公开(公告)号：US07542301B1

公开(公告)日：2009-06-02

申请号：US11159574

申请日：2005-06-22

申请人： Lily Liong ,  Kenneth D. Schatz ,  Gordon Craig ,  Mark A. Hadley ,  Eric Kanemoto

发明人： Lily Liong ,  Kenneth D. Schatz ,  Gordon Craig ,  Mark A. Hadley ,  Eric Kanemoto

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L24/19 ,  H01L24/24 ,  H01L24/95 ,  H01L24/97 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24101 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K3/0014 ,  H05K3/321 ,  H05K3/368 ,  H05K2201/09036 ,  H05K2201/0949 ,  H05K2201/09827 ,  H05K2201/10674 ,  H05K2201/10727 ,  H05K2203/0108 ,  H05K2203/0143 ,  H05K2203/1545 ,  H01L2224/82 ,  H01L2924/00

摘要： An embossing die, the die comprises one or more protruding features configured to create one or more corresponding recessed regions in a substrate; and a left side edge and a right side edge. Either the left side edge or the right side edge is a gradually sloping edge. The embossing die can be used to form an assembly. The assembly comprises a substrate including a more than one defined frames. Each of the defined frames comprises a plurality of recessed regions and a plurality of functional blocks, each functional block being deposited in one of the recessed regions. Each of the defined frames is separated from another frame by a region. The region can be a flattened region, a sloped region, or a plateau shaped region having a plateau top and two sloped sides, wherein each sloped side forms about 10-15 degree angle to a surface of the substrate.

摘要翻译： 压模包括一个或多个突出特征，其被配置为在基底中产生一个或多个相应的凹陷区域; 以及左侧边缘和右侧边缘。 左侧边缘或右侧边缘都是逐渐倾斜的边缘。 压花模具可用于形成组件。 组件包括包括多于一个定义的框架的基板。 每个定义的框架包括多个凹陷区域和多个功能块，每个功能块被沉积在一个凹进区域中。 每个定义的帧与另一个帧分开一个区域。 该区域可以是具有平台顶部和两个倾斜侧面的扁平区域，倾斜区域或平台形区域，其中每个倾斜侧面与基底的表面形成约10-15度的角度。

公开(公告)号：US07615479B1

公开(公告)日：2009-11-10

申请号：US11159526

申请日：2005-06-22

申请人： Gordon S. W. Craig ,  Mark A. Hadley ,  Susan Swindlehurst ,  Ali A. Tootoonchi ,  Eric Kanemoto ,  Eric Jonathan Snyder ,  Scott Herrmann ,  Glenn Gengel ,  Lily Liong

发明人： Gordon S. W. Craig ,  Mark A. Hadley ,  Susan Swindlehurst ,  Ali A. Tootoonchi ,  Eric Kanemoto ,  Eric Jonathan Snyder ,  Scott Herrmann ,  Glenn Gengel ,  Lily Liong

IPC分类号： H01L21/4763 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/31

CPC分类号： G06K19/07718 ,  G06K19/07749 ,  G06K19/07752 ,  G06K19/07756 ,  H01L23/66 ,  H01L24/19 ,  H01L24/24 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2224/83136 ,  H01L2224/95085 ,  H01L2224/95122 ,  H01L2224/95136 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15155 ,  H01L2924/15157 ,  H01L2924/15165 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T29/53178 ,  H01L2224/82 ,  H01L2224/83851 ,  H01L2924/00

摘要： An electronic assembly. The assembly includes a substrate, a plurality of recessed regions, and a plurality of functional blocks. Each functional block is deposited in one of the recessed regions. A substantial amount of the plurality of functional blocks is recessed below a top surface of the substrate. Substantial amount is defined by any one of less than 10% of said functional blocks protrudes above the top surface of the substrate; less than 1% of the functional blocks protrudes above the top surface of the substrate; more than 90% of the functional blocks are recessed below the top surface of the substrate; or more than 99% of the functional blocks are recessed below the top surface of the substrate.

摘要翻译： 电子组装。 组件包括衬底，多个凹陷区域和多个功能块。 每个功能块沉积在一个凹陷区域中。 大量的多个功能块被凹入到衬底的顶表面之下。 基本上限是由少于10％的所述功能块中的任何一个突出于衬底的顶表面之上; 少于1％的功能块突出于衬底的顶表面之上; 超过90％的功能块凹陷在基板的顶表面下方; 或超过99％的功能块凹陷在基板的顶表面下方。