公开(公告)号：US12148711B2

公开(公告)日：2024-11-19

申请号：US17524473

申请日：2021-11-11

Applicant: Lodestar Licensing Group LLC

Inventor： Owen R. Fay ,  Dong Soon Lim ,  Randon K. Richards ,  Aparna U. Limaye

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/31 ,  H01L23/66 ,  H01Q1/22

Abstract: Semiconductor devices with antennas and electromagnetic interference (EMI) shielding, and associated systems and methods, are described herein. In one embodiment, a semiconductor device includes a semiconductor die coupled to a package substrate. An antenna structure is disposed over and/or adjacent the semiconductor die. An electromagnetic interference (EMI) shield is disposed between the semiconductor die and the antenna structure to shield at least the semiconductor die from electromagnetic radiation generated by the antenna structure and/or to shield the antenna structure from interference generated by the semiconductor die. A first dielectric material and/or a thermal interface material can be positioned between the semiconductor die and the EMI shield, and a second dielectric material can be positioned between the EMI shield and the antenna structure. In some embodiments, the semiconductor device includes a package molding over at least a portion of the antenna, the EMI shield, and/or the second dielectric material.

公开(公告)号：US20240339390A1

公开(公告)日：2024-10-10

申请号：US18666369

申请日：2024-05-16

Applicant: Lodestar Licensing Group LLC

Inventor： Owen R. Fay ,  Jack E. Murray

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/13 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065 ,  H01L25/10 ,  H01L25/18

CPC classification number: H01L23/49827 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/13 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/1413 ,  H01L2224/14179 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45099 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181

Abstract: Package-on-package systems for packaging semiconductor devices. In one embodiment, a package-on-package system comprises a first semiconductor package device and a second semiconductor package device. The first package device includes a base substrate including a first side having a die-attach region and a peripheral region, a first semiconductor die attached to the base substrate at the die-attach region, wherein the first semiconductor die has a front side facing the first side of the base substrate and a backside spaced apart from the first side of the base substrate by a first distance, and a high density interconnect array in the perimeter region of the base substrate outside of the die-attach region. The interconnect array has a plurality of interconnects that extend from the first side of the base substrate by a second distance greater than the first distance. The second semiconductor device package is electrically coupled corresponding individual interconnects.

公开(公告)号：US20250038127A1

公开(公告)日：2025-01-30

申请号：US18918757

申请日：2024-10-17

Applicant: Lodestar Licensing Group, LLC

Inventor： Owen R. Fay ,  Dong Soon Lim ,  Randon K. Richards

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/31 ,  H01L23/66 ,  H01Q1/22

Abstract: Semiconductor devices with antennas and electromagnetic interference (EMI) shielding, and associated systems and methods, are described herein. In one embodiment, a semiconductor device includes a semiconductor die coupled to a package substrate. An antenna structure is disposed over and/or adjacent the semiconductor die. An electromagnetic interference (EMI) shield is disposed between the semiconductor die and the antenna structure to shield at least the semiconductor die from electromagnetic radiation generated by the antenna structure and/or to shield the antenna structure from interference generated by the semiconductor die. A first dielectric material and/or a thermal interface material can be positioned between the semiconductor die and the EMI shield, and a second dielectric material can be positioned between the EMI shield and the antenna structure. In some embodiments, the semiconductor device includes a package molding over at least a portion of the antenna, the EMI shield, and/or the second dielectric material.

公开(公告)号：US12033929B2

公开(公告)日：2024-07-09

申请号：US17493352

申请日：2021-10-04

Applicant: Lodestar Licensing Group LLC

Inventor： Owen R. Fay ,  Jack E. Murray

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L23/13 ,  H01L25/00 ,  H01L25/065 ,  H01L25/10 ,  H01L25/18 ,  H01L23/31

CPC classification number: H01L23/49827 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/13 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/1413 ,  H01L2224/14179 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/45099 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2924/00014 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/48145 ,  H01L2924/00012

Abstract: Package-on-package systems for packaging semiconductor devices. In one embodiment, a package-on-package system comprises a first semiconductor package device and a second semiconductor package device. The first package device includes a base substrate including a first side having a die-attach region and a peripheral region, a first semiconductor die attached to the base substrate at the die-attach region, wherein the first semiconductor die has a front side facing the first side of the base substrate and a backside spaced apart from the first side of the base substrate by a first distance, and a high density interconnect array in the perimeter region of the base substrate outside of the die-attach region. The interconnect array has a plurality of interconnects that extend from the first side of the base substrate by a second distance greater than the first distance. The second semiconductor device package is electrically coupled corresponding individual interconnects.

公开(公告)号：US20240186295A1

公开(公告)日：2024-06-06

申请号：US18439693

申请日：2024-02-12

Applicant: Lodestar Licensing Group LLC

Inventor： Randon K. Richards ,  Aparna U. Limaye ,  Owen R. Fay ,  Dong Soon Lim

IPC: H01L25/065 ,  H01L21/66 ,  H01L21/78 ,  H01L23/00 ,  H01L23/552 ,  H01L23/64 ,  H01L23/66 ,  H01L25/00 ,  H01L25/18 ,  H01Q1/22 ,  H01Q1/48

CPC classification number: H01L25/0657 ,  H01L21/78 ,  H01L22/12 ,  H01L23/552 ,  H01L23/645 ,  H01L23/66 ,  H01L24/08 ,  H01L24/80 ,  H01L25/0652 ,  H01L25/18 ,  H01L25/50 ,  H01Q1/2283 ,  H01Q1/48 ,  H01L2223/6677 ,  H01L2224/08145 ,  H01L2224/80895 ,  H01L2224/80896 ,  H01L2225/06531 ,  H01L2225/06537 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1443 ,  H01L2924/14511 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025

Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate and the components are connected with conductive material in preformed holes in dielectric material in the bond lines aligned with TSVs of the devices and the exposed conductors of the substrate. Methods of fabrication are also disclosed.