公开(公告)号：US06559215B2

公开(公告)日：2003-05-06

申请号：US09908038

申请日：2001-07-18

申请人： Lynne K. Mills ,  JoLee M. Dominowski ,  Gene D. Rose ,  Deidre A. Strand ,  Kenneth L. Foster ,  Stephen F. Hahn

发明人： Lynne K. Mills ,  JoLee M. Dominowski ,  Gene D. Rose ,  Deidre A. Strand ,  Kenneth L. Foster ,  Stephen F. Hahn

IPC分类号： C08K507

CPC分类号： C08G61/02 ,  C08G2261/312

摘要： This invention is a composition comprising (a) an oligomer or polymer dispersible in an organic solvent, having a low dielectric constant, or being curable to form a material having a low dielectric constant, (b) at least one organic solvent and (c) less than 1000 parts by weight of a polymeric coating additive per million parts by weight of total composition (ppm). The polymeric additive is characterized in that it is miscible with component (a) and the solvent system but becomes incompatible with the mixture of component (a) and solvent during the coating process.

公开(公告)号：US06815333B2

公开(公告)日：2004-11-09

申请号：US10402073

申请日：2003-03-28

申请人： Paul H. Townsend, III ,  Lynne K. Mills ,  Joost J. M. Waeterloos ,  Richard J. Strittmatter

发明人： Paul H. Townsend, III ,  Lynne K. Mills ,  Joost J. M. Waeterloos ,  Richard J. Strittmatter

IPC分类号： H01L214763

CPC分类号： H01L21/02118 ,  H01L21/02126 ,  H01L21/022 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/02304 ,  H01L21/02307 ,  H01L21/0271 ,  H01L21/0274 ,  H01L21/0332 ,  H01L21/31144 ,  H01L21/312 ,  H01L21/3122 ,  H01L21/31695 ,  H01L21/76808 ,  H01L21/76811 ,  H01L21/76813 ,  H01L21/7682 ,  H01L21/76835

摘要： This invention relates to a method of dual damascene integration for manufacture of integrating circuits using three top hard mask layers having alternating etch selectivity characteristics.

摘要翻译： 本发明涉及一种双镶嵌一体化方法，用于使用具有交替蚀刻选择性特性的三个顶部硬掩模层来制造积分电路。

公开(公告)号：US5320990A

公开(公告)日：1994-06-14

申请号：US39657

申请日：1993-03-30

申请人： Theresa A. Guiton ,  Lynne K. Mills

发明人： Theresa A. Guiton ,  Lynne K. Mills

IPC分类号： C04B35/581 ,  C04B35/58

CPC分类号： C04B35/581

摘要： Prepare sintered aluminum nitride bodies having a thermal conductivity of at least 200 W/m-K by sintering under non-reducing conditions and controlling interrelated parameters such as binder burnout atmosphere, heating rate, sintering temperature, time at sintering temperature, cooling rate and cooling temperature. Sintered bodies having thermal conductivities in excess of 200, especially in excess of 270, W/m-K result from this process.

摘要翻译： 通过在非还原条件下烧结来制备热导率至少为200W / m-K的烧结氮化铝体，并控制相关参数，例如粘合剂烧尽气氛，加热速率，烧结温度，烧结温度下的时间，冷却速度和冷却温度。 该过程产生热导率超过200，特别是超过270的W / m-K的烧结体。

公开(公告)号：US08865845B2

公开(公告)日：2014-10-21

申请号：US12091811

申请日：2006-10-25

申请人： Paul J. Popa ,  Lynne K. Mills ,  Kevin E. Howard

发明人： Paul J. Popa ,  Lynne K. Mills ,  Kevin E. Howard

IPC分类号： C08F283/12 ,  G03F7/09 ,  C08G77/58 ,  G03F7/075

CPC分类号： G03F7/091 ,  C08G77/58 ,  G03F7/0757

摘要： The invention relates to silsesquioxane-titania hybrid polymers, wherein the titania domain size is less than about five nanometers. Such polymers are useful, for example, to form anti-reflection coatings in the fabrication of microelectronic devices.

摘要翻译： 本发明涉及倍半硅氧烷 - 二氧化钛杂化聚合物，其中二氧化钛域的尺寸小于约5纳米。 这样的聚合物可用于例如在微电子器件的制造中形成抗反射涂层。

公开(公告)号：US06168859A

公开(公告)日：2001-01-02

申请号：US09086926

申请日：1998-05-29

申请人： Lynne K. Mills ,  Eric J. Swedberg ,  Arne K. Knudsen

发明人： Lynne K. Mills ,  Eric J. Swedberg ,  Arne K. Knudsen

IPC分类号： B32B516

CPC分类号： C04B41/009 ,  C04B41/4584 ,  C04B41/81 ,  C04B2111/00844 ,  C08K9/06 ,  H01L23/295 ,  H01L2924/0002 ,  Y10T428/12528 ,  Y10T428/257 ,  Y10T428/259 ,  Y10T428/2991 ,  Y10T428/2993 ,  C04B41/4535 ,  C04B41/4554 ,  C04B41/4572 ,  C04B41/5035 ,  C04B35/10 ,  H01L2924/00

摘要： A filler powder comprised of an alumina powder coated with a silicon containing coating, wherein the silicon containing coating at most partially covers the surface of said coated alumina powder and the filler powder, when mixed with a thermosetting epoxy resin, has an average spiral flow length that is at least about 1.1 times greater than a comparable filler powder containing uncoated alumina powder mixed with the thermosetting resin. A preferred process for making the filler powder comprises: heating, simultaneously, an alumina powder with a second powder coated with an organo-silicate to a temperature for a time sufficient to volatilize, deposit and pyrolyze at least a portion of the organo-silicate on the alumina powder to form a silicon containing inorganic coating thereon.

摘要翻译： 一种由涂覆有含硅涂层的氧化铝粉末组成的填料粉末，其中含硅涂层至少部分覆盖所述涂覆的氧化铝粉末和填料粉末的表面，当与热固性环氧树脂混合时，其平均螺旋流动长度 比含有与热固性树脂混合的未涂覆的氧化铝粉末相当的填料粉末的至少约1.1倍。 制备填料粉末的优选方法包括：同时加热涂有有机硅酸盐的第二粉末的氧化铝粉末至足以使至少部分有机硅酸盐挥发，沉积和热解的温度 氧化铝粉末在其上形成含硅无机涂层。

公开(公告)号：US07268200B2

公开(公告)日：2007-09-11

申请号：US11262237

申请日：2005-10-28

申请人： Paul H. Townsend, III ,  Lynne K. Mills ,  Sheila Gombar-Fetner

发明人： Paul H. Townsend, III ,  Lynne K. Mills ,  Sheila Gombar-Fetner

IPC分类号： C08G77/08

CPC分类号： H01L21/02118 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/0332 ,  H01L21/31144 ,  H01L21/3121 ,  H01L21/76801 ,  H01L21/7681 ,  H01L21/76811 ,  H01L21/76813 ,  H01L21/76829 ,  H01L21/76835 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： This invention is directed to a method of making a composition in which a silane having an unsaturated group and a silane having an aromatic group are hydrolyzed. In this method the more highly reactive silane is continuously added during the hydrolysis reaction of the less reactive silane. The composition can be used in the fabrication of microelectronic devices, particularly as hardmasks or etchstops.

摘要翻译： 本发明涉及一种制备其中具有不饱和基团的硅烷和具有芳族基团的硅烷水解的组合物的方法。 在该方法中，反应性较低的硅烷在水解反应过程中连续添加更高反应性的硅烷。 该组合物可以用于制造微电子器件，特别是硬掩模或蚀刻棒。

公开(公告)号：US07115531B2

公开(公告)日：2006-10-03

申请号：US09933535

申请日：2001-08-20

申请人： Edward O. Shaffer, II ,  Kevin E. Howard ,  Joost J. M. Waeterloos ,  Jack E. Hetzner ,  Paul H. Townsend, III ,  Lynne K. Mills ,  Sheila Gombar-Fetner ,  Larry R. Wilson

发明人： Edward O. Shaffer, II ,  Kevin E. Howard ,  Joost J. M. Waeterloos ,  Jack E. Hetzner ,  Paul H. Townsend, III ,  Lynne K. Mills ,  Sheila Gombar-Fetner ,  Larry R. Wilson

IPC分类号： H01L21/469 ,  H01L21/31

CPC分类号： H01L21/02118 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/0332 ,  H01L21/31144 ,  H01L21/3121 ,  H01L21/76801 ,  H01L21/7681 ,  H01L21/76811 ,  H01L21/76813 ,  H01L21/76829 ,  H01L21/76835 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： This invention is a method comprising providing a substrate, forming a first layer on the substrate, wherein the first layer has a dielectric constant of less than 3.0 and comprises an organic polymer, applying an organosilicate resin over the first layer, removing a portion of the organosilicate resin to expose a portion of the first layer, and removing the exposed portions of the first layer. The invention is also an integrated circuit article comprising an active substrate containing transistors and an electrical interconnect structure containing a pattern of metal lines separated, at least partially, by layers or regions of an organic polymeric material having a dielectric constant of less than 3.0 and further comprising a layer of an organosilicate resin above at least one layer of the organic polymer material.

公开(公告)号：US20100221666A1

公开(公告)日：2010-09-02

申请号：US12091811

申请日：2006-10-25

申请人： Paul J. Popa ,  Lynne K. Mills ,  Kevin E. Howard

发明人： Paul J. Popa ,  Lynne K. Mills ,  Kevin E. Howard

IPC分类号： G03F7/20 ,  C08G77/06

CPC分类号： G03F7/091 ,  C08G77/58 ,  G03F7/0757

摘要： The invention relates to silsesquioxane-titania hybrid polymers, wherein the titania domain size is less than about five nanometers. Such polymers are useful, for example, to form anti-reflection coatings in the fabrication of microelectronic devices.

摘要翻译： 本发明涉及倍半硅氧烷 - 二氧化钛杂化聚合物，其中二氧化钛域的尺寸小于约5纳米。 这样的聚合物可用于例如在微电子器件的制造中形成抗反射涂层。