Resistive random access memory device and method for manufacturing the same

    公开(公告)号:US10115769B1

    公开(公告)日:2018-10-30

    申请号:US15620880

    申请日:2017-06-13

    Abstract: A ReRAM device is provided. The ReRAM device comprises a first dielectric layer disposed on a substrate and covering a gate oxide structure on the substrate, a first conductive connecting structure disposed on the substrate and penetrating the first dielectric layer, and a ReRAM unit disposed on the first conductive connecting structure. The first dielectric layer comprises a first insulating layer disposed on the substrate, and a stop layer disposed on the first insulating layer and contacting a top surface of the gate oxide structure, wherein the stop layer is a hydrogen controlled layer.

    Method for operating non-volatile memory device and applications thereof

    公开(公告)号:US09947403B1

    公开(公告)日:2018-04-17

    申请号:US15469672

    申请日:2017-03-27

    Abstract: A method for operating a resistance switching memory device is provided, wherein the method includes a first program process, and the first program process includes steps as follows: A programming pulse having a first polarity is firstly applied to at least one resistance switching memory cell of the NVM device. A first verifying pulse with a verifying voltage is then applied to the resistance switching memory cell. A first settling pulse is applied to the resistance switching memory cell prior to or after the verifying pulse is applied, wherein the first settling pulse includes a settling voltage having a second polarity opposite to the first polarity and an absolute value substantially less than that of the verifying voltage.

    Semiconductor memory device and operation method thereof

    公开(公告)号:US09947398B1

    公开(公告)日:2018-04-17

    申请号:US15482978

    申请日:2017-04-10

    CPC classification number: G11C13/0038 G11C13/004 G11C2013/0054

    Abstract: A semiconductor memory device includes: a memory array including a plurality of memory cells, the memory cells being in any of a high resistance state (HRS) and a low resistance state (LRS); a reference array including a plurality of reference cells, the memory cells and the reference cells having the same impedance-temperature relationship, the reference cells being in a middle resistance state between HRS and LRS; an average circuit configured for averaging respective reference currents from the reference cells of the reference array into an average reference current; and a comparator configured for comparing a plurality of respective memory currents from the memory cells of the memory array with the average reference current to obtain a plurality of output data of the memory cells of the memory array and to determine respective impedance states of the memory cells of the memory array.

    Multi-state memory device and method for adjusting memory state characteristics of the same

    公开(公告)号:US10482953B1

    公开(公告)日:2019-11-19

    申请号:US16103022

    申请日:2018-08-14

    Abstract: A multi-state memory device includes a first memory element, a second memory element, a first controlling element and a second controlling element. The second memory element has a memory cell structure identical to that of the first memory element and connects to the first memory element in series. The first controlling element is connected to the first memory element either in series or in parallel. The second controlling element has a characteristic value identical to that of the first controlling element and is connected to the second memory element by a connection structure identical to that of the first controlling element. When the first memory element receives a first signal and a second signal through the first controlling element, a first state value and a second state value are generated correspondingly, and the characteristic value is greater than the first state value and less than the second state value.

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