摘要:
Integrated circuits with memory elements are provided. An integrated circuit may include logic circuitry formed in a first portion having complementary metal-oxide-semiconductor (CMOS) devices and may include at least a portion of the memory elements and associated memory circuitry formed in a second portion having nano-electromechanical (NEM) relay devices. The NEM and CMOS devices may be interconnected through vias in a dielectric stack. Devices in the first and second portions may receive respective power supply voltages. In one suitable arrangement, the memory elements may include two relay switches that provide nonvolatile storage characteristics and soft error upset (SEU) immunity. In another suitable arrangement, the memory elements may include first and second cross-coupled inverting circuits. The first inverting circuit may include relay switches, whereas the second inverting circuit includes only CMOS transistors. Memory elements configured in this way may be used to provide volatile storage characteristics and SEU immunity.
摘要:
Integrated circuits with memory elements are provided. An integrated circuit may include logic circuitry formed in a first portion having complementary metal-oxide-semiconductor (CMOS) devices and may include at least a portion of the memory elements and associated memory circuitry formed in a second portion having nano-electromechanical (NEM) relay devices. The NEM and CMOS devices may be interconnected through vias in a dielectric stack. Devices in the first and second portions may receive respective power supply voltages. In one suitable arrangement, the memory elements may include two relay switches that provide nonvolatile storage characteristics and soft error upset (SEU) immunity. In another suitable arrangement, the memory elements may include first and second cross-coupled inverting circuits. The first inverting circuit may include relay switches, whereas the second inverting circuit includes only CMOS transistors. Memory elements configured in this way may be used to provide volatile storage characteristics and SEU immunity.
摘要:
One embodiment relates to a buffered transistor device. The device includes a buffered vertical fin-shaped structure formed in a semiconductor substrate. The vertical fin-shaped structure includes at least an upper semiconductor layer, a buffer region, and at least part of a well region. The buffer region has a first doping polarity, and the well region has a second doping polarity which is opposite to the first doping polarity. At least one p-n junction that at least partially covers a horizontal cross section of the vertical fin-shaped structure is formed between the buffer and well regions. Other embodiments, aspects, and features are also disclosed.
摘要:
Asymmetric transistors may be formed by creating pocket implants on one source-drain terminal of a transistor and not the other. Asymmetric transistors may also be formed using dual-gate structures having first and second gate conductors of different work functions. Stacked transistors may be formed by stacking two transistors of the same channel type in series. One of the source-drain terminals of each of the two transistors is connected to a common node. The gates of the two transistors are also connected together. The two transistors may have different threshold voltages. The threshold voltage of the transistor that is located higher in the stacked transistor may be provided with a lower threshold voltage than the other transistor in the stacked transistor. Stacked transistors may be used to reduce leakage currents in circuits such as memory cells. Asymmetric transistors may also be used in memory cells to reduce leakage.
摘要:
A field programmable gate array (FPGA) includes a set of monitor circuits adapted to provide indications of process, voltage, and temperature for at least one circuit in the FPGA, and a controller adapted to derive a range of body-bias values for the at least one circuit from the indications of process, voltage, and temperature for the at least one circuit. The FPGA further includes a body-bias generator adapted to provide a body-bias signal to at least one transistor in the at least one circuit. The body-bias signal has a value within the range of body-bias values.
摘要:
A field programmable gate array (FPGA) includes a set of monitor circuits adapted to provide indications of process, voltage, and temperature for at least one circuit in the FPGA, and a controller adapted to derive a range of body-bias values for the at least one circuit from the indications of process, voltage, and temperature for the at least one circuit. The FPGA further includes a body-bias generator adapted to provide a body-bias signal to at least one transistor in the at least one circuit. The body-bias signal has a value within the range of body-bias values.
摘要:
Integrated circuits such as programmable logic device integrated circuits are provided that have configuration random-access memory elements. The configuration random-access memory elements are loaded with configuration data to customize programmable logic on the integrated circuits. Each memory element has a capacitor that stores data for that memory element. A pair of cross-coupled inverters are connected to the capacitor. The inverters ensure that the memory elements produce output control signals with voltages than range from one power supply rail to another. Each configuration random-access memory element may have a clear transistor. The capacitor may be formed in a dielectric layer that lies above the transistors of the inverters, the address transistor, and the clear transistor. The inverters may be powered with an elevated power supply voltage.
摘要:
Memory elements are provided that are immune to soft error upset events when subjected to high-energy atomic particle strikes. The memory elements have nonlinear high-impedance two-terminal elements that restrict the flow of discharge currents during a particle strike. By lengthening the switching speed of the memory elements, the presence of the nonlinear high-impedance two-terminal elements prevents the states of the memory elements from flipping during discharge transients. The nonlinear high-impedance two-terminal elements may be formed from polysilicon p-n junction diodes, Schottky diodes, and other semiconductor structures. Data loading circuitry is provided to ensure that memory element arrays using the nonlinear high-impedance two-terminal elements can be loaded rapidly.
摘要:
Apparatus and methods are disclosed for improving the performance of a programmable logic device (PLD). A PLD includes a memory cell configured to provide a pair of voltages to a gate of a pass transistor and a body of the pass transistor, respectively.
摘要:
Apparatus and methods are disclosed for improving the performance of a programmable logic device (PLD). A PLD includes a memory cell configured to provide a pair of voltages to a gate of a pass transistor and a body of the pass transistor, respectively.