28

    CPC分类号: A61K6/083

    摘要: The subject of the invention is a cosmetic preparation for teeth which is composed of one or more film-forming polymers--at least one of which is water soluble, partly soluble, emulsifiable or dispersible--and coloring agents. The composition ensures the aesthetic appearance of the teeth and can--by contrast with earlier products--be removed easily and rapidly.

    摘要翻译: PCT No.PCT / HU81 / 00039 Sec。 371日期1982年5月28日 102(e)日期1982年5月28日PCT提交1981年10月2日PCT公布。 公开号WO82 / 01128 1982年4月15日。本发明的主题是由一种或多种成膜聚合物组成的牙齿化妆品,其中至少一种是水溶性的,部分可溶的,可乳化的或可分散的和着色剂。 该组合物确保了牙齿的美学外观,并且可以与早期产品相比较,可以容易且快速地去除。

    Process for producing storage-stable surfaces of polished silicon wafers
    7.
    发明授权
    Process for producing storage-stable surfaces of polished silicon wafers 失效
    抛光硅晶片的储存稳定表面的制造方法

    公开(公告)号:US5219613A

    公开(公告)日:1993-06-15

    申请号:US863394

    申请日:1992-04-03

    IPC分类号: H01L21/312 H01L21/316

    摘要: Silicon wafers are first subjected to an oxidative treatment and subsequey to exposure to organosilicon compounds which contain at least one radical in the molecule which is hydrolyzably bound to the silicon and at least one radical in the molecule having hydrophilic properties. Depending on the compound selected, more or less strongly hydrophilic or hydrophobic properties of the silicon surface can consequently be established under mild conditions. The wafers treated in such a manner have a high storage stability and retain their surface nature even under difficult climatic circumstances. The surface nature present after the oxidative treatment can then be restored particularly easily by hydrolysis.

    摘要翻译: 首先对硅晶片进行氧化处理,然后暴露于在分子中含有至少一个基团的有机硅化合物,其可水解地结合到硅和至少一个具有亲水性质的基团中。 取决于所选择的化合物,因此可以在温和的条件下建立硅表面的或多或少的强亲水性或疏水性。 以这种方式处理的晶片具有高的储存稳定性并且即使在困难的气候条件下也保持其表面性质。 然后在氧化处理后存在的表面性质可以通过水解特别容易地恢复。

    RECYCLING OF HIGH-BOILING COMPOUNDS WITHIN AN INTEGRATED CHLOROSILANE SYSTEM
    10.
    发明申请
    RECYCLING OF HIGH-BOILING COMPOUNDS WITHIN AN INTEGRATED CHLOROSILANE SYSTEM 有权
    高浓度化合物在一体化氯化石系统中的回收

    公开(公告)号:US20090016947A1

    公开(公告)日:2009-01-15

    申请号:US12281550

    申请日:2007-02-21

    IPC分类号: C01B33/107

    CPC分类号: C01B33/10763

    摘要: Trichlorosilane production is increased while simultaneously lowering environmental burden due to destruction and disposition of high boilers by feeding high boilers from trichlorosilane production or from polycrystalline silicon production into a fluidized bed for production of trichlorosilane from metallic silicon and hydrogen chloride.

    摘要翻译: 三氯硅烷生产增加,同时通过将来自三氯硅烷生产的高锅炉或从多晶硅生产送入用于从金属硅和氯化氢生产三氯硅烷的流化床,由于高锅炉的破坏和处置而降低环境负荷。