摘要:
A waterborne coating composition comprising at least one base neutralized active hydrogen containing film-forming resin and a water dispersible carbodiimide crosslinker capable of reacting with the film-forming resin to form a crosslinked film.
摘要:
A process for forming a color-clear multilayer coating on a substrate is disclosed. The basecoat is a waterborne coating and the clear topcoat is isocyanate containing and comprises a polyene and a polythiol. The isocyanate can be present as a separate component or can be an isocyanate-functional polyene.
摘要:
A two-component coating composition is disclosed wherein the binder components comprise: (a) an amino component comprising an aqueous solution and/or dispersion of at least one polyacrylate containing amino groups in a quantity sufficient to make said polyacrylate soluble and/or dispersible in water upon neutralization with acid; and (b) a polyisocyanate component containing free isocyanate groups. Also disclosed is the method of emulsifying component (b) into component (a).
摘要:
A process for forming a color-clear multilayer coating on a substrate is disclosed. The clear topcoat comprises a polyene and a polythiol that is radiation curable.
摘要:
The present invention is directed to a coating composition comprising a polymer that comprises an oligomeric macromonomer and a core from which the oligomeric macromonomer extends, wherein the oligomeric macromonomer comprises reactive functional groups and has an average functionality ranging from 1.0 to 30, and wherein the core is
摘要:
A composition comprising an unsaturated polyester polyol oligomer and an isocyanate are disclosed; the composition can further comprise a radiation-curable compound, such as a (meth)acrylic copolymer, and/or a polythiol. Methods for using the composition and substrates treated therewith are also disclosed.
摘要:
An integrated circuit package of this invention includes a series of nonconductive rigid substrates, each substrate having a pattern of generally coplanar bond fingers embedded thereupon. An integrated circuit die is connected to individual bond fingers of varying bond finger patterns. Individual bond fingers are connected to package terminals by medial leads, which are generally perpendicular to the bond finger patterns. Semiconductor die packages having both top and bottom package terminals are thus produced. Methods and devices are shown.
摘要:
Disclosed is a method for coating a substrate comprising the steps of (a) forming a basecoat by coating the substrate with a pigmented basecoating composition; and (b) thereafter forming a topcoat by coating the basecoat with a clear topcoating composition; wherein at least one of the basecoating composition and topcoating composition contains an addition interpolymer having alkoxysilane and/or acyloxysilane moieties.
摘要:
Disclosed herein are immunogenic compositions comprising one or more inactivated dengue viruses and one or more inactivated non-dengue flaviviruses and methods of making and using thereof.
摘要:
Composition and process for low temperature curing of polyuretdione-polyol compositions in which the polyuretdione is prepared from a polyisocyanate with isocyanate groups and a polyol containing primary hydroxyl groups. The catalyst for the composition and process is an amine catalyst containing the group —N═C—N—, being aprotic, having a pKa greater than 20 and upon addition to the liquid coating composition causing a phase-change of the coating composition from liquid to solid at 25° C. and 1 atm. within one week.